Resin molding apparatus and method of manufacturing resin molded product

US11833722B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11833722-B2
Application numberUS-202117407746-A
CountryUS
Kind codeB2
Filing dateAug 20, 2021
Priority dateAug 25, 2020
Publication dateDec 5, 2023
Grant dateDec 5, 2023

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin molding apparatus includes: a first molding mold provided with a first member and a second member configured to move relative to the first member, and configured to form a cavity by the first member and the second member; a second molding mold configured to hold a substrate; and a mask member so as to be relatively immovable with respect to the first member, configured to make contact with a portion of the substrate when the first molding mold and the second molding mold are clamped, and formed with a flow portion through which a resin material existing in the cavity and pressurized by the second member is capable of flowing.

First claim

Opening claim text (preview).

What is claimed is: 1. A resin molding apparatus, comprising: a lower mold provided with a side surface member and a bottom surface member, which is configured to be capable of moving up and down with respect to the side surface member, and configured to form a cavity by the side surface member and the bottom surface member, wherein the side surface member surrounds the bottom surface member; an upper mold configured to hold a substrate; and a metallic mask configured to make partial contact with the side surface member, configured to be formed substantially in a form of the cavity, configured to make contact with a portion of the substrate when the lower mold and the upper mold are clamped, and formed with a flow portion through which a resin material existing in the cavity and pressurized by the bottom surface member is capable of flowing. 2. The resin molding apparatus of claim 1 , wherein the flow portion is formed on an outer peripheral portion of the metallic mask. 3. The resin molding apparatus of claim 1 , wherein the side surface member is formed in a frame shape so as to surround the cavity from a lateral side, and wherein an outer peripheral portion of the metallic mask is disposed to be placed on the side surface member. 4. The resin molding apparatus of claim 3 , wherein a first tapered portion is formed on the outer peripheral portion of the metallic mask, and wherein the metallic mask is disposed so that the first tapered portion comes into contact with the side surface member. 5. The resin molding apparatus of claim 4 , wherein a second tapered portion having a shape corresponding to the first tapered portion is formed on the side surface member, and wherein the metallic mask is disposed so that the first tapered portion comes into contact with the second tapered portion. 6. The resin molding apparatus of claim 1 , wherein the flow portion is formed at least at two locations facing each other with a center of the metallic mask interposed therebetween. 7. The resin molding apparatus of claim 1 , wherein the flow portion is formed so as to narrow a flow route of the resin material toward a flow direction of the resin material. 8. A method of manufacturing a resin molded product by using the resin molding apparatus of claim 1 . 9. A method of manufacturing a resin molded product, comprising: disposing a metallic mask configured to make partial contact with a side surface member of a lower mold forming a cavity, in which a resin material is accommodated, with a bottom surface member of the lower mold configured to be capable of moving up and down with respect to the side surface member, wherein the metallic mask configured to be formed substantially in a form of the cavity and wherein the side surface member surrounds the bottom surface member; clamping the lower mold and an upper mold holding a substrate, and bringing the disposed metallic mask into contact with a portion of the substrate; and performing a resin molding on the substrate by pressurizing the resin material in the cavity to allow the resin material to flow through a flow portion formed in the metallic mask. 10. The method of claim 9 , wherein the flow portion is formed on an outer peripheral portion of the metallic mask.

Assignees

Inventors

Classifications

  • using moulds · CPC title

  • Manufacture or treatment · CPC title

  • specially adapted for containing masks, reticles or pellicles · CPC title

  • B29C43/18Primary

    incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles {(B29C43/206 takes precedence)} · CPC title

  • Moulds for making articles of definite length, i.e. discrete articles · CPC title

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Frequently asked questions

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What does patent US11833722B2 cover?
A resin molding apparatus includes: a first molding mold provided with a first member and a second member configured to move relative to the first member, and configured to form a cavity by the first member and the second member; a second molding mold configured to hold a substrate; and a mask member so as to be relatively immovable with respect to the first member, configured to make contact w…
Who is the assignee on this patent?
Towa Corp
What technology area does this patent fall under?
Primary CPC classification B29C43/18. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 05 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).