Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope

Patent metadata

Field	Value
Publication number	US-9726689-B1
Application number	US-201314067727-A
Country	US
Kind code	B1
Filing date	Oct 30, 2013
Priority date	Mar 15, 2013
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

The invention relates to sensors, and more particularly, a sensor device having accelerometer and gyroscope integrated into a low cost compact package. The device includes: MEMs wafer; and an ASIC wafer bonded to the MEMs wafer; a wafer-level-package redistribution layer (WLP RDL) formed on a surface of the ASIC wafer; and a ball grid array having a plurality of solder balls that electrically connect the package to a circuit board. The MEMs wafer includes the accelerometer and gyroscope, while the ASIC wafer includes two separate cavities corresponding to the accelerometer and gyroscope, respectively. The ASIC wafer includes electrical circuits/components to process the readout signals received from the accelerometer and gyroscope.

First claim

What is claimed is:

1. A device, comprising:
a micro-electro-mechanical system (MEMS) wafer that is formed of one monolithic body devoid of a via hole and comprises first and second sensors formed on one side of the MEMS wafer, the first and second sensors each including an active component;
an application-specific-integrated-circuit (ASIC) wafer bonded to the MEMS wafer and configured to electrically communicate to the first and second sensors, the ASIC wafer includes first and second cavities in a first surface thereof, the first and second cavities providing space for the first and second sensors, respectively, so that the active components of the first and second sensors freely move within the first and second cavities without touching the ASIC wafer;
first and second electrical contacts providing electrical connection between the ASIC wafer and the MEMS wafer; and
sealing mechanisms that bond the ASIC wafer to the MEMS wafer and separate the first cavity and the first electrical contact from the second cavity and the second electrical contact, the sealing means preventing fluid communication between the first and second cavities.

2. A device as recited in claim 1 , further comprising:
a wafer-level-package redistribution layer (WLP RDL) disposed directly on the ASIC wafer and positioned on a second surface of the ASIC wafer on an opposite side to the MEMS wafer; and
a ball-grid-array (BGA) bonded to the WLP RDL.

3. A device as recited in claim 1 , wherein gas pressures inside the first and second cavities are different from each other.

4. A device as recited in claim 2 , wherein the electrical contacts provide both mechanical and electrical connections between the MEMS wafer and the ASIC wafer.

5. A device as recited in claim 4 , wherein the ASIC wafer includes vias providing electrical communication between the BGA and the electrical contacts.

6. A device as recited in claim 1 , wherein the first and second sensors include a gyroscope and an accelerometer.

Assignees

• Maxim Integrated Products
• Hanking Electronics Ltd

Inventors

• Desai Hemant
• Harper Peter
• Kondylis Demetre

Classifications

• B81C1/00269

  Bonding of solid lids or wafers to the substrate · CPC title

• B81C2203/0118

  Bonding a wafer on the substrate, i.e. where the cap consists of another wafer · CPC title

• B81C1/0023

  Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261) · CPC title

• G01P1/023

  for acceleration measuring devices · CPC title

• G01P2015/0862

  being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system · CPC title