Electric field grading protection design surrounding a galvanic or capacitive isolator

Patent metadata

Field	Value
Publication number	US-11798741-B2
Application number	US-202217945028-A
Country	US
Kind code	B2
Filing date	Sep 14, 2022
Priority date	May 29, 2020
Publication date	Oct 24, 2023
Grant date	Oct 24, 2023

Abstract

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

First claim

What is claimed is:

1. A micro-isolator with enhanced isolation breakdown voltage, comprising:
a first isolator element in a first plane, wherein the first isolator element comprises a first coil or a first plate;
a second isolator element in a second plane, wherein the second isolator element comprises a second coil or a second plate;
a first dielectric material, comprising a polymer, disposed between the first and second isolator elements;
a first electrically floating ring disposed in the first plane and surrounding the first isolator element;
a second electrically floating ring concentric with the first electrically floating ring; and
a third electrically floating ring concentric with the second electrically floating ring, wherein a first gap distance between the third electrically floating ring and the second electrically floating ring differs from a second gap distance between the second electrically floating ring and the first electrically floating ring.

2. The micro-isolator of claim 1 , wherein the first isolator element and the second isolator element are separated in a vertical dimension and the first isolator element and the first electrically floating ring are separated in a second dimension.

3. The micro-isolator of claim 1 , further comprising a second dielectric material different than the first dielectric material separating the first isolator element from the first electrically floating ring.

4. The micro-isolator of claim 3 , wherein the second dielectric material encapsulates the first isolator element.

5. The micro-isolator of claim 1 , wherein the first isolator element has a first height, and wherein the first electrically floating ring has a second height less than the first height.

6. The micro-isolator of claim 1 , wherein the first electrically floating ring is a segmented ring.

7. The micro-isolator of claim 1 , wherein the first isolator element is configured to couple to a higher voltage than the second isolator element.

8. A micro-isolator with enhanced isolation breakdown voltage, comprising:
first and second isolator elements disposed in respective planes, wherein the first isolator element comprises a first coil or a first plate and the second isolator element comprises a second coil or a second plate;
a first dielectric material, comprising a polymer, disposed between the first and second isolator elements;
an electrically floating ring in-plane with and surrounding the first isolator element; and
a second dielectric material separating the first isolator element from the electrically floating ring,
wherein the second dielectric material encapsulates the first isolator element but not the electrically floating ring.

9. The micro-isolator of claim 8 , wherein the electrically floating ring is a first electrically floating ring, and wherein the micro-isolator further comprises a second electrically floating ring concentric with the first electrically floating ring.

10. The micro-isolator of claim 8 , wherein the first isolator element has a first height, and wherein the electrically floating ring has a second height less than the first height.

11. The micro-isolator of claim 8 , wherein the electrically floating ring comprises one or more gaps.

12. The micro-isolator of claim 8 , wherein the first isolator element is configured to couple to a higher voltage than the second isolator element.

13. The micro-isolator of claim 8 , wherein the first isolator element and the second isolator element are separated in a vertical dimension and the first isolator element and the electrically floating ring are separated in a second dimension.

14. A micro-isolator with enhanced isolation breakdown voltage, comprising:
a first isolator element in a first plane, comprising a first coil or a first plate;
a second isolator element in a second plane, comprising a second coil or a second plate;
a polymeric dielectric material disposed between the first and second isolator elements; and
first, second and third concentric electrically floating rings surrounding the first isolator element in the first plane;
wherein a first gap distance between the third electrically floating ring and the second electrically floating ring differs from a second gap distance between the second electrically floating ring and the first electrically floating ring.

15. The micro-isolator of claim 14 , wherein the first isolator element and the second isolator element are separated in a vertical dimension and the first isolator element and the first electrically floating ring are separated in a second dimension.

16. The micro-isolator of claim 14 , further comprising a second dielectric material different than the polymeric dielectric material separating the first isolator element from the first electrically floating ring.

17. The micro-isolator of claim 16 , wherein the second dielectric material encapsulates the first isolator element.

18. The micro-isolator of claim 14 , wherein the first isolator element has a first height, and wherein the first electrically floating ring has a second height less than the first height.

19. The micro-isolator of claim 14 , wherein the first electrically floating ring is a segmented ring.

20. The micro-isolator of claim 14 , wherein the first isolator element is configured to couple to a higher voltage than the second isolator element.

Assignees

• Analog Devices International Unlimited Co

Inventors

• Diaham Sombel
• Lambkin Paul
• Stenson Bernard Patrick
• Mcguinness Patrick M
• O'Sullivan Laurence B
• O'Brien Stephen

Classifications

• H10W20/497

  Inductive arrangements or effects of, or between, wiring layers · CPC title

• H10W20/496

  Capacitor integral with wiring layers · CPC title

• H10W20/423

  Shielding layers · CPC title

• H10W20/48

  Insulating materials thereof · CPC title

• H10W20/43

  Layouts of interconnections · CPC title