Display substrate motherboard and preparation method thereof, display substrate and preparation method thereof

Patent metadata

Field	Value
Publication number	US-11818922-B2
Application number	US-201916964423-A
Country	US
Kind code	B2
Filing date	Sep 29, 2019
Priority date	Sep 29, 2019
Publication date	Nov 14, 2023
Grant date	Nov 14, 2023

Abstract

A display substrate motherboard and a preparation method thereof, a display substrate and a preparation method thereof are disclosed. The display substrate motherboard includes a base substrate, a first flexible organic layer, a first inorganic layer, a second flexible organic layer and a pixel driving circuit layer. The pixel driving circuit layer includes a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions are insulated from each other. An orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate. An orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate.

First claim

The invention claimed is:

1. A display substrate motherboard, comprising:
a base substrate,
a first flexible organic layer on the base substrate,
a first inorganic layer on the first flexible organic layer,
a second flexible organic layer on the first inorganic layer, and
a pixel driving circuit layer on the second flexible organic layer, the pixel driving circuit layer including a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions being insulated from each other,
wherein an orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate, and an orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate,
wherein the orthogonal projection of the second flexible organic layer on the base substrate is also located inside an orthogonal projection of the first flexible organic layer on the base substrate.

2. The display substrate motherboard according to claim 1 , wherein an interval between at least one side edge of the orthogonal projection of the second flexible organic layer on the base substrate and a corresponding side edge of the orthogonal projection of the first flexible organic layer on the base substrate is greater than or equal to 0.2 mm.

3. The display substrate motherboard according to claim 1 , wherein an orthogonal projection of the first flexible organic layer on the base substrate is located inside the orthogonal projection of the first inorganic layer on the base substrate.

4. The display substrate motherboard according to claim 1 , wherein materials of the first flexible organic layer and the second flexible organic layer both include polyimide.

5. The display substrate motherboard according to claim 1 , wherein a thickness of the first flexible organic layer is 5 μm-20 μm, a thickness of the first inorganic layer is 0.4 μm-2 μm, and a thickness of the second flexible organic layer is 5 μm-20 μm.

6. The display substrate motherboard according to claim 1 , wherein the first inorganic layer includes a first inorganic sub-layer and a second inorganic sub-layer sequentially stacked on the first flexible organic layer,
a material of the first inorganic sub-layer includes one or more of silicon oxide, silicon nitride or silicon oxynitride, and
a material of the second inorganic sub-layer includes amorphous silicon.

7. The display substrate motherboard according to claim 6 , wherein a total thickness of the first inorganic layer is 0.4 μm-2 μm, and a thickness of the second inorganic sub-layer is
1 nm-50 nm.

8. The display substrate motherboard according to claim 1 , further comprising:
a second inorganic layer on the second flexible organic layer, and
a third flexible organic layer on the second inorganic layer;
wherein an orthogonal projection of the third flexible organic layer on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate.

9. The display substrate motherboard according to claim 1 , wherein the base substrate is a rigid substrate.

10. The display substrate motherboard according to claim 1 , further comprising a light-emitting element layer on the pixel driving circuit layer,
the light-emitting element layer including a plurality of light-emitting element portions respectively used for the plurality of display substrates, and the plurality of light-emitting element portions being respectively located on the plurality of pixel driving circuit portions.

11. A display substrate, comprising:
a first flexible organic layer,
a first inorganic layer on the first flexible organic layer,
a second flexible organic layer on the first inorganic layer,
a pixel driving circuit layer on the second flexible organic layer, and
a light-emitting element layer on the pixel driving circuit layer;
wherein a thickness of the first flexible organic layer is 5 μm-20 μm, a thickness of the first inorganic layer is 0.4 μm-2 μm, and a thickness of the second flexible organic layer is 5 μm-20 μm.

12. A preparation method of a display substrate motherboard, comprising:
providing a base substrate,
forming a first flexible organic layer on the base substrate,
forming a first inorganic layer on the first flexible organic layer,
forming a second flexible organic layer on the first inorganic layer, and
forming a pixel driving circuit layer on the second flexible organic layer, the pixel driving circuit layer including a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions being insulated from each other;
wherein an orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate, and an orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate,
wherein the orthogonal projection of the second flexible organic layer on the base substrate is also located inside an orthogonal projection of the first flexible organic layer on the base substrate.

13. The preparation method of the display substrate motherboard according to claim 12 , wherein an interval between at least one side edge of the orthogonal projection of the second flexible organic layer on the base substrate and a corresponding side edge of the orthogonal projection of the first flexible organic layer on the base substrate is greater than or equal to 0.2 mm.

14. The preparation method of the display substrate motherboard according to claim 12 , wherein a formation thickness of the first flexible organic layer is 5 μm-20 μm, a formation thickness of the first inorganic layer is 0.4 μm-2 μm, and a formation thickness of the second flexible organic layer is 5 μm-20 μm.

15. The preparation method of the display substrate motherboard according to claim 12 , wherein the forming the first inorganic layer includes sequentially forming a first inorganic sub-layer and a second inorganic sub-layer on the first flexible organic layer,
a material of the first inorganic sub-layer includes one or more of silicon oxide, silicon nitride and silicon oxynitride, and
a material of the second inorganic sub-layer includes amorphous silicon.

16. The preparation method of the display substrate motherboard according to claim 15 , wherein a total thickness of the first inorganic sub-layer is 0.4 μm-2 μm; and a formation thickness of the second inorganic sub-layer is 1 nm-50 nm.

17. A preparation method of a display substrate, comprising:
obtaining a display substrate motherboard by using the preparation method according to claim 12 ,
separating the first flexible organic layer from the base substrate, and
cutting the display substrate motherboard to form a plurality of individual display substrates.

18. The preparation method of the display substrate according to claim 17 , wherein the base substrate is separated from the first flexible organic layer by using a laser lift-off manner.

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Yu Jun
• Lu Zhong
• Fan Zhenrui
• Chen Shuohua
• Song Zhaoyang
• Yin Chenlin
• Tang Yongjie

Classifications

• H10K59/124 Primary

  Insulating layers formed between TFT elements and OLED elements · CPC title

• H10K77/111 Primary

  Flexible substrates · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title

• H10K2102/311

  Flexible OLED · CPC title