Resin composition

Patent metadata

Field	Value
Publication number	US-11773301-B2
Application number	US-201917282696-A
Country	US
Kind code	B2
Filing date	Oct 4, 2019
Priority date	Oct 5, 2018
Publication date	Oct 3, 2023
Grant date	Oct 3, 2023

Abstract

A resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) an anionic polymerization inhibitor including at least one borate ester compound.

First claim

What is claimed is:

1. A resin composition, comprising components (a) to (c) below:
(a) at least one 2-methylene-1,3-dicarbonyl compound,
(b) an initiator comprising at least one basic substance, and
(c) an anionic polymerization inhibitor comprising at least one borate ester compound;
wherein the 2-methylene-1,3-dicarbonyl compound is a compound comprising at least one structural unit represented by formula (I) below

2. The resin composition according to claim 1 , wherein the borate ester compound is at least one selected from the group consisting of triisopropyl borate, tri-t-butyl borate, and tri-o-tolyl borate.

3. The resin composition according to claim 1 , wherein the basic substance is an amine compound.

4. The resin composition according to claim 1 , wherein the basic substance is a tertiary amine compound.

5. The resin composition according to claim 1 , wherein the 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 or higher and 10,000 or lower.

6. A one-part adhesive comprising the resin composition according to claim 1 .

7. The one-part adhesive according to claim 6 , for electronic components.

8. The resin composition according to claim 2 , wherein the basic substance is an amine compound.

9. The resin composition according to claim 2 , wherein the basic substance is a tertiary amine compound.

10. The resin composition according to claim 2 , wherein the 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 or higher and 10,000 or lower.

11. A one-part adhesive comprising the resin composition according to claim 2 .

12. The one-part adhesive according to claim 11 , for electronic components.

Assignees

• Namics Corp

Inventors

• Sato Ayako
• Arai Fuminori

Classifications

• C09J135/02 Primary

  Homopolymers or copolymers of esters (C09J135/06, C09J135/08 take precedence) · CPC title

• C08F122/14 Primary

  Esters having no free carboxylic acid groups · CPC title

• C09J4/00

  Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} · CPC title

• C08F22/14 Primary

  Esters having no free carboxylic acid groups · CPC title

• C08F2/40

  using retarding agents · CPC title