Micromechanical sensor

Patent metadata

Field	Value
Publication number	US-11768221-B2
Application number	US-202117447764-A
Country	US
Kind code	B2
Filing date	Sep 15, 2021
Priority date	Sep 21, 2020
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

A micromechanical sensor, including a micromechanical chip having a first micromechanical structure, a first evaluation chip, having a first application-specific integrated circuit, and a second evaluation chip having a second application-specific integrated circuit. The first evaluation chip and the micromechanical chip are situated in a stacked manner, the micromechanical chip being directly electrically conductively connected with the first evaluation chip and the first evaluation chip being directly electrically conductively connected with the second evaluation chip. The first application-specific integrated circuit primarily includes analog circuit elements and the second application-specific circuit primarily includes digital circuit elements.

First claim

What is claimed is:

1. A micromechanical sensor, comprising:
a micromechanical chip having a first micromechanical structure;
a first evaluation chip having a first application-specific integrated circuit;
a second evaluation chip having a second application-specific integrated circuit, the first evaluation chip and the micromechanical chip being situated in a stacked manner, the micromechanical chip being directly electrically conductively connected with the first evaluation chip, the first evaluation chip being directly electrically conductively connected with the second evaluation chip, the first application-specific integrated circuit primarily including analog circuit elements, and the second application-specific circuit primarily including digital circuit elements,
a further micromechanical chip having a second micromechanical structure;
wherein the second evaluation chip and the further micromechanical chip are situated in a stacked manner, the further micromechanical chip being directly electrically conductively connected with the first evaluation chip;
wherein a first bond pad series of the micromechanical chip is connected with the first evaluation chip using bond wires, a second bond pad series of the further micromechanical chip is connected with the first evaluation chip using bond wires, the first bond pad series and the second bond pad series being situated perpendicularly with regard to one another.

2. The micromechanical sensor as recited in claim 1 , wherein a first technology node of the first evaluation chip is greater than a second technology node of second evaluation chip.

3. The micromechanical sensor as recited in claim 2 , wherein the first technology node is in a range of 80 nanometers to 180 nanometers and/or the second technology node is smaller than 70 nanometers.

4. The micromechanical sensor as recited in claim 1 , wherein the micromechanical chip includes a second micromechanical structure, the second evaluation chip and the micromechanical chip being situated in a stacked manner, the first evaluation chip and the second evaluation chip being situated both above or both underneath the micromechanical chip.

5. The micromechanical sensor as recited in claim 1 , wherein the first micromechanical structure is configured to measure a three-dimensional rotation rate and the second micromechanical structure is configured to measure a three-dimensional acceleration.

6. The micromechanical sensor as recited in claim 1 , further comprising:
a substrate, wherein communication pads are situated at the substrate, the first evaluation chip and/or the second evaluation chip being electrically conductively connected with the communication pads.

7. The micromechanical sensor as recited in claim 6 , further comprising:
a housing, wherein the housing is a mold housing and the substrate is an integrated circuit board substrate.

8. The micromechanical sensor as recited in claim 1 , wherein the first evaluation chip and the second evaluation chip are connected with one another using bond wires.

Assignees

• Bosch Gmbh Robert

Inventors

• Visconti Andrea
• Kosov Artjom
• Hahn Jochen
• Classen Johannes
• Giesselmann Timo

Classifications

• G01P15/18 Primary

  in two or more dimensions · CPC title

• B81B7/02

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

• B81B2201/0235

  Accelerometers · CPC title

• B81B2207/03

  Electronic circuits for micromechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting · CPC title

• B81B7/0032 Primary

  Packages or encapsulation (processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023) · CPC title