Connection body

Patent metadata

Field	Value
Publication number	US-9960138-B2
Application number	US-201715584609-A
Country	US
Kind code	B2
Filing date	May 2, 2017
Priority date	Feb 3, 2014
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

Even in case of conductive particles being clamped between stepped sections of substrate electrodes and electrode terminals, conductive particles sandwiched between each main surface of the substrate electrodes and electrode terminals are sufficiently compressed, ensuring electrical conduction. An electronic component is connected to a circuit substrate via an anisotropic conductive adhesive agent, on respective edge-side areas of substrate electrodes of the circuit substrate and electrode terminals of the electronic component, stepped sections are formed and abutted, conductive particles are sandwiched between each main surface and stepped sections of the substrate electrodes and electrode terminals; the conductive particles and stepped sections satisfy formula, a+b+c≤0.8 D (1), wherein a is height of the stepped section of the electrode terminals, b is height of the stepped section of the substrate electrodes, c is gap distance between each stepped sections and D is diameter of conductive particles.

First claim

The invention claimed is:

1. A connection body comprising:
a circuit substrate; and
an electronic component connected onto the circuit substrate via an anisotropic conductive adhesive agent;
wherein the circuit substrate has substrate electrodes formed thereon and the electronic component has electrode terminals formed thereon, both of which having stepped sections formed on respective edge-side areas;
wherein conductive particles contained by the anisotropic conductive adhesive agent are sandwiched between main surfaces of the substrate electrodes and the electrode terminals; and
wherein the conductive particles and each of the stepped sections of the substrate electrodes and the electrode terminals satisfy the following formula (1):
a+b+c≤ 0.8 D   (1)

wherein a is a height of the stepped section of the electrode terminals, b is a height of the stepped section of the substrate electrodes, c is a gap distance between each of the stepped sections and D is a diameter of the conductive particles.

2. The connection body according to claim 1 , wherein the conductive particles and each of the stepped sections of the substrate electrodes and the electrode terminals satisfy the following formula (2):
c≤1 μm  (2).

3. The connection body according to claim 1 , wherein the anisotropic conductive adhesive agent is formed in a film form, and
wherein the conductive particles are regularly arranged or individually separated.

4. The connection body according to claim 1 , wherein the conductive particles are sandwiched between the stepped sections formed on respective edge-side areas of the substrate electrodes and the electrode terminals.

5. A method for manufacturing a connection body comprising:
a connecting step of connecting an electronic component onto a circuit substrate via an anisotropic conductive adhesive agent;
wherein the circuit substrate has substrate electrodes formed thereon and the electronic component has electrode terminals formed thereon, both of which having stepped sections formed on respective edge-side areas;
wherein conductive particles contained by the anisotropic conductive adhesive agent are sandwiched between main surfaces of the substrate electrodes and the electrode terminals; and
wherein the conductive particles and each of the stepped sections of the substrate electrodes and the electrode terminals satisfy the following formula (1): a+b+c≤0.8D (1)
wherein a is a height of the stepped section of the electrode terminals, b is a height of the stepped section of the substrate electrodes, c is a gap distance between each of the stepped sections, and D is a diameter of the conductive particles.

6. An electronic device comprising a connection body, wherein the connection body is the connection body according to claim 1 .

7. An electronic device comprising a connection body, wherein the connection body is the connection body according to claim 2 .

8. An electronic device comprising a connection body, wherein the connection body is the connection body according to claim 3 .

9. An electronic device comprising a connection body, wherein the connection body is the connection body according to claim 4 .

10. The electronic device according to claim 6 , wherein the electronic device is a display device.

11. The electronic device according to claim 7 , wherein the electronic device is a display device.

12. The electronic device according to claim 8 , wherein the electronic device is a display device.

13. The electronic device according to claim 9 , wherein the electronic device is a display device.

Assignees

• Dexerials Corp

Inventors

• SARUYAMA Kenichi
• Akutsu Yasushi

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title