Apparatus and method for treating substrate
US-2021013064-A1 · Jan 14, 2021 · US
US11798799B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11798799-B2 |
| Application number | US-202117397088-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 9, 2021 |
| Priority date | Aug 9, 2021 |
| Publication date | Oct 24, 2023 |
| Grant date | Oct 24, 2023 |
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A cleaning apparatus for cleaning a substrate includes a lamp for emitting ultraviolet radiation in an irradiation region; a housing that houses the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water outlet, the water flow path extending in the irradiation region; an upper reflector extending along and above the lamp; and a lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector at least partially define the irradiation region and reflect ultraviolet radiation toward the water flow path, and wherein the lower reflector shields the substrate from ultraviolet radiation emitted by the lamp.
Opening claim text (preview).
The invention claimed is: 1. A cleaning apparatus for cleaning a substrate, comprising: a lamp configured to emit ultraviolet radiation in an irradiation region; a housing that houses the lamp, the housing defining a cooling chamber surrounding the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water outlet, the water flow path extending in the irradiation region; an upper reflector within the cooling chamber of the housing extending along and above the lamp; and a lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector are configured to at least partially define the irradiation region and to reflect ultraviolet radiation emitted by the lamp toward the water flow path, and wherein the lower reflector is configured to shield the substrate from ultraviolet radiation emitted by the lamp. 2. The cleaning apparatus of claim 1 , further comprising a cleaning chamber enclosing an interior volume, wherein the cleaning apparatus is enclosed in the interior volume. 3. The cleaning apparatus of claim 1 , wherein the lamp operates between 80 to 90 watts. 4. The cleaning apparatus of claim 1 , wherein at least one of the upper reflector and the lower reflector has a length that is equal or greater than a length of the lamp. 5. The cleaning apparatus of claim 1 , further comprising a substrate support for supporting the substrate below the water outlet in the substrate processing region, wherein the lower reflector is disposed between the water outlet and the substrate support. 6. The cleaning apparatus of claim 5 , wherein the substrate support is configured to rotate the substrate. 7. The cleaning apparatus of claim 1 , wherein the housing has an inlet and an outlet in fluid communication with the cooling chamber, the cooling chamber configured to route a cooling fluid between the inlet and the outlet and over the lamp. 8. The cleaning apparatus of claim 7 , wherein the cooling fluid comprises cool dry air. 9. The cleaning apparatus of claim 7 , wherein the housing includes an upper cover and a lower cover sealed to the upper cover, wherein the inlet and the outlet are formed in the upper cover. 10. The cleaning apparatus of claim 9 , wherein the upper cover is formed from PTFE and the lower cover is formed from quartz. 11. The cleaning apparatus of claim 1 , wherein a horizontal spacing between the water outlet and the housing is 0.5 inch to 4 inches. 12. The cleaning apparatus of claim 11 , wherein the horizontal spacing is between 1 inch and 2 inches. 13. The cleaning apparatus of claim 1 , wherein the upper reflector and the lower reflector are comprised of aluminum. 14. The cleaning apparatus of claim 1 , wherein the water outlet is configured to translate horizontally relative to the substrate processing region. 15. A method of cleaning a substrate masked with a photoresist, the method comprising: flowing ultraviolet-irradiated ozonated water onto the substrate while shielding the substrate from ultraviolet radiation, wherein flowing ultraviolet-irradiated ozonated water onto the substrate includes passing ozonated water along a water flow path subjected to ultraviolet radiation in an irradiation region, the ultraviolet radiation being emitted by a lamp in a housing, and wherein the water flow path is defined by a water deflector spaced below the housing and having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water into a substrate processing region beneath the water deflector. 16. The method of claim 15 , further comprising rotating the substrate while flowing the ultraviolet-irradiated ozonated water onto the substrate. 17. The method of claim 15 , further comprising: horizontally translating the water outlet with respect to the substrate while flowing the ultraviolet-irradiated ozonated water onto the substrate. 18. The method of claim 15 , wherein the irradiation region is at least partially defined by a lower reflector and an upper reflector, the upper reflector positioned above the water deflector and the lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector reflect ultraviolet radiation toward the water flow path, and the lower reflector shields the substrate from ultraviolet radiation. 19. A cleaning apparatus for cleaning a substrate, comprising: a lamp configured to emit ultraviolet radiation in an irradiation region; a housing that houses the lamp, the housing defining a cooling chamber surrounding the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water outlet, the water flow path extending in the irradiation region; an upper reflector within the cooling chamber of the housing extending along and above the lamp; a lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector are configured to at least partially define the irradiation region and to reflect ultraviolet radiation emitted by the lamp toward the water flow path, and wherein the lower reflector is configured to shield the substrate from ultraviolet radiation emitted by the lamp; and a substrate support for supporting the substrate below the lower reflector in the substrate processing region, the substrate support configured to rotate the substrate, wherein the water deflector is configured to translate horizontally while flowing ultraviolet-irradiated ozonated water into the substrate processing region. 20. The cleaning apparatus of claim 19 , further comprising a cleaning chamber enclosing an interior volume, wherein the cleaning apparatus is enclosed in the interior volume.
by wet cleaning only (H10P70/52 takes precedence) · CPC title
surrounding a central transfer chamber · CPC title
for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title
the liquid being ozonated · CPC title
Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning · CPC title
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