Removable contactless probe

Patent metadata

Field	Value
Publication number	US-11768225-B2
Application number	US-202117361475-A
Country	US
Kind code	B2
Filing date	Jun 29, 2021
Priority date	Jun 29, 2021
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

First claim

What is claimed is:

1. A system, said system comprising:
a printed circuit board with a microstrip, wherein said printed circuit board has a first surface, wherein said first surface is on a first plane, and wherein said microstrip is on said first surface of said printed circuit board;
a conductive structure surrounding said microstrip, wherein said conductive structure extends along a second plane, and wherein said second plane is substantially perpendicular to said first plane;
a probe lead in communication with said conductive structure;
a first contact pad electrically connected to said conductive structure; and
a second contact pad electrically connected to said conductive structure.

2. The system of claim 1 , wherein:
said conductive structure is at least partially embedded in said printed circuit board.

3. The system of claim 1 , further comprising:
an enclosure of said conductive structure.

4. The system of claim 1 , further comprising:
a removal facilitation handle connected to said conductive structure.

5. The system of claim 1 , further comprising:
a probe landing pad connected to said conductive structure.

6. The system of claim 1 , further comprising:
a clamping structure connected to said conductive structure.

7. The system of claim 6 , wherein:
said probe lead communicates with said conductive structure via said clamping structure.

8. The system of claim 1 , further comprising:
an additional conductive structure surrounding an additional microstrip.

9. The system of claim 8 , further comprising:
an additional probe lead in communication with said additional conductive structure.

10. The system of claim 1 , wherein:
said conductive structure, said first contact pad, and said second contact pad extend above a surface of said printed circuit board.

11. A method, said method comprising:
surrounding a microstrip with a conductive structure to form a first portion, wherein said conductive structure extends along a structure plane;
embedding said first portion in a printed circuit board, wherein said printed circuit board has a surface, wherein said surface is on a surface plane, wherein said microstrip is on said surface of said printed circuit board, and wherein said surface plane is substantially perpendicular to said structure plane;
connecting, electrically, a first contact pad and a second contact pad to said conductive structure; and
extending a second portion above said surface of said printed circuit board.

12. The method of claim 11 , further comprising:
producing said second portion via additive manufacturing.

13. The method of claim 11 , further comprising:
encasing said second portion in an enclosure.

14. The method of claim 11 , further comprising:
connecting a probe lead to said conductive structure.

15. The method of claim 11 , further comprising:
compensating for a signal delay.

16. A method, said method comprising:
providing a near field structure proximate a surface of a printed circuit board, wherein said surface is on a first plane, wherein said near field structure comprises:
a conductive structure surrounding a microstrip on said printed circuit board, wherein said microstrip is on said surface of said printed circuit board, wherein said conductive structure extends along a second plane, and wherein said second plane is substantially perpendicular to said first plane;
a first contact pad electrically connected to said conductive structure, wherein said first contact pad extends above a surface of said printed circuit board; and
a second contact pad electrically connected to said conductive structure, wherein said second contact pad extends above said surface of said printed circuit board; and

connecting, electrically, a probe lead to said near field structure.

17. The method of claim 16 , further comprising:
compensating for a signal delay.

18. The method of claim 16 , wherein said near field structure further comprises:
an enclosure of said conductive structure.

19. The method of claim 16 , wherein said near field structure further comprises:
a clamping structure connected to said conductive structure.

20. The method of claim 16 , wherein said near field structure further comprises:
an additional conductive structure surrounding an additional microstrip.

Assignees

• IBM

Inventors

• Cocchini Matteo
• Olson Kyle
• Singer Noah

Classifications

• G01R1/07 Primary

  Non contact-making probes · CPC title

• H01P3/081

  Microstriplines · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/10151

  Sensor · CPC title