Dual-sided co-packaged optics for high bandwidth networking applications

Patent metadata

Field	Value
Publication number	US-11830863-B2
Application number	US-202117539088-A
Country	US
Kind code	B2
Filing date	Nov 30, 2021
Priority date	Mar 4, 2020
Publication date	Nov 28, 2023
Grant date	Nov 28, 2023

Abstract

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

First claim

What is claimed is:

1. An electronic package, comprising:
a first package substrate, the first package substrate having a first surface opposite a second surface, and having a first lateral side, a second lateral side, a third lateral side, and a fourth lateral side between the first surface and the second surface;
a second package substrate coupled to the first surface of the first package substrate, the second package substrate within a footprint of the first package substrate;
a die coupled to the second package substrate, the die within a footprint of the second package substrate;
a first photonic engine on the first surface of the first package substrate and extending over the first lateral side of the first package substrate;
a second photonic engine on the first surface of the first package substrate and extending over the second lateral side of the first package substrate;
a third photonic engine on the first surface of the first package substrate and extending over the third lateral side of the first package substrate;
a fourth photonic engine on the first surface of the first package substrate and extending over the fourth lateral side of the first package substrate; and
an additional photonic engine on the second surface of the first package substrate.

2. The electronic package of claim 1 , further comprising:
a fifth photonic engine on the first surface of the first package substrate and extending over the first lateral side of the first package substrate; and
a sixth photonic engine on the first surface of the first package substrate and extending over the third lateral side of the first package substrate.

3. The electronic package of claim 2 , further comprising:
a seventh photonic engine on the first surface of the first package substrate and extending over the second lateral side of the first package substrate; and
an eighth photonic engine on the first surface of the first package substrate and extending over the fourth lateral side of the first package substrate.

4. The electronic package of claim 3 , further comprising:
a ninth photonic engine and a tenth photonic engine on the second surface of the first package substrate and extending over the first lateral side of the first package substrate;
an eleventh photonic engine and a twelfth photonic engine on the second surface of the first package substrate and extending over the second lateral side of the first package substrate;
a thirteenth photonic engine and a fourteenth photonic engine on the second surface of the first package substrate and extending over the third lateral side of the first package substrate; and
a fifteenth photonic engine and the additional photonic engine on the second surface of the first package substrate and extending over the fourth lateral side of the first package substrate.

5. The electronic package of claim 1 , wherein each of the photonic engines comprises one or more optical inputs/outputs.

6. The electronic package of claim 1 , wherein each of the photonic engines is coupled to the first substrate by a corresponding socket.

7. The electronic package of claim 1 , wherein each of the photonic engines is coupled to a corresponding integrated heat spreader.

8. The electronic package of claim 1 , wherein the die is a switch die.

9. A system, comprising:
a board; and
an electronic package coupled to the board, the electronic package comprising:
a first package substrate, the first package substrate having a first surface opposite a second surface, and having a first lateral side, a second lateral side, a third lateral side, and a fourth lateral side between the first surface and the second surface;
a second package substrate coupled to the first surface of the first package substrate, the second package substrate within a footprint of the first package substrate;
a die coupled to the second package substrate, the die within a footprint of the second package substrate;
a first photonic engine on the first surface of the first package substrate and extending over the first lateral side of the first package substrate;
a second photonic engine on the first surface of the first package substrate and extending over the second lateral side of the first package substrate;
a third photonic engine on the first surface of the first package substrate and extending over the third lateral side of the first package substrate;
a fourth photonic engine on the first surface of the first package substrate and extending over the fourth lateral side of the first package substrate; and
an additional photonic engine on the second surface of the first package substrate.

10. The system of claim 9 , further comprising:
an Ethernet channel coupled to the board.

11. The system of claim 9 , further comprising:
an power supply coupled to the board.

12. The system of claim 9 , further comprising:
a cooling fan coupled to the board.

13. The system of claim 9 , wherein the electronic package further comprises:
a fifth photonic engine on the first surface of the first package substrate and extending over the first lateral side of the first package substrate; and
a sixth photonic engine on the first surface of the first package substrate and extending over the third lateral side of the first package substrate.

14. The system of claim 13 , wherein the electronic package further comprises:
a seventh photonic engine on the first surface of the first package substrate and extending over the second lateral side of the first package substrate; and
an eighth photonic engine on the first surface of the first package substrate and extending over the fourth lateral side of the first package substrate.

15. The system of claim 14 , wherein the electronic package further comprises:
a ninth photonic engine and a tenth photonic engine on the second surface of the first package substrate and extending over the first lateral side of the first package substrate;
an eleventh photonic engine and a twelfth photonic engine on the second surface of the first package substrate and extending over the second lateral side of the first package substrate;
a thirteenth photonic engine and a fourteenth photonic engine on the second surface of the first package substrate and extending over the third lateral side of the first package substrate; and
a fifteenth photonic engine and the additional photonic engine on the second surface of the first package substrate and extending over the fourth lateral side of the first package substrate.

16. The system of claim 9 , wherein each of the photonic engines of the electronic package comprises one or more optical inputs/outputs.

17. The system of claim 9 , wherein each of the photonic engines of the electronic package is coupled to the first substrate by a corresponding socket.

18. The system of claim 9 , wherein each of the photonic engines of the electronic package is coupled to a corresponding integrated heat spreader.

19. The system of claim 9 , wherein the die of the electronic package is a switch die.

Assignees

• Intel Corp

Inventors

• Pothukuchi Suresh V
• Alduino Andrew
• Mahajan Ravindranath V
• Nekkanty Srikant
• Liao Ling
• Potluri Harinadh
• Bond David M
• Gujjula Sushrutha Reddy
• Tran Donald Tiendung
• Hui David
• Tamarkin Vladimir

Classifications

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65 Primary

  Shapes or dispositions of interconnections · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title