Stacked III-V semiconductor diode

US11784261B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11784261-B2
Application numberUS-202217667105-A
CountryUS
Kind codeB2
Filing dateFeb 8, 2022
Priority dateFeb 8, 2021
Publication dateOct 10, 2023
Grant dateOct 10, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A stacked III-V semiconductor diode comprising or consisting of GaAs, with a heavily n-doped cathode layer, a heavily p-doped anode layer, and a drift region arranged between the cathode layer and the anode layer with a dopant concentration of at most 8·10 15 cm −3 , and a layer thickness of at least 10 μm, wherein the cathode layer has a delta layer section with a layer thickness of 0.1 μm to 2 μm and a dopant concentration of at least 1·10 19 cm −3 .

First claim

Opening claim text (preview).

What is claimed is: 1. A stacked III-V semiconductor diode comprising GaAs, and comprising: a heavily n-doped cathode layer; a heavily p-doped anode layer; and a drift region arranged between the cathode layer and the anode layer with a dopant concentration of at most 8·10 15 cm −3 , a layer thickness of at least 10 μm, and a maximum of 100 μm, wherein the cathode layer has a first section of the cathode layer and a second section of the cathode layer, and the first section of the cathode layer is formed as a delta layer section with a layer thickness between 0.1 μm and 2 μm and a dopant concentration of at least 1·10 19 cm −3 , and wherein the second section of the cathode layer has a dopant concentration of less than 1·10 19 cm −3 and above 1·10 18 cm −3 . 2. The stacked III-V semiconductor diode according to claim 1 , wherein the delta layer section is materially adjacent to a metallic cathode contact layer. 3. The stacked III-V semiconductor diode according to claim 1 , wherein the second section of the cathode layer has a lower dopant concentration than the delta layer section. 4. The stacked III-V semiconductor diode according to claim 1 , wherein the second section of the cathode layer has the dopant concentration of above 2·10 18 cm −3 . 5. The stacked III-V semiconductor diode according to claim 1 , wherein the second section of the cathode layer has a layer thickness between 0.5 μm and 5 μm. 6. The stacked III-V semiconductor diode according to claim 1 , wherein the cathode layer has a transition layer section, wherein the transition layer section is arranged between the second section of the cathode layer and the drift region and has a layer thickness of at least 3 μm, and the transition layer section has a lower dopant concentration than the second section of the cathode layer and a higher dopant concentration than the drift region, and wherein the dopant concentration of the transition layer section has a dopant concentration gradient decreasing convexly or concavely or linearly or in a stepped manner in a direction of the drift region. 7. The stacked III-V semiconductor diode according to claim 1 , wherein the anode layer has a first section of the anode layer and a second section of the anode layer arranged between the first section of the anode layer and the drift region, and wherein a dopant concentration of the second section of the anode layer is less than a dopant concentration of the first section of the anode layer, or the dopant concentration of the second section of the anode layer is the same as the dopant concentration of the first section of the anode layer. 8. The stacked III-V semiconductor diode according to claim 7 , wherein the dopant concentration of the first section of the anode layer is at least 8·10 17 cm −3 and at most 8·10 18 cm −3 , and the dopant concentration of the second section of the anode layer is at least 1·10 17 cm −3 and at most 8·10 17 cm −3 . 9. The stacked III-V semiconductor diode according to claim 7 , wherein the anode layer has a transition section adjacent to the drift region, wherein the transition section has a dopant concentration gradient that decreases convexly or concavely or linearly or in a stepped manner in a direction of the drift region, and has a dopant concentration greater than the dopant concentration of the drift region that is p-doped and less than the dopant concentration of the second section of the anode layer. 10. The stacked III-V semiconductor diode according to claim 7 , wherein the second section of the anode layer has a lower doping than the second section of the cathode layer. 11. The stacked III-V semiconductor diode according to claim 7 , wherein the dopant concentration of the first section of the anode layer is at most 4·10 18 cm −3 . 12. The stacked III-V semiconductor diode according to claim 1 , wherein the delta layer section has Te or Se as a dopant. 13. The stacked III-V semiconductor diode according to claim 1 , wherein the layer thickness of the drift region is at most 80 μm. 14. The stacked III-V semiconductor diode according to claim 1 , wherein the layer thickness of the first section of the cathode layer is between 0.1 μm and 1 μm. 15. The stacked III-V semiconductor diode according to claim 1 , wherein the dopant concentration of the first section of the cathode layer is at least 2·10 19 cm −3 . 16. The stacked III-V semiconductor diode according to claim 1 , wherein the dopant concentration of the second section of the cathode layer is above 5·10 18 cm −3 . 17. The stacked III-V semiconductor diode according to claim 1 , wherein the second section of the cathode layer has a layer thickness between 0.5 μm and 1.5 μm. 18. The stacked III-V semiconductor diode according to claim 1 , wherein the second section of the cathode layer has a layer thickness between 0.5 μm and 2.5 μm.

Assignees

Inventors

Classifications

  • Cathode regions of diodes · CPC title

  • Anode regions of diodes · CPC title

  • further characterised by the dopants · CPC title

  • Impurity distributions or concentrations · CPC title

  • Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions · CPC title

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What does patent US11784261B2 cover?
A stacked III-V semiconductor diode comprising or consisting of GaAs, with a heavily n-doped cathode layer, a heavily p-doped anode layer, and a drift region arranged between the cathode layer and the anode layer with a dopant concentration of at most 8·10 15 cm −3 , and a layer thickness of at least 10 μm, wherein the cathode layer has a delta layer section with a layer thickness of 0.1 μm to…
Who is the assignee on this patent?
3 5 Power Electronics Gmbh, Azur Space Solar Power Gmbh
What technology area does this patent fall under?
Primary CPC classification H10D8/50. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 10 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).