Light-emitting device and electronic device using the same
US-2024128272-A1 · Apr 18, 2024 · US
US2020266369A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020266369-A1 |
| Application number | US-201916709000-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 10, 2019 |
| Priority date | Feb 19, 2019 |
| Publication date | Aug 20, 2020 |
| Grant date | — |
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The present disclosure discloses a flexible substrate and a method for manufacturing the same, and a flexible display substrate and a method for manufacturing the same. The method for manufacturing the flexible substrate includes: sequentially forming a first flexible substrate layer and a first inorganic layer on a rigid base substrate; forming a second flexible substrate layer on a side of the first inorganic layer distal from the first flexible substrate layer, an orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer; and stripping off the rigid base substrate to obtain the flexible substrate. The method solves the problem of poor process of the flexible substrate.
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1 . A method for manufacturing a flexible substrate, comprising: sequentially forming a first flexible substrate layer and a first inorganic layer on a rigid base substrate; forming a second flexible substrate layer on a side of the first inorganic layer distal from the first flexible substrate layer, an orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer; and stripping off the rigid base substrate to obtain the flexible substrate. 2 . The method according to claim 1 , wherein the forming the second flexible substrate layer on the side of the first inorganic layer distal from the first flexible substrate layer, the orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer comprises: forming a first substrate solution layer on the side of the first inorganic layer distal from the first flexible substrate layer, an area of the first substrate solution layer being smaller than an area of the first flexible substrate layer, and an orthographic projection of the first substrate solution layer on the first flexible substrate layer being located within the first flexible substrate layer; and drying the first substrate solution layer to obtain the second flexible substrate layer. 3 . The method according to claim 1 , wherein upon the forming the second flexible substrate layer on the side of the first inorganic layer distal from the first flexible substrate layer, the method further comprises: forming a second inorganic layer on a side of the second flexible substrate layer distal from the first inorganic layer. 4 . The method of claim 3 , wherein upon the forming the second inorganic layer on the side of the second flexible substrate layer distal from the first inorganic layer, the method further comprises: forming a third flexible substrate layer on a side of the second inorganic layer distal from the second flexible substrate layer, an orthographic projection of the third flexible substrate layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and forming a third inorganic layer on a side of the third flexible substrate layer distal from the second inorganic layer. 5 . The method according to claim 4 , wherein the forming the third flexible substrate layer on the side of the second inorganic layer distal from the second flexible substrate layer comprises: forming a second substrate solution layer on the side of the second inorganic layer distal from the second flexible substrate layer, an area of the second substrate solution layer being smaller than an area of the second flexible substrate layer, and an orthographic projection of the second substrate solution layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and drying the second substrate solution layer to obtain the third flexible substrate layer. 6 . The method according to claim 1 , wherein upon the forming the second flexible substrate layer on the side of the first inorganic layer distal from the first flexible substrate layer, the method further comprises: sequentially forming a second inorganic layer, a third flexible substrate layer and a third inorganic layer on the side of the second flexible substrate layer distal from the first inorganic layer, an orthographic projection of the third flexible substrate layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer. 7 . A flexible substrate, comprising: a first flexible substrate layer, a first inorganic layer, and a second flexible substrate layer that are sequentially stacked, an orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer. 8 . The flexible substrate according to claim 7 , further comprising: a second inorganic layer located on a side of the second flexible substrate layer distal from the first inorganic layer. 9 . The flexible substrate according to claim 8 , further comprising: a third flexible substrate layer located on a side of the second inorganic layer distal from the second flexible substrate layer, an orthographic projection of the third flexible substrate layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and a third inorganic layer located on a side of the third flexible substrate layer distal from the second inorganic layer. 10 . A method for manufacturing a flexible display substrate, the method comprising: sequentially forming a first flexible substrate layer, a first inorganic layer, and a second flexible substrate layer on a rigid base substrate, an orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer; forming a display structure layer on a side of the second flexible substrate layer distal from the first inorganic layer, an orthographic projection of the display structure layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and stripping off the rigid base substrate to obtain the flexible display substrate. 11 . The method according to claim 10 , wherein prior to the forming the display structure layer on the side of the second flexible substrate layer distal from the first inorganic layer, the method further comprises: forming a second inorganic layer on the side of the second flexible substrate layer distal from the first inorganic layer; and forming the display structure layer on the side of the second flexible substrate layer distal from the first inorganic layer comprises: forming the display structure layer on a side of the second inorganic layer distal from the second flexible substrate layer. 12 . The method according to claim 11 , wherein upon the forming the second inorganic layer on the side of the second flexible substrate layer distal from the first inorganic layer, the method further comprises: sequentially forming a third flexible substrate layer and a third inorganic layer on the side of the second inorganic layer distal from the second flexible substrate layer, an orthographic projection of the third flexible substrate layer on the first flexible substrate layer being located within the orthographic projection of the second flexible substrate layer on the first flexible substrate layer; and the forming the display structure layer on the side of the second inorganic layer distal from the second flexible substrate layer comprises: forming the display structure layer on a side of the third inorganic layer distal from the third flexible substrate layer, an orthographic projection of the display structure layer on the first flexible substrate layer being located within the orthographic projection of the third flexible substrate layer on the first flexible substrate layer. 13 . The method according to claim 10 , wherein prior to the stripping off the rigid base substrate, the method further comprises: forming a encapsulation structure layer on a side of the display structure layer distal from
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Manufacturing or production processes characterised by the final manufactured product · CPC title
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