Low dielectric resin substrate

Patent metadata

Field	Value
Publication number	US-11802192-B2
Application number	US-202117346897-A
Country	US
Kind code	B2
Filing date	Jun 14, 2021
Priority date	Jun 30, 2020
Publication date	Oct 31, 2023
Grant date	Oct 31, 2023

Abstract

The present invention is a low dielectric resin substrate, which is a composite including an annealed quartz glass cloth and an organic resin, where the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m2). This provides a resin substrate that includes a quartz glass cloth which has a low dielectric loss tangent and which is also excellent in tensile strength.

First claim

The invention claimed is:

1. A low dielectric resin substrate, which is a composite comprising an annealed quartz glass cloth and an organic resin, wherein
the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m 2 ).

2. The low dielectric resin substrate according to claim 1 , further comprising a silica powder having a dielectric loss tangent of less than 0.0010 at 10 GHz, and an average particle size of 0.1 to 30 μm.

3. The low dielectric resin substrate according to claim 2 , wherein the organic resin is a thermoplastic resin.

4. The low dielectric resin substrate according to claim 3 , wherein the thermoplastic resin is one or more thermoplastic resins selected from polyphenylene ether, polyether ether ketone, polyether ketone, polyether sulfone, and fluorine resin.

5. The low dielectric resin substrate according to claim 2 , wherein the organic resin is a thermosetting resin.

6. The low dielectric resin substrate according to claim 5 , wherein the thermosetting resin is one or more thermosetting resins selected from epoxy resin, allylated epoxy resin, allylated polyphenylene ether resin, maleimide resin, bismaleimide resin, cyanate resin, and cyclopentadiene-styrene copolymer resin.

7. The low dielectric resin substrate according to claim 1 , wherein the organic resin is a thermoplastic resin.

8. The low dielectric resin substrate according to claim 7 , wherein the thermoplastic resin is one or more thermoplastic resins selected from polyphenylene ether, polyether ether ketone, polyether ketone, polyether sulfone, and fluorine resin.

9. The low dielectric resin substrate according to claim 1 , wherein the organic resin is a thermosetting resin.

10. The low dielectric resin substrate according to claim 9 , wherein the thermosetting resin is one or more thermosetting resins selected from epoxy resin, allylated epoxy resin, allylated polyphenylene ether resin, maleimide resin, bismaleimide resin, cyanate resin, and cyclopentadiene-styrene copolymer resin.

Assignees

• Shinetsu Chemical Co

Inventors

• Shiobara Toshio
• Taguchi Yusuke
• Itokawa Hajime

Classifications

• C08K3/40 Primary

  Glass · CPC title

• C08F16/24

  Monomers containing halogen · CPC title

• C08K3/36

  Silica · CPC title

• B32B5/024 Primary

  Woven fabric · CPC title

• C03C3/06 Primary

  with more than 90% silica by weight, e.g. quartz {(C03C3/045 takes precedence)} · CPC title