Handheld electronic device

Patent metadata

Field	Value
Publication number	US-11838432-B2
Application number	US-202017068619-A
Country	US
Kind code	B2
Filing date	Oct 12, 2020
Priority date	Dec 3, 2019
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

First claim

What is claimed is:

1. A portable electronic device comprising:
a housing defining an internal volume of the portable electronic device;
a battery within the internal volume; and
a circuit board assembly within the internal volume and defining a first portion extending along a first side of the battery and a second portion extending along a second side of the battery, the circuit board assembly comprising:
a first circuit board defining:
a top surface; and
a bottom surface opposite the top surface;

a wall structure soldered to the first circuit board;
a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure, the second circuit board defining an exterior top surface of the circuit board assembly;
an adhesive between the wall structure and the first circuit board and between the wall structure and the second circuit board, the adhesive bonding the first circuit board and the second circuit board to the wall structure;
an electronic component coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure;
a memory module coupled to the exterior top surface of the circuit board assembly;
a first millimeter-wave antenna array coupled to the bottom surface of the first circuit board;
a flexible circuit element; and
a second millimeter-wave antenna array conductively coupled to the flexible circuit element, flexible circuit element soldered to the bottom surface of the first circuit board.

2. The portable electronic device of claim 1 , wherein:
the wall structure comprises a via;
the first circuit board is soldered to the via; and
the second circuit board is soldered to the via, thereby conductively coupling the first circuit board to the second circuit board.

3. The portable electronic device of claim 1 , wherein the electronic component is a processor.

4. The portable electronic device of claim 1 , wherein the flexible circuit element extends along the second side of the battery and a third side of the battery.

5. The portable electronic device of claim 1 , wherein:
the flexible circuit element is a first flexible circuit element; and
the portable electronic device further comprises a third millimeter-wave antenna array conductively coupled to a second flexible circuit element; and
the second flexible circuit element is conductively coupled to the top surface of the first circuit board.

6. The portable electronic device of claim 1 , wherein the circuit board assembly further comprises a barrier formed of solder and attached to the first circuit board, the barrier extending at least partially around an outer periphery of the processor and configured to inhibit a flow of a curable adhesive deposited between the processor and the first circuit board.

7. A portable electronic device comprising:
a housing defining an internal volume of the portable electronic device;
a display at least partially within the housing; and
a circuit board assembly within the housing and comprising:
a first circuit board;
a wall structure coupled to the first circuit board;
a second circuit board coupled to the wall structure and supported above the first circuit board by the wall structure;
a circuit element coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure;
a barrier formed of solder and attached to the first circuit board, the barrier extending at least partially around an outer periphery of the circuit element and having a height between about 0.05 and about 0.07 mm; and
a cured adhesive positioned between the circuit element and the first circuit board and in contact with a surface of the barrier.

8. The portable electronic device of claim 7 , wherein the barrier extends along at least three sides of the outer periphery of the circuit element.

9. The portable electronic device of claim 7 , wherein the wall structure contacts a side of the barrier.

10. The portable electronic device of claim 7 , wherein an inner surface of the wall structure is set apart from a side of the circuit element by a distance between about 0.2 mm and 0.4 mm.

11. The portable electronic device of claim 7 , wherein the barrier is configured to limit a spread of a liquid adhesive along the first circuit board.

12. The portable electronic device of claim 11 , wherein the cured adhesive is formed by:
flowing a curable liquid adhesive between the circuit element and the first circuit board; and
allowing the curable liquid adhesive to harden.

13. A portable electronic device comprising:
a housing defining an internal volume of the portable electronic device;
a display at least partially within the housing;
a circuit board assembly within the housing and comprising:
a first circuit board;
a second circuit board;
a wall structure supporting the second circuit board above the first circuit board and comprising conductive vias within a matrix material, the conductive vias soldered to the first circuit board via a first solder material having a first melting temperature and soldered to the second circuit board via a second solder material having a second melting temperature that is lower than the first melting temperature;
a first circuit element coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board;
a second circuit element coupled to the second circuit board along an exterior surface of the second circuit board; and
an attachment tab soldered to the first circuit board and defining a hole; and

a fastener extending through the hole and engaged with the housing to secure the circuit board assembly to the housing.

14. The portable electronic device of claim 13 , wherein the conductive vias conductively couple the first circuit element to the second circuit element.

15. The portable electronic device of claim 13 , wherein:
the hole is a first hole; and
the attachment tab is soldered to the first circuit board along a mounting portion of the attachment tab;
the attachment tab further defines a second hole within the mounting portion; and
the circuit board assembly further comprises a fastener assembly extending through the second hole and configured to clamp the mounting portion of the attachment tab, the first circuit board, the second circuit board, and the wall structure together.

16. The portable electronic device of claim 13 , wherein the first melting temperature is between 20 degrees Celsius and about 30 degrees Celsius lower than the second melting temperature.

17. The portable electronic device of claim 16 , wherein the first solder material and the second solder material exhibit a ductile failure mode at strain rates of about 100 s −1 .

Assignees

• Apple Inc

Inventors

• Keen Bryan D
• Monaco Devon A
• Lee Sherry
• Chowdhury Ihtesham H
• Nyland Eric N
• Hill Matthew D
• Varma Arun R
• Browning Lucy E
• Cohen Sawyer I
• Pope Benjamin J
• Choudhury Abhishek
• Bilanski James W
• Wang Yaodong
• Morizio Daniel J
• Ruhter Nicholas W
• Karol David A
• Gordoni Sean M

Classifications

• H04M1/0206 Primary

  Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings · CPC title

• G06F1/1637

  Details related to the display arrangement, including those related to the mounting of the display in the housing · CPC title

• G06F1/1686 Primary

  the I/O peripheral being an integrated camera · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• H04M1/0264

  for a camera module assembly · CPC title