Method and device for estimating level of damage or lifetime expectation of power semiconductor module
US-2019285689-A1 · Sep 19, 2019 · US
US11796400B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11796400-B2 |
| Application number | US-202117172686-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 10, 2021 |
| Priority date | Feb 12, 2020 |
| Publication date | Oct 24, 2023 |
| Grant date | Oct 24, 2023 |
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A lifetime estimation system for estimating a lifetime of a heating source is provided in an apparatus for heating a target object using the heating source and performing a feedback control of a target object temperature using a temperature controller based on a temperature measurement value of the target object measured by a temperature measuring device. The temperature controller controls a power supplied to the heating source and performs a temperature control using a state space model to perform the feedback control of the temperature of the target object. The lifetime estimation system includes a temperature monitor unit that monitors the temperature measurement value of the target object, a hunting amount detection unit that detects a hunting amount in a stable region of the monitored temperature of the target object, and a lifetime estimation unit that estimates a lifetime of the heating source from the detected hunting amount.
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What is claimed is: 1. A lifetime estimation system for estimating a lifetime of a heating source in an apparatus for heating a target object using the heating source and performing a feedback control of a temperature of the target object using a temperature controller based on a temperature measurement value of the target object that is measured by a temperature measuring device, the temperature controller controlling a power supplied to the heating source and performing a temperature control using a state space model to perform the feedback control of the temperature of the target object, the lifetime estimation system comprising: a processor; and a memory storing instructions thereon, the instructions when executed by the processor cause the processor to: monitor the temperature measurement value of the target object that is measured by the temperature measuring device; detect a hunting amount in a stable region of the monitored temperature of the target object; and estimate the lifetime of the heating source from the detected hunting amount. 2. The lifetime estimation system of claim 1 , wherein the instructions when executed by the processor further cause the processor to obtain a relationship between the hunting amount and an output of the heating source and estimate the lifetime of the heating source from the relationship. 3. The lifetime estimation system of claim 1 , wherein the instructions when executed by the processor further cause the processor to preset a threshold for the hunting amount of the heating source and use the threshold as a reference for estimating the lifetime of the heating source. 4. The lifetime estimation system of claim 1 , wherein the heating source is an LED. 5. A lifetime estimation method for estimating a lifetime of a heating source in an apparatus for heating a target object using the heating source and performing a feedback control of a temperature of the target object using a temperature controller based on a temperature measurement value of the target that is measured by a temperature measuring device, the temperature controller controlling a power supplied to the heating source and performing temperature control using a state space model to perform the feedback control of the temperature of the target object, the lifetime estimation method comprising: monitoring the temperature measurement value of the target object that is measured by the temperature measuring device; detecting a hunting amount in a stable region of the monitored temperature of the target object, and estimating the lifetime of the heating source from the detected hunting amount. 6. The lifetime estimation method of claim 5 , wherein a relationship between the hunting amount and an output of the heating source is obtained, and the lifetime of the heating source is estimated from the relationship. 7. The lifetime estimation method of claim 5 , wherein a threshold for the hunting amount of the heating source is set in advance, and the threshold is used as a reference for estimating the lifetime of the heating source. 8. The lifetime estimation method of claim 5 , wherein the heating source is an LED. 9. The lifetime estimation method of claim 5 , wherein the temperature controller includes a heating system including the heating source that is set as a plant, and an observer that modeled from the plant, and the temperature controller performs the feedback control with a difference between the plant and the observer. 10. An inspection apparatus comprising: a stage on which a substrate having multiple electronic devices is placed; an inspection mechanism configured to inspect the electronic devices by bringing probes into electrical contact with the electronic devices formed on the substrate on the stage; a heating mechanism having a heating source for heating the electronic devices; a cooling mechanism having a cooling source for cooling the electronic devices; temperature measuring devices configured to respectively measure temperatures of the electronic devices; a temperature controller configured to control a power supplied to the heating source and perform temperature control using a state space model to perform a feedback control of the temperature of each of the electronic devices based on temperature measurement values measured by the temperature measuring devices; and a lifetime estimation system configured to estimate a lifetime of the heating source, wherein the lifetime estimation system includes: a processor; and a memory storing instructions thereon, the instructions when executed by the processor cause the processor to: monitor the temperature measurement values of the electronic devices measured by the temperature measuring devices; detect a hunting amount in a stable region of the monitored temperatures of the electronic devices; and estimate the lifetime of the heating source from the detected hunting amount. 11. The inspection apparatus of claim 10 , wherein the instructions when executed by the processor further cause the processor to obtain a relationship between the hunting amount and an output of the heating source, and estimate the lifetime of the heating source from the relationship. 12. The inspection apparatus of claim 10 , wherein the instructions when executed by the processor further cause the processor to preset a threshold for the hunting amount of the heating source and use the threshold as a reference for estimating the lifetime of the heating source. 13. The inspection apparatus of claim 10 , wherein the heating source is an LED. 14. The inspection apparatus of claim 10 , wherein each of the temperature measuring devices is a temperature measuring circuit installed in each of the electronic devices. 15. The inspection apparatus of claim 10 , wherein the temperature controller includes a heating system including the stage, the heating mechanism, and the cooling mechanism that is set as a plant and an observer that modeled from the plant, and the temperature controller performs the feedback control with a difference between the plant and the observer. 16. The inspection apparatus of claim 15 , wherein the temperature controller further includes: a controller configured to perform a control including a sliding mode control that outputs a control signal including a power signal to the plant and the observer based on the temperature measurement values of the electronic devices. 17. The inspection apparatus of claim 16 , wherein the controller includes: a sliding mode controller using a power supplied to the heating source as an operation amount; a cooling mode controller using a power supplied to the cooling source as an operation amount; and a switching controller configured to determine whether to output an output of the sliding mode controller alone as a first operation amount to the heating source or to use an output of the cooling mode controller as a second operation amount, based on a value of a nonlinear term between a linear term and the nonlinear term that are the output of the sliding mode controller. 18. The inspection apparatus of claim 17 , wherein the second operation amount is only the output of the cooling mode controller or a sum of the output of the sliding mode controller and the output of the cooling mode controller.
Measuring quantity of heat conveyed by flowing media, e.g. in heating systems (G01K17/02, G01K17/04 take precedence){e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device} · CPC title
arrangements for monitoring a plurality of temperatures, e.g. by multiplexing · CPC title
Testing · CPC title
Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title
Testing light-emitting diodes, laser diodes or photodiodes · CPC title
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