Devices and methods for controlling wafer uniformity in plasma-based process

Patent metadata

Field	Value
Publication number	US-11769652-B2
Application number	US-201916525330-A
Country	US
Kind code	B2
Filing date	Jul 29, 2019
Priority date	Jul 31, 2018
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

Devices and methods for controlling wafer uniformity in plasma-based process is disclosed. In one example, a device for plasma-based processes is disclosed. The device includes: a housing defining a process chamber and a gas distribution plate (GDP) arranged in the process chamber. The housing comprises: a gas inlet configured to receive a process gas, and a gas outlet configured to expel processed gas. The GDP is configured to distribute the process gas within the process chamber. The GDP has a plurality of holes evenly distributed thereon. The GDP comprises a first zone and a second zone. The first zone is closer to the gas outlet than the second zone. At least one hole in the first zone is closed.

First claim

What is claimed is:

1. A device for plasma-based processes, comprising:
a housing defining a process chamber, wherein the housing comprises:
a gas inlet configured to receive a process gas, and
a gas outlet configured to expel a processed gas; and

a gas distribution plate (GDP) arranged in the process chamber and configured to distribute the process gas within the process chamber to achieve a silicon etching uniformity less than a threshold, the GDP comprising:
an annular body that extends laterally from an inner sidewall to an outer sidewall and consists of a first zone, a second zone and a third zone positioned within the annular body, wherein the first, second and third zones form the entirety of the annular body, wherein the third zone is bordered between the gas inlet and a first edge of the first zone, and the second zone is bordered between the gas inlet and a second edge of the first zone opposite the first edge of the first zone such that the first zone is disposed between the second and third zones, and wherein the first zone comprises seven holes that are filled such that no gas flows through the first zone, and wherein the first zone comprises approximately one-quarter of the annular body;
a first plurality of holes extending through the third zone of the annular body from lower surface of the annular body toward an upper surface of the annular body; and
a second plurality of holes extending through the second zone of the annular body from a lower surface of the annular body toward an upper surface of the annular body,
wherein each of the first plurality of holes have a circular cross-section with a first diameter and each of the second plurality of holes have a circular cross-section with a second diameter, and a minimum value of the first diameter of each of the first plurality of holes is greater than a maximum value of the second diameter of each of the second plurality of holes, and
wherein the first plurality of holes is smaller in number than that of the second plurality of holes.

2. The device of claim 1 , wherein an average cross-sectional area of the first plurality of holes is greater than an average cross-sectional area of the second plurality of holes.

3. The device of claim 1 , wherein the first zone is closer to the gas outlet than the second and third zones.

4. The device of claim 1 , wherein:
the second zone and the third zone are located on different sides of the gas inlet.

5. The device of claim 1 , wherein a total area of the first plurality of holes is the same as that of the second plurality of holes.

6. The device of claim 1 , wherein the first zone has no open holes.

7. The device of claim 1 , wherein:
the first diameter is in a range from about 0.48 mm to about 0.52 mm; and
the second diameter is in a range from about 0.4 mm to about 0.46 mm.

8. The device of claim 1 , wherein:
the second zone and the third zone are located on different sides of the gas inlet;
the third zone comprises a first plurality of holes having a first average cross-sectional area;
the second zone comprises a second plurality of holes having a second average cross-sectional area that is less than the first cross-sectional average area.

9. A device for plasma-based processes, comprising:
a housing defining a process chamber, wherein the housing comprises:
a gas inlet configured to receive a process gas, and
a gas outlet configured to expel a processed gas; and

a gas distribution plate (GDP) arranged in the process chamber and configured to distribute the process gas within the process chamber to achieve a silicon etching uniformity less than 10%, the GDP comprising:
an annular body that extends laterally from an inner sidewall to an outer sidewall and consists of a first zone, a second zone and a third zone positioned within the annular body, wherein the first, second and third zones form the entirety of the annular body, wherein the third zone is bordered between the gas inlet and a first edge of the first zone, and the second zone is bordered between the gas inlet and a second edge of the first zone opposite the first edge of the first zone such that the first zone is disposed between the second and third zones, and wherein the first zone comprises seven holes that are filled such that no gas flows through the first zone, and wherein the first zone comprises approximately one-quarter of the annular body;
a first plurality of holes extending through the third zone of the annular body from lower surface of the annular body toward an upper surface of the annular body, wherein each of the first plurality of holes have a circular cross section with a first diameter; and
a second plurality of holes extending through the second zone of the annular body from a lower surface of the annular body toward an upper surface of the annular body, wherein each of the second plurality of holes have a circular cross section with a second diameter,
wherein the first diameter of each of the first plurality of holes is in the range of 0.48 to 0.52 millimeters (mm) and the second diameter of each of the second plurality of holes is in the range of 0.4 to 0.46 mm, and
wherein the first plurality of holes is smaller in number than that of the second plurality of holes.

10. The device of claim 9 , wherein the second zone and the third zone are located on different sides of the gas inlet.

11. The device of claim 10 , wherein the first zone has no open holes.

12. The device of claim 10 , wherein a total cross-sectional area of the first plurality of holes in the third zone is the same as a total cross-sectional area of the second plurality of holes in the second zone.

13. The device of claim 10 , wherein:
the first average distance of between the first plurality of holes and the position of the gas outlet is shorter than a second average distance between the second plurality of holes and the position of the gas outlet.

14. A device for plasma-based processes, comprising:
a housing defining a process chamber, wherein the housing comprises:
a gas inlet configured to receive a process gas, and
a gas outlet configured to expel a processed gas; and

a gas distribution plate (GDP) arranged in the process chamber and configured to distribute the process gas within the process chamber to achieve a silicon etching uniformity less than a threshold, the GDP comprising:
an annular body that extends laterally from an inner sidewall to an outer sidewall and consists of a first zone, a second zone and a third zone positioned within the annular body, wherein the first, second and third zones form the entirety of the annular body, wherein the third zone is bordered between the gas inlet and a first edge of the first zone, and the second zone is bordered between the gas inlet and a second edge of the first zone opposite the first edge of the first zone such that the first zone is disposed between the second and third zones, and wherein the first zone comprises a plurality of holes that are filled such that no gas flows through the first zone, and wherein the first zone comprises approximately one-quarter of the annular body;
a first plurality of holes extending through the third zone of the annular body from lower surface of the annular body toward an upper surface of the annular body, wherein each of the first plurality of holes have a circular cross section with a first diameter; and
a second plurality of holes extending through the second zone of the annular body from a lower surface of the annular body toward an upper surface of the annular body, wherein each of the second plurality of holes have a circular cross section with a s

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Jr-Sheng
• Li An-Chi
• Huang Shih-Che
• Hsu Chih-Hsien
• Huang zhi-hao
• Wang Ming Chih
• Chiang Yu-Pei
• Chen chun yan

Classifications

• H10P72/0421

  for drying etching · CPC title

• H01J37/32449 Primary

  Gas control, e.g. control of the gas flow · CPC title

• G06F30/00

  Computer-aided design [CAD] · CPC title

• H01J37/3211

  Antennas, e.g. particular shapes of coils · CPC title

• H01J2237/3341

  Reactive etching · CPC title