Cooling arrangement having a closed loop, a semi-open loop and at least one fan

Patent metadata

Field	Value
Publication number	US-11768035-B2
Application number	US-202217827897-A
Country	US
Kind code	B2
Filing date	May 30, 2022
Priority date	May 31, 2021
Publication date	Sep 26, 2023
Grant date	Sep 26, 2023

Abstract

Cooling arrangement and method for cooling of a heat source. The cooling arrangement includes a closed loop, a semi-open loop and at least one fan. The closed loop includes a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream the primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop includes a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

First claim

What is claimed is:

1. A cooling arrangement, comprising:
a closed loop, comprising:
a primary side of a liquid-to-liquid heat exchanger, the primary side being adapted for receiving a first cooling fluid heated by a heat source,
a first air-to-liquid heat exchanger adapted for receiving the first cooling fluid from the primary side of the liquid-to-liquid heat exchanger, and
a first pump adapted for receiving the first cooling fluid from the first air-to-liquid heat exchanger and for returning the first cooling fluid to the heat source;

a semi-open loop, comprising:
a tank adapted for storing a second cooling fluid,
a second pump adapted for drawing the second cooling fluid from the tank,
a secondary side of the liquid-to-liquid heat exchanger, the secondary side being adapted for receiving the second cooling fluid from the second pump,
an evaporating pad adapted for receiving the second cooling fluid from the secondary side of the liquid-to-liquid heat exchanger and for returning at least a portion of the second cooling fluid to the tank, and
an inlet fluidly connected to a source of the second cooling fluid, the inlet being controlled for maintaining a level of the second cooling fluid in the tank; and

at least one fan adapted for causing an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

2. The cooling arrangement of claim 1 , wherein the first air-to-liquid heat exchanger, the at least one fan and the evaporating pad are part of a dry cooler.

3. The cooling arrangement of claim 1 , wherein the heat source is located in a data center.

4. The cooling arrangement of claim 3 , wherein the heat source comprises a plurality of heat generating units.

5. The cooling arrangement of claim 1 , wherein the liquid-to-liquid heat exchanger is a plate heat-exchanger.

6. The cooling arrangement of claim 1 , further comprising:
a first sensor of a temperature of the first cooling fluid at an outlet of the first air-to-liquid heat exchanger; and
a controller operatively connected to the first sensor, the controller being adapted for increasing a speed of one or more of the first pump, the second pump and the at least one fan in response to the temperature of the first cooling fluid at the outlet of the first air-to-liquid heat exchanger being above a high temperature threshold.

7. The cooling arrangement of claim 6 , wherein the inlet comprises a first valve adapted for causing an inflow of the second cooling fluid from the source to the tank, the cooling arrangement further comprising a second sensor of a level of the second cooling fluid in the tank, the controller being operatively connected to the second sensor and adapted for controlling the first valve in order to maintain the level of the second cooling fluid in the tank above a low level threshold.

8. The cooling arrangement of claim 6 , wherein:
the semi-open loop further comprises a second valve adapted for regulating a flow of the second cooling fluid to the evaporating pad;
the cooling arrangement further comprises a third sensor of a temperature of the air flow entering the evaporating pad; and
the controller is operatively connected to the third sensor and adapted for causing the second valve to increase the flow of the second cooling fluid in response to the temperature of the air flow being above a threshold.

9. The cooling arrangement of claim 1 , wherein the closed loop further comprises a second air-to-liquid heat exchanger adapted for receiving the first cooling fluid from the heat source, the second air-to-liquid heat exchanger being positioned in the closed loop upstream of the primary side of the liquid-to-liquid heat exchanger.

10. The cooling arrangement of claim 9 , wherein the first and second air-to-liquid heat exchangers are positioned so that the air flow passes through one of the first and second air-to-liquid heat exchangers and then through another of the first and second air-to-liquid heat exchangers.

11. The cooling arrangement of claim 9 , wherein each of the first and second air-to-liquid heat exchangers define an air inlet side and an air outlet side opposed to the air inlet side, the first and second air-to-liquid heat exchangers being adjacent such that the air outlet side of one of the first and second air-to-liquid heat exchangers extends along the air inlet side of another one of the first and second air-to-liquid heat exchangers.

12. A method for cooling of a heat source, the method comprising:
causing a flow of a first cooling fluid in a closed loop, the closed loop comprising:
a primary side of a liquid-to-liquid heat exchanger, the primary side being adapted for receiving the first cooling fluid heated by a heat source,
a first air-to-liquid heat exchanger adapted for receiving the first cooling fluid from the primary side of the liquid-to-liquid heat exchanger, and
a first pump adapted for receiving the first cooling fluid from the first air-to-liquid heat exchanger and for returning the first cooling fluid to the heat source;

causing a flow of a second cooling fluid in a semi-open loop, the semi-open loop comprising:
a tank adapted for storing the second cooling fluid,
a second pump adapted for drawing the second cooling fluid from the tank,
a secondary side of the liquid-to-liquid heat exchanger, the secondary side being adapted for receiving the second cooling fluid from the second pump,
an evaporating pad adapted for receiving the second cooling fluid from the secondary side of the liquid-to-liquid heat exchanger and for returning at least a portion of the second cooling fluid to the tank, and
an inlet fluidly connected to a source of the second cooling fluid,

controlling the inlet for maintaining a level of the second cooling fluid in the tank; and
controlling at least one fan for causing an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

13. The method of claim 12 , further comprising:
sensing a temperature of the first cooling fluid returning to the heat source; and
increasing a speed of one or more of the first pump, the second pump and the at least one fan in response to the temperature being higher than a threshold.

14. The method of claim 12 , further comprising:
sensing a level of the second cooling fluid in the tank; and
causing a first valve to increase an inflow of the second cooling fluid from the source to the tank in response to the level of the second cooling fluid in the tank being below a low level threshold.

15. The method of claim 12 , further comprising:
sensing a temperature of the air flow entering the evaporating pad; and
causing one or more of a second valve and the second pump to increase a flow of the second cooling fluid to the evaporating pad in response to the temperature of the air flow being above a threshold.

Assignees

• OVH

Inventors

• Hnayno Mohamad
• Bauduin Hadrien
• Chakir Anas
• Chehade Ali

Classifications

• F28C1/14 Primary

  comprising also a non-direct contact heat exchange · CPC title

• F28D5/02

  in which the evaporating medium flows in a continuous film or trickles freely over the conduits · CPC title

• F28C2001/145

  with arrangements of adjacent wet and dry passages · CPC title

• F28D1/024 Primary

  with an air driving element · CPC title

• H05K7/20827 Primary

  within rooms for removing heat from cabinets, e.g. air conditioning devices · CPC title