Method for testing light-emitting elements, testing device, and substrate

Patent metadata

Field	Value
Publication number	US-11837124-B2
Application number	US-202117208022-A
Country	US
Kind code	B2
Filing date	Mar 22, 2021
Priority date	Nov 6, 2020
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

A method for testing light-emitting elements includes: providing a substrate having light-emitting elements and conductive wires; providing at least one coil structure including a first coil and two conductive plugs connected to the first coil; providing a metal rod and a second coil winding the metal rod and connected to an AC power supply. Each light-emitting element includes a positive electrode and a negative electrode connected to one conductive wire, respectively. The substrate defines pairs of through holes, each pair of through holes is aligning with two conductive wires connected to the positive electrode and the negative electrode of one light-emitting element. The testing method further includes inserting the two conductive plugs into one pair of through holes, starting the AC power supply and moving the metal rod towards the coil structure to form an induced current in the first coil configured for driving the one light-emitting element.

First claim

What is claimed is:

1. A method for testing light-emitting elements, comprising:
providing a substrate having a plurality of light-emitting elements to be tested and a plurality of conductive wires; each of the plurality of light-emitting elements comprising a positive electrode and a negative electrode, the positive electrode and the negative electrode connecting to one of the plurality of conductive wires, respectively; the substrate defining a plurality of pairs of through holes, each of the plurality of pairs of through holes aligning with two of the plurality of conductive wires connecting to the positive electrode and the negative electrode of one of the plurality of light-emitting elements;
providing at least one coil structure, each coil structure comprising a first coil and two conductive plugs, each of the two conductive plugs connecting to one of opposite ends of the first coil;
providing a metal rod and a second coil winding the metal rod, the second coil electrically connecting to an alternating current (AC) power supply;
inserting the two conductive plugs into one of the plurality of pairs of through holes to electrically couple the first coil and one light-emitting element, starting the AC power supply and moving the metal rod towards the coil structure to form an induced current in the first coil configured for driving the one light-emitting element to emit light.

2. The method for testing light-emitting elements of claim 1 , wherein providing the substrate comprises providing the substrate having the plurality of light-emitting elements on a same surface of the substrate; the coil structure is placed on a side of the substrate away from the plurality of light-emitting elements and the metal rod is placed on a side of the coil structure away from the substrate and aligned with the first coil when testing.

3. The method for testing light-emitting elements of claim 2 , wherein providing the at least one coil structure comprises providing a plugboard, the at least one coil structure is on a surface of the plugboard.

4. The method for testing light-emitting elements of claim 3 , wherein there are a plurality of coil structures on the plugboard.

5. The method for testing light-emitting elements of claim 4 , wherein the plurality of coil structures and the light-emitting elements on the substrate are in a one-to-one correspondence; the plurality of coil structures and the plurality of light-emitting elements on the substrate are electrically connected in a one-to-one correspondence when test.

6. The method for testing light-emitting elements of claim 4 , wherein providing the substrate comprises providing the substrate having a plurality of sub-units arranged in a matrix; at least two of the plurality of light-emitting elements are in each of the plurality of sub-units; the plurality of coil structures and the light-emitting elements on one of the plurality of sub-units are in a one-to-one correspondence; the plurality of coil structures and the light-emitting elements on one of the plurality of sub-units are electrically connected in a one-to-one correspondence when test.

7. The method for testing light-emitting elements of claim 6 , wherein the light emitting elements in each of the plurality of sub-units are connected in series or in parallel.

8. A testing device for light-emitting elements, comprising:
at least one coil structure, each coil structure comprising a first coil and two conductive plugs, each of the two conductive plugs connected to one of opposite ends of the first coil;
a metal rod; and
a second coil winding the metal rod, the second coil electrically connected to an alternating current (AC) power supply.

9. The testing device for light-emitting elements of claim 8 , further comprising a plugboard, wherein the at least one coil structure is on a surface of the plugboard.

10. The testing device for light-emitting elements of claim 9 , wherein there are a plurality of coil structures on the plugboard.

11. The testing device for light-emitting elements of claim 8 , wherein the testing device is configured to test light-emitting elements arranged on a substrate.

Assignees

• Interface Tech Chengdu Co Ltd
• Interface Optoelectronics Shenzhen Co Ltd
• General Interface Solution Ltd

Inventors

• Wu Hung-Chih

Classifications

• H10W90/00

  Package configurations · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/273

  Interconnections for measuring or testing, e.g. probe pads · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/825

  containing nitrogen, e.g. GaN · CPC title