Electronic device with cooling by a liquid metal spreader

Patent metadata

Field	Value
Publication number	US-9693480-B2
Application number	US-201214365538-A
Country	US
Kind code	B2
Filing date	Dec 11, 2012
Priority date	Dec 13, 2011
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

An electronic device with cooling of a heat dissipation source, by a liquid metals spreader, the device including at least one heat dissipation source, at least one spreader through which at least one liquid metal circulation channel passes forming a loop routed below a heat dissipation source, at least one heat sink, and at least one electromagnetic pump moving the liquid metal in the at least one channel such that the liquid metal absorbs heat dissipated by a heat dissipation source and transports the absorbed heat to be evacuated by the heat sink. Each spreader includes at least two plates made of an electrical insulating material located on each side of at least one bar made of deformable material.

First claim

The invention claimed is:

1. An electronic device for cooling of a heat dissipation source by a liquid metals spreader, the electronic device comprising:
at least one heat dissipation source comprising at least one electronic component;
at least one spreader through which at least one liquid metal circulation channel passes forming a loop routed below the heat dissipation source;
at least one heat sink; and
at least one electromagnetic pump moving the liquid metal in the at least one channel such that the liquid metal absorbs heat dissipated by the heat dissipation source and transports the absorbed heat to be evacuated by the heat sink,
wherein each spreader comprises at least two plates made of an insulating material located on each side of at least one bar made of deformable material, around which the liquid metal circulation channel is made.

2. An electronic device according to claim 1 , wherein the at least electronic component is a semiconductor component.

3. An electronic device according to claim 2 , comprising stacks made of several semiconductor components/liquid metals spreader/heat sink, each associated with an electromagnetic pump.

4. An electronic device according to claim 1 , wherein the liquid metal is chosen from among gallium, indium, bismuth, tin, alloys including gallium and/or indium and/or tin, sodium-potassium alloy.

5. An electronic device according to claim 1 , wherein each bar made of deformable material is made from expanded Teflon, foam with closed cells, foam with open cells and with sealed coating, or solid or hollow deformable plastic.

6. An electronic device according to claim 1 , wherein the heat sink is a finned heat sink or a forced convection liquid cooler.

7. An electronic device according to claim 6 , wherein the finned heat sink is used with a fan.

8. An electronic device according to claim 1 , wherein each electromagnetic pump is a magnetohydrodynamic conducting pump.

9. An electronic device according to claim 1 , wherein the plates made of an insulating electrical material are made of ceramic, AlN, Al203, Si 3 N 4 , or SiC.

10. An electronic device according to claim 1 , wherein each electromagnetic pump is included between the two plates of a spreader made of an insulating material.

11. An electronic device according to claim 1 , wherein the spreader comprises fins inside the at least one liquid metal circulation channel to increase an exchange area with the liquid metal.

12. An electronic device according to claim 1 , further comprising a heat duct arranged between the liquid metals spreader and the heat sink.

13. An electronic device according to claim 1 , further comprising:
a first polymer frame;
a polymer seal with support means;
a second polymer frame;
a first plate made of an insulating material on which semiconductor components are placed, the first plate being arranged between the first polymer frame and the polymer seal;
a second plate made of an insulating material, the second plate being arranged between the polymer seal and the second polymer frame;
a bar made of deformable material, the bar made of deformable material being arranged between the first plate and the second plate;
three electrodes one being placed on the bar made of deformable material;
a first magnetic circuit comprising at least one bar made of a magnetic material and a permanent magnet, the first magnetic circuit being placed on a side of the first plate opposite to the polymer seal;
a second magnetic circuit, the second magnetic circuit being placed on a side of the second plate opposite to the polymer seal;
a heat sink, the heat sink being placed on the side of the second plate opposite to the polymer seal;
the liquid metal circulation channel being made around the bar made of deformable material.

14. An electronic device according to claim 13 , wherein the electrodes are made from copper coated with a protective layer, molybdenum, tungsten, or stainless steel.

15. An electronic device according to claim 1 , further comprising:
one polymer frame;
electrodes one of which i 3 placed on deformable material;
a polymer seal with support means;
a finned heat sink;
a first ceramic plate on which plural semiconductor components are placed, the first ceramic plate being arranged between the polymer frame and the polymer seal;
a second ceramic plate, the second ceramic plate being arranged between the polymer seal and the finned heat sink;
two first magnetic circuits, the two first magnetic circuits being placed on a side of the first ceramic plate opposite to the polymer seal;
a bar made of deformable material, the bar made of deformable material being arranged between the first ceramic plate and the second ceramic plate;
electrodes, one of which is placed on deformable material;
two second magnetic circuits, the two second magnetic circuits being placed on a side of the second ceramic plate opposite to the polymer seal;
the liquid metal circulation channel being made around the bar made of deformable material.

16. An electronic device according to claim 1 , further comprising:
a first polymer frame;
a first polymer seal with support means;
a second polymer seal with support means;
a second polymer frame;
a first ceramic plate on which semiconductor components are placed, the first ceramic plate being arranged between the first polymer frame and the first polymer seal;
a second ceramic plate, the second ceramic plate being arranged between the first polymer seal and the second polymer seal;
a third ceramic plate, the third ceramic plate being arranged between the second polymer seal and the second polymer frame;
a first finned heat sink, the first finned heat sink being placed on a side of the first ceramic plate opposite to the first polymer seal;
first magnetic circuits, the first magnetic circuits being placed on the side of the first ceramic plate opposite to the first polymer seal;
first electrodes, the first electrodes being arranged between the first ceramic plate and the second ceramic plate;
three first bars made of deformable material, the three first bars made of deformable material being arranged between the first ceramic plate and the second ceramic plate;
second electrodes, the second electrodes being arranged between the second ceramic plate and the third ceramic plate;
three second bars made of deformable material, the three second bars made of deformable material being arranged between the second ceramic plate and the third ceramic plate;
second magnetic circuits, the second magnetic circuits being placed on a side of the third ceramic plate opposite to the second polymer seal;
a second finned heat sink, the second finned heat sink being placed on the side of the third ceramic plate opposite to the second polymer seal;
a first liquid metal circulation channel being made around the first bars made of deformable material, and a second liquid metal circulation channel being made around the second bars made of deformable material.

Assignees

• Labinal Power Systems
• Inst Polytechnique Grenoble
• Centre Nat Rech Scient
• Inst Polytechnic De Grenoble

Inventors

• Salat Jacques
• Avenas Yvan
• Meuret Regis Bernard Albert
• Tawk Mansour

Classifications

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20263 Primary

  Heat dissipaters releasing heat from coolant · CPC title

• H01L2924/00

  Electricity · mapped topic

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H01L2924/0002

  Electricity · mapped topic