Coil electronic component

Patent metadata

Field	Value
Publication number	US-11769624-B2
Application number	US-201916593709-A
Country	US
Kind code	B2
Filing date	Oct 4, 2019
Priority date	Dec 20, 2018
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A coil electronic component includes a body including a coil portion disposed therein, and including a plurality of magnetic particles, and external electrodes connected to the coil portion. The body includes an internal region and a protective layer disposed on a surface of the internal region. A first particle of the plurality of magnetic particles included in the protective layer includes an oxide film disposed on a surface of the first particle, and a second particle, having a size greater than a size of the first particle, of the plurality of magnetic particles includes a coating layer disposed on a surface of the second particle and having a composition different from a composition of the oxide film.

First claim

What is claimed is:

1. A coil electronic component, comprising:
a body including a coil portion disposed therein, and including a plurality of magnetic particles; and
external electrodes connected to the coil portion,
wherein the body includes an internal region and a protective layer disposed on a surface of the internal region, and
wherein a first particle of the plurality of magnetic particles included in the protective layer includes an oxide film disposed on a surface of the first particle, and a second particle, having a size greater than a size of the first particle, of the plurality of magnetic particles includes a coating layer disposed on a surface of the second particle, the coating layer having a composition different from a composition of the oxide film,
the oxide film is in contact with the first particle and the coating layer is in contact with the second particle,
the coating layer disposed on the surface of the second particle includes a phosphorus element, and
the oxide film of the first particle does not include a phosphorus element.

2. The coil electronic component of claim 1 , wherein the coating layer includes glass.

3. The coil electronic component of claim 1 , wherein a thickness of the coating layer is 10 to 60 nm.

4. The coil electronic component of claim 1 , wherein the first particle includes pure iron.

5. The coil electronic component of claim 1 , wherein the first particle has a diameter of 5 μm or less.

6. The coil electronic component of claim 1 , wherein the second particle includes an Fe-based alloy.

7. The coil electronic component of claim 1 , wherein the second particle has a diameter of 10 to 25 μm.

8. The coil electronic component of claim 1 , wherein a thickness of the protective layer is 4 to 40 μm.

9. The coil electronic component of claim 1 , wherein the oxide film includes an oxide including a metal component included in the first particle.

10. The coil electronic component of claim 1 , wherein a thickness of the oxide film is 200 nm or less.

11. The coil electronic component of claim 1 , wherein a partial particle of the plurality of magnetic particles included in the internal region includes an oxide film disposed on a surface of the partial particle.

12. The coil electronic component of claim 11 , wherein the oxide film in the internal region has a thickness less than a thickness of the oxide film of the protective layer.

13. The coil electronic component of claim 11 , wherein an amount of oxides of the oxide film included in a unit volume of the protective layer is greater than an amount of oxides of the oxide film included in a unit volume of the internal region.

14. The coil electronic component of claim 1 , wherein a thickness of the oxide film of the protective layer decreases in a direction from the protective layer to the internal region.

15. The coil electronic component of claim 1 , wherein, when the protective layer includes two regions having a same thickness as each other, a thickness of the oxide film in a region adjacent to a surface of the body is greater than a thickness of the oxide film in a region adjacent to the internal region.

16. The coil electronic component of claim 1 , wherein the coating layer disposed on the surface of the second particle has a multilayer structure including a P-based inorganic coating layer and an atomic layer deposition layer.

17. A coil electronic component, comprising:
a body including a coil portion disposed therein, and including a plurality of magnetic particles; and
external electrodes connected to the coil portion,
wherein the plurality of magnetic particles comprises first partial particles disposed adjacent to a surface of the body and including oxide films directly disposed on respective surfaces of the first partial particles, and second partial particles disposed adjacent to an internal region of the body and including oxide films directly disposed on respective surfaces of the second partial particles, and
an average thickness of the oxide films of the first partial particles adjacent to the surface of the body is greater than an average thickness of the oxide films of the second partial particles adjacent to the internal region of the body, wherein each of the oxide films of the first partial particles adjacent to the surface of the body and the oxide films of the second partial particles adjacent to the internal region of the body is an only oxide film disposed on a corresponding particle.

18. The coil electronic component of claim 17 , wherein at least one of the first partial particles or at least one of the second partial particles has a diameter of 5 μm or less.

19. The coil electronic component of claim 17 , wherein a thickness of the oxide film disposed on at least one of the first partial particles or at least one of the second partial particles is 200 nm or less.

Assignees

• Samsung Electro Mech

Inventors

• Lee Young Il
• Yeo Jeong Gu
• Hwang Ji Hoon
• Shin Myoung Ki
• Moon Byeong Cheol

Classifications

• H01F27/327 Primary

  Encapsulating or impregnating (encapsulating coil and core H01F27/022) · CPC title

• H01F27/2804

  Printed windings · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01F5/00 Primary

  Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title