Probe pin material including Ag—Pd—Cu-based alloy

Patent metadata

Field	Value
Publication number	US-11807925-B2
Application number	US-202217982092-A
Country	US
Kind code	B2
Filing date	Nov 7, 2022
Priority date	Feb 10, 2022
Publication date	Nov 7, 2023
Grant date	Nov 7, 2023

Abstract

A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (SAg), a Pd concentration (SPd) and a Cu concentration (SCu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.

First claim

What is claimed is:

1. A probe pin material comprising a Ag—Pd—Cu-based alloy comprising: Ag, Pd and Cu; B as a first additive element; at least any element of Zn, Bi and Sn as a second additive element, and unavoidable impurities,
wherein the alloy contains no In; wherein S Ag is a ratio of a concentration of Ag in the alloy to a combined concentration of Ag, Pd and Cu in the alloy as mass %, S Pd is a ratio of a concentration of Pd in the alloy to the combined concentration of Ag, Pd and Cu in the alloy as mass %, S Cu is a ratio of a concentration of Cu in the alloy to the combined concentration of Ag, Pd and Cu in the alloy as mass %,
wherein all values of the S Ag , the S Pd and the S Cu fall within a range of a polygon (A1-A2-A3-A4) surrounded with straight lines connecting respective points of a point A1 (Ag: 5.5 mass %, Pd:47.5 mass %, Cu:47 mass %), a point A2 (Ag: 5.5 mass %, Pd:58.5 mass %, Cu:36 mass % ), a point A3 (Ag: 18 mass %, Pd:49 mass %, Cu:33 mass %) and a point A4 (Ag: 18 mass %, Pd:45 mass %, Cu:37 mass %) in a Ag—Pd—Cu ternary system phase diagram,
a concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and
a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less.

2. The probe pin material according to claim 1 , wherein
when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and
a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted,
the number of times of bending counted is five or more.

3. A probe pin comprising the probe pin material defined in claim 1 .

4. The probe pin material according to claim 1 , wherein a Vickers hardness is 380 Hv or more and 580 Hv or less.

5. The probe pin material according to claim 4 , wherein
when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and
a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted,
the number of times of bending counted is five or more.

6. The probe pin material according to claim 1 , wherein all values of the S Ag , the S Pd and the S Cu fall within a range of a polygon (A1-A2-B3-B4) surrounded with straight lines connecting respective points of the point A1, the point A2, a point B3 (Ag: 13 mass %, Pd:52.8 mass %, Cu:34.2 mass %) and a point B4 (Ag: 13 mass %, Pd:46 mass %, Cu:41 mass %).

7. The probe pin material according to claim 6 , wherein
when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and
a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted,
the number of times of bending counted is five or more.

8. The probe pin material according to claim 6 , wherein all values of the Sa Ag , the S Pd , and the S Cu fall within a range of a polygon (C1-A2-C3-C4) surrounded with straight lines connecting respective points of a point C1 (Ag: 5.5 mass %, Pd:52 mass %, Cu:42.5 mass %), the point A2, a point C3 (Ag: 11 mass %, Pd:54.3 mass %, Cu:34.7 mass %) and a point C4 (Ag: 11 mass %, Pd:50 mass %, Cu:39 mass %).

9. The probe pin material according to claim 6 , wherein a specific resistance after an aging heat treatment is 10 μΩ·cm or less.

10. The probe pin material according to claim 6 , wherein a Vickers hardness is 380 Hv or more and 580 Hv or less.

11. A probe pin comprising the probe pin material defined in claim 6 .

12. The probe pin material according to claim 1 , wherein all values of the S Ag , the S Pd , and the S Cu fall within a range of a polygon (C1-A2-C3-C4) surrounded with straight lines connecting respective points of a point C1 (Ag: 5.5 mass %, Pd:52 mass %, Cu:42.5 mass %), the point A2, a point C3 (Ag: 11 mass %, Pd:54.3 mass %, Cu:34.7 mass %) and a point C4 (Ag: 11 mass %, Pd:50 mass %, Cu:39 mass %).

13. The probe pin material according to claim 12 , wherein a specific resistance after an aging heat treatment is 10 μΩ·cm or less.

14. The probe pin material according to claim 12 , wherein a Vickers hardness is 380 Hv or more and 580 Hv or less.

15. The probe pin material according to claim 12 , wherein
when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and
a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted,
the number of times of bending counted is five or more.

16. A probe pin comprising the probe pin material defined in claim 12 .

17. The probe pin material according to claim 1 , wherein a specific resistance after an aging heat treatment is 10 μΩ·cm or less.

18. The probe pin material according to claim 17 , wherein a Vickers hardness is 380 Hv or more and 580 Hv or less.

19. The probe pin material according to claim 17 , wherein
when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and
a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted, the number of times of bending counted is five or more.

Assignees

• Tanaka Precious Metal Ind

Inventors

• Fuse Takeshi
• Shima Kunihiro
• Sagae Takeyuki
• Kouno Shinji

Classifications

• C22C5/04 Primary

  Alloys based on a platinum group metal · CPC title

• C22C30/02

  containing copper · CPC title

• C22C30/04

  containing tin or lead · CPC title

• C22C30/06

  containing zinc · CPC title

• C22F1/14

  of noble metals or alloys based thereon · CPC title