Cutting machine

Patent metadata

Field	Value
Publication number	US-11826879-B2
Application number	US-202117342736-A
Country	US
Kind code	B2
Filing date	Jun 9, 2021
Priority date	Jun 24, 2020
Publication date	Nov 28, 2023
Grant date	Nov 28, 2023

Abstract

There is provided a cutting machine for cutting a wafer using a cutting blade. The cutting machine includes a shape storage section, a shape measurement unit, a determination section, and an end face correction device. The shape storage section stores a cross-sectional shape of a support surface, which a mount of a cutting unit has, in an axial direction of a spindle. The shape measurement unit contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle. Through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, the determination section determines whether or not the support surface needs a correction. The end face correction device corrects a shape of the support surface.

First claim

What is claimed is:

1. A cutting machine for cutting a wafer using a cutting blade, comprising:
a holding table that holds the wafer on a holding surface thereof;
a cutting unit including a mount having an external thread formed on a distal end of a cylinder, the external thread being disposed on a distal end of a spindle and extending in an axial direction of the spindle, and a support surface that is formed in an annular shape concentric with the external thread and supports the cutting blade thereon, and a nut that is brought into threaded engagement with the external thread to hold the cutting blade between the nut and the support surface, whereby the wafer held on the holding surface is cut by the cutting blade;
a shape storage section that stores a cross-sectional shape of the support surface in the axial direction of the spindle;
a shape measurement unit that contactlessly measures the cross-sectional shape of the support surface in the axial direction of the spindle;
a determination section that through a comparison between the cross-sectional shape stored in the shape storage section and the cross-sectional shape measured by the shape measurement unit, determines whether or not the support surface needs a correction; and
an end face correction device that corrects a shape of the support surface,
wherein the end face correction device includes
a correction grinding stone arranged such that the correction grinding stone is able to be brought into contact with the support surface,
an end detection section that detects an end of the correction grinding stone, and
a movement control section configured to move the correction grinding stone and the support surface relative to each other in a direction parallel to the support surface with the end of the correction grinding stone maintained in contact with the support surface.

2. The cutting machine according to claim 1 ,
wherein the shape measurement unit includes
an emitter unit that emits a laser beam toward the support surface in the axial direction of the spindle, and
an image sensor that receives reflected light of the laser beam reflected on the support surface, and

the shape measurement unit measures a distance from the emitter unit to the support surface in the axial direction of the spindle based on a light reception position at which the image sensor has received the reflected light.

3. The cutting machine according to claim 1 ,
wherein the shape measurement unit includes
a transmitter unit that transmits ultrasonic vibrations toward the support surface in the axial direction of the spindle, and
a receiver unit that receives vibrations generated by reflection of the ultrasonic vibrations on the support surface, the ultrasonic vibrations being transmitted by the transmitter unit, and

the shape measurement unit measures a distance from the transmitter unit to the support surface in the axial direction of the spindle based on a time from the transmission of the ultrasonic vibrations by the transmitter unit until the reception by the receiver unit of the vibrations reflected on the support surface.

Assignees

• Disco Corp

Inventors

• Takeda Shun

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B49/12 Primary

  involving optical means · CPC title

• B24B7/16

  for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings (for combined grinding of surfaces of revolution and adjacent plane surfaces on work B24B5/01; for grinding edges of bevels on work B24B9/00) · CPC title

• B24B49/003

  involving acoustic means · CPC title

• B26D7/01

  Means for holding or positioning work · CPC title