Heat-dissipating component for mobile device

Patent metadata

Field	Value
Publication number	US-11770913-B2
Application number	US-202017083599-A
Country	US
Kind code	B2
Filing date	Oct 29, 2020
Priority date	Nov 8, 2019
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A heat-dissipating component for a mobile device includes a case body, a micro pump, and a heat dissipation tube plate. The case body has a vent hole and a positioning accommodation trough. The bottom of the positioning accommodation trough is in communication with the vent hole. The micro pump is disposed in the positioning accommodation trough and corresponds to the vent hole The heat dissipation tube plate has cooling fluid inside. One end of the heat dissipation tube plate is fixed on the positioning accommodation trough and contacts a heating element of the mobile device. The gas transmitted by the micro pump forms gas flow so as to perform heat exchange with heat absorbed by the heat dissipation tube plate, and the gas flow is discharged out through the vent hole.

First claim

What is claimed is:

1. A heat-dissipating component for a mobile device, comprising:
a case body having a vent hole and a positioning accommodation trough, wherein the positioning accommodation trough corresponds to the vent hole, and a bottom of the positioning accommodation trough is in communication with the vent hole;
a micro pump disposed in the positioning accommodation trough, wherein the micro pump corresponds to the vent hole in communication with the bottom of the positioning accommodation trough, whereby gas transmitted by the micro pump is discharged out through the vent hole during operation; and
a heat dissipation tube plate having cooling fluid inside, wherein one end of the heat dissipation tube plate is fixed on the positioning accommodation trough and contacts a heating element of the mobile device so as to perform liquid convective heat exchange with heat generated by the heating element;
wherein the gas transmitted by the micro pump forms gas flow so as to perform heat exchange with heat absorbed by the heat dissipation tube plate, and the gas flow is discharged out through the vent hole; and
wherein the heat-dissipating component further comprises a liquid pump, wherein the liquid pump is in communication with an inside of the heat dissipation tube plate, whereby the cooling fluid inside the heat dissipation tube plate is capable of being pumped and circulating so that heat exchange effect of the heat dissipation tube plate is accelerated.

2. The heat-dissipating component according to claim 1 , wherein the micro pump comprises:
a nozzle plate comprising a plurality of connecting elements, a suspension sheet, and a hollow hole, wherein the suspension sheet is capable of bending and vibrating, the plurality of connecting elements is connected to a periphery of the suspension sheet, and the hollow hole is formed at a center portion of the suspension sheet, wherein the suspension sheet is fixed by the plurality of connecting elements, and the plurality of connecting elements provides the suspension sheet with a flexible support, wherein a gas flow chamber is formed under the nozzle plate, and at least one gap is formed among the plurality of connecting elements and the suspension sheet;
a chamber frame stacked on the suspension sheet;
an actuator stacked on the chamber frame so as to be bent to vibrate reciprocatingly when the actuator is applied with a voltage;
an insulation frame stacked on the actuator; and
a conductive frame stacked on the insulation frame;
wherein a resonance chamber is formed among the actuator, the chamber frame, and the suspension sheet, wherein the actuator is driven to move the nozzle plate owing to a resonance effect, and the suspension sheet of the nozzle plate is bent to vibrate reciprocatingly, thereby making the gas flow through the at least one gap, enter into the gas flow chamber and then be discharged out, so as to achieve transmission of the gas.

3. The heat-dissipating component according to claim 2 , wherein the actuator comprises:
a piezoelectric carrier plate stacked on the chamber frame;
an adjusting resonance plate stacked on the piezoelectric carrier plate; and
a piezoelectric plate stacked on the adjusting resonance plate so as to drive the piezoelectric carrier plate and the adjusting resonance plate to bend and vibrate reciprocatingly when the piezoelectric plate is applied with a voltage.

4. The heat-dissipating component according to claim 1 , wherein the micro pump comprises:
an inlet plate having at least one inlet hole, at least one convergence trough corresponding to the at least one inlet hole, and a convergence chamber, wherein the at least one inlet hole is configured to guide a gas outside the micro pump to flow therein, and the at least one convergence trough is configured to guide the gas guided from the at least one inlet hole to be converged at the convergence chamber;
a resonance sheet having a perforation corresponding to the convergence chamber, wherein a periphery of the perforation is a movable portion; and
a piezoelectric actuator disposed correspondingly to the resonance sheet;
wherein the inlet plate, the resonance sheet and the piezoelectric actuator are arranged sequentially and stacked with each other, wherein a chamber space is formed between the resonance sheet and the piezoelectric actuator, so that when the piezoelectric actuator is driven, the gas outside the micro pump is guided into the micro pump through the at least one inlet hole of the inlet plate, is converged at the convergence chamber via the at least one convergence trough, and flows through the perforation of the resonance sheet, thereby allowing the movable portion of the resonance sheet to resonate with the piezoelectric actuator so as to transmit the gas.

5. The heat-dissipating component according to claim 4 , wherein the piezoelectric actuator comprises:
a suspension plate having a square shape, wherein the suspension plate is capable of bending and vibrating;
an outer frame disposed around a periphery of the suspension plate;
at least one supporting element connected between the suspension plate and the outer frame to provide a flexible support for the suspension plate; and
a piezoelectric element having a side length, wherein the side length of the piezoelectric element is smaller than or equal to a side length of the suspension plate, and the piezoelectric element is attached to a surface of the suspension plate so as to drive the suspension plate to bend and vibrate when the piezoelectric element is applied with a voltage.

6. The heat-dissipating component according to claim 4 , wherein the micro pump comprises:
a suspension plate having a first surface and a second surface, wherein the first surface has a protruding portion;
an outer frame disposed around a periphery of the suspension plate;
at least one supporting element connected between the suspension plate and the outer frame to provide a flexible support for the suspension plate; and
a piezoelectric element attached to the second surface of the suspension plate so as to apply a voltage to the suspension plate to drive the suspension plate to bend and vibrate;
wherein the at least one supporting element is formed between the suspension plate and the outer frame, and the suspension plate and the outer frame are not coplanar, and wherein a chamber space is kept between the first surface of the suspension plate and the resonance sheet.

7. The heat-dissipating component according to claim 4 , wherein the micro pump further comprises a first insulation sheet, a conductive sheet, and a second insulation sheet, wherein the inlet plate, the resonance sheet, the piezoelectric actuator, the first insulation sheet, the conductive sheet, and the second insulation sheet are sequentially stacked and assembled with each other.

8. The heat-dissipating component according to claim 1 , wherein the micro pump is a micro-electromechanical systems (MEMS) pump and comprises:
a first substrate having a plurality of inlets, wherein each of the plurality of inlets is a conical hole;
a first oxide layer stacked on the first substrate, wherein the first oxide layer has a plurality of convergence channels and a convergence chamber, wherein the plurality of convergence channels is in communication between the convergence chamber and the plurality of inlets;
a second substrate combined with the first substrate, comprising:
a silicon wafer layer, having:
an actuation portion being in a circular shape;
an outer peripheral portion being in a hollow ring shape and surrounding a periphery of the actuation portion;
a plurality of connection portions respectively connected between the actuation portion and the outer peripheral portion; an

Assignees

• Microjet Technology Co Ltd

Inventors

• Mou Hao-Jan
• Lin Ching-Sung
• Wu Chin-Chuan
• Chen Chih-Kai
• Han Yung-Lung
• Huang Chi-Feng
• Lee Wei-Ming

Classifications

• H05K7/20154 Primary

  Heat dissipaters coupled to components · CPC title

• F04B43/046

  with piezoelectric drive · CPC title

• F04B45/047

  Pumps having electric drive · CPC title

• H05K5/0213

  Venting apertures; Constructional details thereof · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title