Electronic device including conductive adhesive layer

Patent metadata

Field	Value
Publication number	US-11805685-B2
Application number	US-202117205419-A
Country	US
Kind code	B2
Filing date	Mar 18, 2021
Priority date	Jul 30, 2020
Publication date	Oct 31, 2023
Grant date	Oct 31, 2023

Abstract

The present application relates to an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component includes a first pad area including first pads and second pads spaced apart from the first pads. A number of the first pads is greater than a number of the second pads. The second electronic component includes first bumps electrically connected to the first pads, and second bumps electrically connected to the second pads. Each of the second bumps has a bonding area greater than a bonding area of each of the first bumps. A conductive adhesive layer is disposed between the first electronic component and the second electronic component to electrically connect the first pads to the first bumps.

First claim

What is claimed is:

1. An electronic device comprising:
a first electronic component comprising a first pad area including first pads and second pads spaced apart from the first pads, wherein a number of the first pads is greater than a number of the second pads;
a second electronic component comprising:
first bumps electrically connected to the first pads; and
second bumps electrically connected to the second pads, wherein each of the second bumps has a bonding area greater than a bonding area of each of the first bumps; and

a conductive adhesive layer disposed between the first electronic component and the second electronic component to electrically connect the first pads to the first bumps, wherein
each of the second pads has a thickness greater than a thickness of each of the first pads.

2. The electronic device of claim 1 , wherein
the first electronic component comprises a display area adjacent to the first pad area, wherein a pixel is disposed in the display area, and
the second electronic component comprises a driving chip.

3. The electronic device of claim 2 , wherein the first electronic component comprises a second pad area comprising third pads electrically connected to the second pads.

4. The electronic device of claim 3 , further comprising a circuit board electrically connected to the second pad area.

5. The electronic device of claim 3 , wherein
the driving chip receives first signals through the second pads and the second bumps, and
the driving chip provides second signals to the first pads through the first bumps, the second signals being generated based on the first signals.

6. The electronic device of claim 1 , wherein
the first pads are disposed in a matrix arrangement comprising a plurality of rows and a plurality of columns, and
the second pads are disposed in a direction parallel to a row direction of the plurality of rows of the matrix arrangement.

7. The electronic device of claim 1 , wherein
the first pads define a first pad row, a second pad row, a third pad row, and a fourth pad row disposed in a first direction,
each of the first pad row, the second pad row, the third pad row, and the fourth pad row comprises corresponding pads of the first pads,
the corresponding pads of the first pads are disposed in a second direction intersecting the first direction, and
at least a portion of the corresponding pads of the first pads extends in a direction intersecting the first direction and the second direction in a plan view.

8. The electronic device of claim 1 , wherein the conductive adhesive layer comprises:
an adhesive layer; and
a single layer of a plurality of conductive balls included in the adhesive layer.

9. The electronic device of claim 8 , wherein
a portion of the plurality of conductive balls is disposed between the first pads and the first bumps, and
none of the conductive balls overlaps the second pads and the second bumps.

10. The electronic device of claim 8 , wherein
the conductive adhesive layer comprises a first area and a second area in a plan view,
the plurality of conductive balls are disposed on the first area and the plurality of conductive balls are not disposed on the second area,
the first area of the conductive adhesive layer overlaps the first pads, and
the second area of the conductive adhesive layer overlaps an entirety of the second pads.

11. The electronic device of claim 1 , wherein each of the second bumps has a multilayered structure of more layers than layers of each of the first bumps.

12. The electronic device of claim 1 , wherein
each of the first pads and the second pads comprises a plurality of laminated conductive layers, and
the second pads comprise a greater number of conductive layers than a number of conductive layers in the first pads.

13. The electronic device of claim 1 , wherein
a second pad of the second pads and a second bump of the second bumps constitute a metal structure, the second bump being bonded to the second pad, and
the metal structure comprises a eutectic region of a first metal and a second metal, wherein the first metal is different from the second metal.

14. The electronic device of claim 13 , wherein the eutectic region further comprises a third metal different from each of the first metal and the second metal.

15. An electronic device comprising:
a first electronic component comprising a first pad area including first pads and second pads spaced apart from the first pads, wherein a number of first pads is greater than a number of the second pads;
a second electronic component comprising:
first bumps electrically connected to the first pads; and
second bumps electric connected to the second pads, wherein each of the second bumps has a bonding area greater than a bonding area of each of the first bumps; and

a conductive adhesive layer disposed between the first electronic component and the second electronic component to electrically connect the first pads to the first lumps, wherein
each of the second bumps has a thickness greater than a thickness of each of the first bumps.

16. An electronic device comprising:
a display panel comprising a display area and a pad area adjacent to the display area, the pad area comprising first pads and second pads, each of the second pads having a greater surface area than a surface area of each of the first pads;
a driving chip comprising:
first bumps electrically connected to the first pads; and
second bumps electrically connected to the second pads; and

an anisotropic conductive adhesive layer disposed between the display panel and the driving chip to electrically connect the first pads to the first bumps, wherein each of the second pads has a thickness greater than a thickness of each of the first pads.

17. The electronic device of claim 16 , wherein
a plurality of pixels are disposed in the display area,
the display panel comprises signal lines that electrically connect the first pads to the plurality of pixels, and
the driving chip provides data signals to the plurality of pixels through the signal lines.

18. The electronic device of claim 16 , wherein
the first pads define a plurality of pad rows disposed in a first direction,
each of the plurality of pad rows comprise corresponding pads of the first pads,
the corresponding pads of the first pads are disposed in a second direction intersecting the first direction, and
the second pads define a pad row disposed in the second direction,
wherein an interval between the pad row closest to the pad row of the second pads among the plurality of pad rows of the first pads and the pad row of the second pads is greater than an interval between the plurality of pad rows of the first pads.

19. The electronic device of claim 18 , wherein the conductive adhesive layer comprises:
an adhesive layer; and
a single layer of a plurality of conductive balls included in the adhesive layer.

20. The electronic device of claim 19 , wherein
the plurality of conductive balls overlap the plurality of pad rows of the first pads, and
none of the plurality of conductive balls are disposed on an area between the pad row of the first pads that is closest to the pad row of the second pads and the pad row of the second pads.

Assignees

• Samsung Display Co Ltd

Inventors

• Cho Youngmin
• Kim Hongam

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title