Micro-electromechanical system device and method of forming the same

Patent metadata

Field	Value
Publication number	US-11825750-B2
Application number	US-202017083337-A
Country	US
Kind code	B2
Filing date	Oct 29, 2020
Priority date	Oct 29, 2020
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

A micro-electromechanical system (MEMS) device and a method of forming the same, the MEMS device includes a composite substrate, a cavity, a piezoelectric stacking structure and a proof mass. The composite substrate includes a first semiconductor layer, a bonding layer and a second semiconductor layer from bottom to top. The cavity is disposed in the composite substrate, and the cavity is extended from the second semiconductor layer into the first semiconductor layer and not penetrated the first semiconductor layer. The piezoelectric stacking structure is disposed on the composite substrate, with the piezoelectric stacking structure having a suspended region over the cavity. The proof mass is disposed in the cavity to connect to the piezoelectric stacking structure.

First claim

What is claimed is:

1. A micro-electromechanical system device comprising:
a composite substrate comprising a first semiconductor layer, a bonding layer and a second semiconductor layer from bottom to top;
a cavity disposed in the first semiconductor layer, the cavity being extended from the second semiconductor layer into the first semiconductor layer and not penetrated the first semiconductor layer;
a piezoelectric stacking structure disposed on the composite substrate, the piezoelectric stacking structure comprising a suspended region over the cavity; and
a proof mass disposed in the cavity and connected to the piezoelectric stacking structure, wherein a coverage area of the proof mass is 10% to 90% less than a coverage area of the suspended region,
wherein the suspended region comprises a free end and an anchor end, and the proof mass is disposed adjacent to and laterally spaced apart from the free end of the suspended region and disposed away from the anchor end of the suspended region.

2. The micro-electromechanical system device according to claim 1 , a material of the proof mass is the same as a material of the second semiconductor layer.

3. The micro-electromechanical system device according to claim 2 , wherein a thickness of the proof mass is the same as a thickness of the second semiconductor layer.

4. The micro-electromechanical system device according to claim 1 , further comprising an insulating layer disposed between the second semiconductor layer and the piezoelectric stacking structure.

5. The micro-electromechanical system device according to claim 4 , wherein the piezoelectric stacking structure further comprises:
a first metal layer disposed on the insulating layer, wherein the insulating layer comprises silicon oxide;
a first piezoelectric layer disposed on the first metal layer; and
a second metal layer disposed on the first piezoelectric layer.

6. The micro-electromechanical system device according to claim 1 , further comprising a cover layer disposed on the piezoelectric stacking structure, wherein a vacuum cavity is disposed between the cover layer and the piezoelectric stacking structure.

7. The micro-electromechanical system device according to claim 6 , wherein the cover layer is attached to the piezoelectric stacking structure through a protrusion structure.

8. The micro-electromechanical system device according to claim 1 , wherein the piezoelectric stacking structure comprises a plurality of the suspended regions, and a plurality of the proof masses is disposed in the cavity to connect to each of the suspended regions respectively.

Assignees

• Vanguard Int Semiconduct Corp

Inventors

• Xia jia jie

Classifications

• H10N30/306 Primary

  Cantilevers · CPC title

• B81B3/0021

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

• B81B3/0067

  Mechanical properties · CPC title

• G01P15/09

  by piezoelectric pick-up · CPC title

• H10N30/05

  Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes · CPC title