Articles containing copper nanoparticles and methods for production and use thereof

Patent metadata

Field	Value
Publication number	US-9797032-B2
Application number	US-201514691305-A
Country	US
Kind code	B2
Filing date	Apr 20, 2015
Priority date	Jul 30, 2009
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material.

First claim

What is claimed is the following:

1. A method comprising:
providing a plurality of copper nanoparticles;
wherein the plurality of copper nanoparticles are less than about 20 nm in size;

mixing the plurality of copper nanoparticles with a matrix material; and
applying pressure to at least partially fuse the plurality of copper nanoparticles together to form a nanoparticle network that remains disposed in the matrix material,
wherein applying pressure comprises press molding a mixture of copper nanoparticles and the matrix material.

2. The method of claim 1 , wherein the plurality of copper nanoparticles further comprise a surfactant system.

3. The method of claim 2 , wherein the surfactant system comprises a bidentate diamine and one or more C6-C18 alkylamines.

4. The method of claim 1 , wherein the plurality of copper nanoparticles range between about 1 nm and about 10 nm in size.

5. The method of claim 1 , wherein the plurality of copper nanoparticles range between about 1 nm and about 5 nm in size.

6. The method of claim 1 , further comprising:
curing the matrix material.

7. The method of claim 1 , wherein the matrix material is selected from the group consisting of a polymer matrix, a rubber matrix, a glass matrix, a ceramic matrix and a metal matrix.

8. The method of claim 1 , further comprising:
applying heat to at least partially fuse the plurality of copper nanoparticles together to form the nanoparticle network.

9. The method of claim 1 , wherein the nanoparticle network defines an electrically conductive percolation pathway in the matrix material.

10. A method comprising:
providing a plurality of copper nanoparticles;
wherein the plurality of copper nanoparticles are less than about 20 nm in size;

mixing the plurality of copper nanoparticles with a matrix material; and
applying pressure to at least partially fuse the plurality of copper nanoparticles together to form a nanoparticle network;
wherein applying pressure comprises extruding a mixture of copper nanoparticles and the matrix material.

11. The method of claim 10 , wherein the plurality of copper nanoparticles further comprise a surfactant system.

12. The method of claim 10 , wherein the surfactant system comprises a bidentate diamine and one or more C6-C18 alkylamines.

13. The method of claim 10 , wherein the plurality of copper nanoparticles range between about 1 nm and about 10 nm in size.

14. The method of claim 10 , wherein the plurality of copper nanoparticles range between about 1 nm and about 5 nm in size.

15. The method of claim 10 , further comprising:
curing the matrix material.

16. The method of claim 10 , wherein the matrix material is selected from the group consisting of a polymer matrix, a rubber matrix, a glass matrix, a ceramic matrix and a metal matrix.

17. The method of claim 10 , further comprising:
applying heat to at least partially fuse the plurality of copper nanoparticles together to form the nanoparticle network.

18. The method of claim 10 , wherein the nanoparticle network defines an electrically conductive percolation pathway in the matrix material.

Assignees

• Lockheed Corp

Inventors

• Bedworth Peter V
• Zinn Alfred A

Classifications

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/30

  Die-attach connectors · CPC title

• B22F1/054

  Nanosized particles · CPC title

• H01B1/16

  the conductive material comprising metals or alloys · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title