Quantum device with modular quantum building blocks

US11812673B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11812673-B2
Application numberUS-202117158099-A
CountryUS
Kind codeB2
Filing dateJan 26, 2021
Priority dateJul 27, 2018
Publication dateNov 7, 2023
Grant dateNov 7, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Techniques for a quantum device with modular quantum building blocks are provided. In one embodiment, a device is provided that comprises a substrate that is coupled with a plurality of qubit pockets, where at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit. In one implementation, the device can further comprise a plurality of connectors coupled to the substrate and positioned around at least a portion of the substrate, where the plurality of connectors comprising a connecting element. In one or more implementations, the device can further comprise a plurality of transmission lines formed on the substrate and connect at least one connector of the plurality of connectors to at least one qubit pocket of the plurality of qubit pockets.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming a modular quantum device, comprising: providing a plurality of substrates respectively comprising a plurality of qubit pockets, wherein the substrates are separate from one another; providing qubits in respective pockets of the plurality of qubit pockets; coupling respective substrates of the plurality of substrates to one another via connectors formed on the respective substrates; forming a plurality of transmission lines on each of the substrates; and connecting the plurality of transmission lines to at least one connector of the connectors and to at least one qubit pocket of the plurality of qubit pockets, wherein each of the substrates are separately replaceable from one another without replacement of an entirety of the modular quantum device. 2. The method of claim 1 , further comprising: arranging pairs of the connectors formed on a same substrate of the substrates with a separation gap between the to maintain crosstalk below −50 decibels. 3. The method of claim 1 , further comprising: arranging pairs of the connectors formed on a same substrate of the substrates with a separation gap of at least 3 millimeters. 4. The method of claim 1 , wherein the connectors comprise wire bonds. 5. The method of claim 1 , wherein the connectors comprise vertical interconnect accesses. 6. The method of claim 1 , wherein the substrates are composed of a material selected from the group consisting of sapphire and silicon and gallium arsenide. 7. The method of claim 1 , wherein at least one transmission line of the plurality of transmission lines comprises a coplanar waveguide. 8. The method of claim 1 , further comprising: using a coplanar waveguide to couple the plurality of qubit pockets to the substrates. 9. The method of claim 1 , wherein at least one transmission line of the plurality of transmission lines is comprised of a microstrip material. 10. The method of claim 1 , further comprising: removing a substrate of the plurality of substrates without degrading a functionality of another substrate of the plurality of substrates. 11. A method for forming a modular quantum device, comprising: assembling a plurality of quantum building blocks, each of the quantum building blocks comprising a substrate, a plurality of connectors, a plurality of qubits and a plurality of transmission lines; determining resistance levels of the plurality of qubits respectively associated with each of the quantum building blocks; determining an arrangement of the quantum building blocks relative to one another based on the resistance levels that achieves different communication frequencies for different ones of the quantum building blocks; connecting the plurality of quantum building blocks to one another via respective connectors formed on different ones of the quantum building blocks in accordance with the arrangement; and removing a quantum building block of the plurality of quantum building blocks without degrading a functionality of another quantum building block of the plurality of building blocks. 12. The method of claim 11 , wherein the assembling comprises arranging two or more connectors of the plurality of connectors formed on a same side of the substrate a separation gap of at least 3 millimeters. 13. The method of claim 11 , wherein each of the quantum building blocks are separately replaceable from one another without replacement of an entirety of the modular quantum device. 14. The method of claim 11 , further comprising: replacing the quantum building block with a new quantum building block. 15. A method for forming a modular quantum device, comprising: forming a plurality of quantum building blocks, each of the quantum building blocks comprising a substrate, a plurality of connectors, a plurality of qubits and a plurality of transmission lines; and connecting the plurality of quantum building blocks to one another via respective connectors of the plurality of connectors formed on different ones of the quantum building blocks, wherein the respective connectors transport quantum signals between the plurality of quantum building blocks, wherein each of the quantum building blocks are separately replaceable from one another without replacement of an entirety of the modular quantum device. 16. The method of claim 15 , further comprising: removing a quantum building block of the plurality of quantum building blocks without degrading a functionality of another quantum building block of the plurality of building blocks. 17. The method of claim 16 , further comprising: replacing the quantum building block with a new quantum building block.

Assignees

Inventors

Classifications

  • G06N10/40Primary

    Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control · CPC title

  • H10N60/815Primary

    for Josephson-effect devices · CPC title

  • Quantum computing, i.e. information processing based on quantum-mechanical phenomena · CPC title

  • of Josephson-effect devices · CPC title

  • Josephson-effect devices · CPC title

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What does patent US11812673B2 cover?
Techniques for a quantum device with modular quantum building blocks are provided. In one embodiment, a device is provided that comprises a substrate that is coupled with a plurality of qubit pockets, where at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit. In one implementation, the device can further comprise a plurality of connectors coupled to the substrate…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification G06N10/40. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).