Resistance soldering system

Patent metadata

Field	Value
Publication number	US-11819951-B2
Application number	US-202117148925-A
Country	US
Kind code	B2
Filing date	Jan 14, 2021
Priority date	Jun 20, 2018
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

A resistance soldering system includes a power input receiving an alternating current from a power source and a controller circuit generating a control signal indicative of a desired power level delivered for a desired time. The resistance soldering system further includes a silicon-controlled rectifier connected to the power input and the controller circuit and producing a control voltage proportional to the control signal and a transformer having a primary side receiving the control voltage and a secondary side having output leads configured to apply an output voltage to a solder joint disposed between the output leads. The controller circuit determines the control signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time. The controller circuit controls the desired power level independent of the desired time. A method of operating a resistance soldering system is also presented.

First claim

We claim:

1. A resistance soldering system, comprising:
a power input channel configured to receive an alternating current from a power source;
a controller circuit configured to generate a control signal indicative of a desired power level delivered for a desired time;
a silicon-controlled rectifier electrically connected to the power input channel and the controller circuit and configured to produce a control voltage proportional to the control signal; and
a transformer having a primary side configured to receive the control voltage from the silicon-controlled rectifier and a secondary side having output leads configured to apply an output voltage across a solder joint disposed between the output leads, wherein electrical resistance of the solder joint to the output voltage melts the solder joint disposed between the pair of output leads, wherein the controller circuit determines the control signal applied to the silicon controlled rectifier required to melt the solder joint based on the desired power level and the desired time, and wherein the controller circuit controls the desired power level independent of the desired time.

2. The system in accordance with claim 1 , wherein the control signal is a current signal.

3. The system in accordance with claim 1 , wherein the signal is a control voltage signal.

4. The system in accordance with claim 1 , wherein the silicon-controlled rectifier receives a voltage output signal and a current output signal from the controller circuit, the voltage output signal and the current output signal indicative of a total power delivered to the primary side of the transformer, whereby the controller circuit determines the total power delivered to a pair of output leads based on the voltage output signal and the current output signal.

5. The system in accordance with claim 4 , wherein the voltage output signal and the current output signal are stored in a memory of the controller circuit.

6. The system in accordance with claim 4 , wherein the system further includes a visual display and wherein the voltage output signal and the current output signal are displayed on the visual display.

7. The system in accordance with claim 1 , wherein the desired power level is characterized as a linear function.

8. The system in accordance with claim 7 , wherein the linear function is further characterized as a piece-wise linear function.

9. The system in accordance with claim 1 , wherein the desired power level is characterized as a polynomial function.

10. A method of operating a resistance soldering system, comprising:
receiving an alternating current from a power input channel connected to a power source;
generating a control signal indicative of a desired power level delivered for a desired time via a controller circuit;
producing a control voltage proportional to the control signal via a silicon-controlled rectifier electrically connected to the power source and the controller circuit;
producing an output voltage from a transformer having a primary side and a secondary side as the primary side receives the control voltage from the silicon-controlled rectifier;
applying the output voltage across a solder joint disposed between output leads electrically connected to the secondary side, wherein electrical resistance of the solder joint to the output voltage melts the solder joint disposed between the pair of output leads; and
determining, via the controller circuit, the control signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time, wherein the controller circuit controls the desired time independent of the desired power level.

11. The method in accordance with claim 10 , wherein the control signal is a current signal.

12. The method in accordance with claim 10 , wherein the control signal is a voltage signal.

13. The method in accordance with claim 12 , wherein the silicon-controlled rectifier receives a voltage output signal and a current output signal from the controller circuit, wherein the voltage output signal and the current output signal are indicative of a total power delivered to the primary side of the transformer, and wherein the method further includes:
determining the total power delivered to a pair of output leads based on the voltage output signal and the current output signal via the controller circuit.

14. The method in accordance with claim 13 , further including storing the voltage output signal and the current output signal in a memory of the controller circuit.

15. The method in accordance with claim 13 , wherein the method further includes:
providing a visual display; and
displaying the voltage output signal and the current output signal on the visual display.

16. The method in accordance with claim 10 , wherein the desired power level is characterized as a linear function.

17. The method in accordance with claim 16 , wherein the linear function is further characterized as a piece wise linear function.

18. The method in accordance with claim 10 , wherein the desired power level is characterized as a polynomial function.

Assignees

• Antaya Tech Corporation
• Aptiv Technologies AG

Inventors

• Olson Gordon
• Wheaton Michael E
• Falk William

Classifications

• B23K3/08 Primary

  Auxiliary devices therefor · CPC title

• G05B19/042

  using digital processors (G05B19/05 takes precedence) · CPC title

• G05B2219/23345

  Memory is eeprom · CPC title

• G05B2219/25252

  Microprocessor · CPC title

• B23K11/00 Primary

  Resistance welding; Severing by resistance heating · CPC title