Power electronics system

US11823971B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11823971-B2
Application numberUS-201917291521-A
CountryUS
Kind codeB2
Filing dateNov 5, 2019
Priority dateNov 6, 2018
Publication dateNov 21, 2023
Grant dateNov 21, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosure relates to an electronic system including a plurality of adjacent, elementary power electronics modules and connected to one another by an electrical module connection. Each elementary module including at least one power component integrated on a printed circuit inserted between two electrically conductive heat sinks. The electrical module connection is made by heat sinks at the side and/or central connection surfaces thereof.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electronic system comprising at least one electronic cell (C 0 ), said at least one electronic cell (C 0 ) comprising: a first elementary power electronic module ( 1 ), called first elementary module ( 1 ), a second elementary power electronic module ( 2 ), called second elementary module ( 2 ), said first and second elementary modules ( 1 , 2 ) being adjacent and connected to each other by an electrical module connection, each of these first and second elementary modules ( 1 , 2 ) comprising: at least one power component ( 100 , 200 ), a first electrically conductive heat sink ( 11 , 21 ), called anode heatsink, connected to a first electrode called anode of the power component ( 100 , 200 ), and a second electrically conductive heat sink ( 12 , 22 ), called cathode heatsink, connected to a second electrode called cathode of the power component ( 100 , 200 ), wherein: each cathode heatsink ( 12 , 22 ) has a first connection surface ( 120 ) called central cathode surface and at least one second connection surface ( 121 , 122 , 222 ) called cathode side surface, and each anode heatsink ( 11 , 21 ) has a first connection surface ( 110 , 210 ) called central anode surface and at least one second connection surface ( 111 , 112 , 212 ) called anode side surface, and in that: the electrical module connection between the first and second adjacent elementary modules ( 1 , 2 ) comprises at least one conductive side electrical connection ( 1121 c , 1222 c ) between: at least one of the anode and cathode side surfaces ( 111 , 121 ) of the first elementary module ( 1 ), and at least one of the anode and cathode side surfaces ( 212 , 222 ) of the second elementary module ( 2 ). 2. The system according to claim 1 wherein the electrical module connection between the first and second adjacent elementary modules ( 1 , 2 ) further comprises one of a capacitive side electrical connection ( 1222 cp ) and an insulating side electrical connection ( 1221 i ) between: at least another one of the anode and cathode side surfaces ( 111 , 121 ) of the first elementary module ( 1 ), and at least another one of the anode and cathode side surfaces ( 212 , 222 ) of the second elementary module ( 2 ). 3. The system according to claim 2 wherein at least one anode side surface ( 111 ) of the first elementary module ( 1 ) is connected to at least one cathode side surface ( 222 ) of the second elementary module ( 2 ) by a conductive side electrical connection ( 1122 c ) and at least one cathode side surface ( 121 ) of the first elementary module ( 1 ) is connected to at least one anode side surface ( 212 ) of the second elementary module ( 2 ) by an electrical connection chosen from a capacitive side electrical connection ( 1221 cp ) or an insulating side electrical connection ( 1221 i ). 4. The system according to claim 3 wherein the at least one power component ( 100 ) of the first elementary module ( 1 ) is one of a first power transistor or a first power diode, and the at least one power component ( 200 ) of the second elementary module ( 2 ) is one of a second power transistor or a second power diode, so that the electronic cell forms a switching cell (C 10 ). 5. The system according to claim 1 comprising a plurality of adjacent electronic cells connected to each other, one electronic cell (C 1 , C 1 ′) of the plurality of electronic cells being connected to at least one adjacent electronic cell (C 2 , C 2 ′) by an electrical connection of cells, said electrical connection of cells comprising at least one of a conductive central electrical connection ( 1231 c , 1242 c ), a capacitive central electrical connection or a central insulating electrical connection ( 2142 i ) between: at least one of the central anode and cathode surfaces of the cell (C 1 , C 1 ′), and at least one of the central anode and cathode surfaces of the at least one cell (C 2 , C 2 ′) adjacent to said cell (C 1 , C 1 ′). 6. The system according to claim 5 , wherein at least one central cathode surface ( 120 ) of the cell (C 1 ) is connected to at least one central anode surface ( 310 ) of the adjacent cell (C 2 ) by a conductive central electrical connection ( 1231 c ) and at least one central anode surface ( 210 ) of the cell (C 1 ) is connected to at least one central cathode surface ( 420 ) of the adjacent cell (C 2 ) by a central insulating electrical connection ( 2142 i ). 7. The system according to claim 4 further comprising a plurality of adjacent electronic cells connected to each other, one electronic cell (C 1 , C 1 ′) of the plurality of electronic cells being connected to at least one adjacent electronic cell (C 2 , C 2 ′) by an electrical connection of cells, said electrical connection of cells comprising at least one of a conductive central electrical connection ( 1231 c , 1242 c ), a capacitive central electrical connection or a central insulating electrical connection ( 2142 i ) between: at least one of the central anode and cathode surfaces of the cell (C 1 , C 1 ′), and at least one of the central anode and cathode surfaces of the at least one cell (C 2 , C 2 ′) adjacent to said cell (C 1 , C 1 ′), wherein at least one central cathode surface ( 120 ) of the cell (C 1 ) is connected to at least one central anode surface ( 310 ) of the adjacent cell (C 2 ) by a conductive central electrical connection ( 1231 c ) and at least one central anode surface ( 210 ) of the cell (C 1 ) is connected to at least one central cathode surface ( 420 ) of the adjacent cell (C 2 ) by a central insulating electrical connection ( 2142 i ), and wherein each electronic cell (C 1 , C 2 , C 3 ) of the plurality of electronic cells is a switching cell (C 10 ), so that the system forms a sub-assembly of a multilevel power converter. 8. The system according to claim 5 wherein the electrical connection of cells further comprises at least one side conductive electrical connection ( 1252 c , 2161 c ) between: at least one of the anode and cathode side surfaces of the cell (C 1 ′), and at least one of the anode and cathode side surfaces of at least one other cell (C 3 ′) adjacent to said cell (C 1 ′). 9. The system according to claim 8 wherein the electrical module connection between the first and second adjacent elementary modules ( 1 , 2 ) further comprises one of a capacitive side electrical connection ( 1222 cp ) and an insulating side electrical connection ( 1221 i ) between: at least another one of the anode and cathode side surfaces ( 111 , 121 ) of the first elementary module ( 1 ), and at least another one of the anode and cathode side surfaces ( 212 , 222 ) of the second elementary module ( 2 ), and wherein at least one anode side surface ( 111 ) of the first elementary module ( 1 ) is connected to at least one cathode side surface ( 222 ) of the second elementary module ( 2 ) by a conductive side electrical connection ( 1122 c ) and at least one cathode side surface ( 121 ) of the first elementary module ( 1 ) is connected to at least one anode side surface ( 212 ) of the second elementary module ( 2 ) by an electrical connection chosen from a capacitive side electrical connection ( 1221 cp ) or an insulating side electrical connection ( 1221 i ), and wherein the at least one power component ( 100 ) of the first elementary module ( 1 ) is one of a first power transistor or a first power diode, and the at least one power component ( 200 ) of the second elementary module ( 2 ) is one of a second power transistor or a second power diode, so that the electronic cell forms a switching cell (C 10 ), said system further comprising a first electronic cell (C 1 ′), a second electro

Assignees

Inventors

Classifications

  • the multiple chips being integrally enclosed · CPC title

  • Configurations of laterally-adjacent chips · CPC title

  • Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

  • Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

  • H10W40/10Primary

    Arrangements for heating · CPC title

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What does patent US11823971B2 cover?
The disclosure relates to an electronic system including a plurality of adjacent, elementary power electronics modules and connected to one another by an electrical module connection. Each elementary module including at least one power component integrated on a printed circuit inserted between two electrically conductive heat sinks. The electrical module connection is made by heat sinks at the …
Who is the assignee on this patent?
Inst Polytechnique Grenoble
What technology area does this patent fall under?
Primary CPC classification H10W40/10. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 21 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).