Curable epoxy compositions
US-2019330411-A1 · Oct 31, 2019 · US
US11773222B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11773222-B2 |
| Application number | US-202117539454-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 1, 2021 |
| Priority date | Aug 25, 2021 |
| Publication date | Oct 3, 2023 |
| Grant date | Oct 3, 2023 |
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A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I) wherein n is 8 to 232, wherein R 1 is independently C 1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II) wherein x≥2, y≥2, and x/y is between 0.1 and 3, and R 2 , R 3 and R 4 are independently C 1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III) and 90 to 250 parts by mole of a curing agent represented by Formula (IV) wherein m is 7 to 230, wherein R 5 is independently C 1-3 alkyl group.
Opening claim text (preview).
What is claimed is: 1. A curable composition, comprising: 100 parts by mole of a first siloxane compound represented by Formula (I), wherein n is 8 to 232, wherein R 1 is independently C 1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II), wherein x≥2, y≥2, and x/y is between 0.1 and 3, wherein R 2 , R 3 and R 4 are independently C 1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III); and 90 to 250 parts by mole of a curing agent represented by Formula (IV), wherein m is 7 to 230, and R 5 is independently C 1-3 alkyl group 2. The curable composition as claimed in claim 1 , wherein the first siloxane compound represented by Formula (I) has a weight average molecular weight of 1,000 g/mol to 18,000 g/mol. 3. The curable composition as claimed in claim 1 , wherein the second siloxane compound represented by Formula (II) has a weight average molecular weight of 1,800 g/mol to 4,000 g/mol. 4. The curable composition as claimed in claim 1 , wherein the curing agent represented by Formula (IV) has a weight average molecular weight of 1,000 g/mol to 18,000 g/mol. 5. The curable composition as claimed in claim 1 , further comprising: a reaction accelerator, wherein the reaction accelerator has a weight percentage of 0.1 wt % to 1 wt %, based on the total weight of the first siloxane compound, the second siloxane compound, and the third siloxane compound. 6. The curable composition as claimed in claim 5 , wherein the reaction accelerator comprises quaternary phosphate, amine, or a combination thereof. 7. The curable composition as claimed in claim 1 , further comprising: an additive, wherein the additive has a weight percentage of 0.1 wt % to 5 wt %, based on the total weight of the first siloxane compound, the second siloxane compound, and the third siloxane compound. 8. The curable composition as claimed in claim 7 , wherein the additive comprises an adhesion promoter, antioxidant, defoamer, levelling agent, stabilizer, or a combination thereof. 9. An electronic device, comprising: a substrate; and a film covered on the substrate, wherein the film is prepared from the curable composition as claimed in claim 1 .
containing silicon bound to oxygen-containing groups · CPC title
containing less than 25 silicon atoms · CPC title
Amines; Quaternary ammonium compounds · CPC title
Esters of phosphoric acids, e.g. of H3PO4 · CPC title
containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence) · CPC title
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