Systems and methods for providing cooling to a heat load

Patent metadata

Field	Value
Publication number	US-10808951-B2
Application number	US-201716083280-A
Country	US
Kind code	B2
Filing date	Feb 14, 2017
Priority date	May 15, 2015
Publication date	Oct 20, 2020
Grant date	Oct 20, 2020

Abstract

Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a pre-cooler upstream and a recovery coil downstream of the evaporative cooler. Outdoor or scavenger air can be conditioned in the evaporative cooler such that the conditioned scavenger air can provide cooling to a cooling fluid circulating through the recovery coil. The reduced-temperature cooling fluid can provide liquid cooling or air cooling for an enclosed space (for example, a data center) or for one or more devices that are enclosed or open to the atmosphere. Given the design and arrangement of the pre-cooler, evaporative cooler and recovery coil in the plenum, the system can operate in multiple modes. The pre-cooler can be configured to circulate a cooling fluid to condition the scavenger air. The pre-cooler fluid circuit can be coupled or de-coupled from a process cooling fluid circuit.

First claim

What is claimed is:

1. A conditioning system for providing cooling to a heat load, the conditioning system comprising:
a plurality of process cooling units, each process cooling unit configured to produce a reduced-temperature cooling fluid and comprising:
a scavenger plenum having an air inlet and outlet, the scavenger plenum configured to direct scavenger air in an air flow path from the air inlet to the air outlet;
an evaporative cooler arranged inside the scavenger plenum in the air flow path and having a first cooling fluid circuit configured to circulate a first cooling fluid through the evaporative cooler, the evaporative cooler configured to selectively evaporate a portion of the first cooling fluid;
a first cooling component arranged inside the scavenger plenum between the air inlet and the evaporative cooler, the first cooling component configured to selectively condition the scavenger air flowing through the first cooling component; and
a second cooling component arranged inside the scavenger plenum between the evaporative cooler and the air outlet and having a second cooling fluid circuit configured to circulate a second cooling fluid through the second cooling component, the second cooling component configured to reduce a temperature of the second cooling fluid; and
a process cooling fluid supply circuit connected to at least one of the first and second cooling fluid circuits of each of the plurality of cooling units and configured to supply a process cooling fluid to the heat load to cause heat rejected by the heat load to be received by the process cooling fluid, the process cooling fluid comprising at least one of the first and second cooling fluids; and
a process cooling fluid return circuit configured to receive the process cooling fluid after the process cooling fluid receives heat rejected by the heat load and to return the process cooling fluid back to each of the plurality of process cooling units for recirculation through at least one of the second cooling component and the evaporative cooler of each of the plurality of process cooling units.

2. The conditioning system of claim 1 wherein each process cooling unit further comprises:
a tank configured to receive and temporarily store at least one of the first and second cooling fluids prior to supplying the process cooling fluid to the heat load.

3. The cooling system of claim 2 wherein the tank is located inside the scavenger plenum.

4. The cooling system of claim 2 wherein the tank is located outside of the scavenger plenum.

5. The cooling system of claim 1 wherein the evaporative cooler of each process cooling unit is a liquid-to-air membrane energy exchanger (LAMEE) and the first cooling fluid is separated from the scavenger air by a membrane.

6. The cooling system of claim 1 wherein the evaporative cooler of each process cooling unit is configured to selectively operate adiabatically and the first cooling fluid circuit includes a selectively closed circuit within the evaporative cooler.

7. The cooling system of claim 1 wherein the first cooling fluid circuit of each process cooling unit is connected to the second cooling fluid circuit.

8. The cooling system of claim 7 wherein the reduced-temperature second cooling fluid selectively flows through the evaporative cooler prior to exiting the scavenger plenum.

9. The cooling system of claim 1 wherein the first cooling component of each process cooling unit is a liquid-to-air heat exchanger (LAHX) having a third cooling fluid circuit and configured to selectively circulate a third cooling fluid to condition the scavenger air.

10. The conditioning system of claim 9 wherein the process cooling fluid supply circuit provides a portion of the process cooling fluid to the first cooling component for use as the third cooling fluid.

11. The conditioning system of claim 10 wherein the third cooling fluid exits the first cooling component at an increased-temperature and is transported to the process cooling fluid return circuit.

12. The conditioning system of claim 9 further comprising an auxiliary cooling unit configured to reduce a temperature of the third cooling fluid exiting the first cooling component of one or more of the process cooling units in the plurality of process cooling units.

13. The conditioning system of claim 12 wherein the auxiliary cooling unit includes a liquid-to-air membrane energy exchanger (LAMEE) arranged inside an auxiliary scavenger air plenum and a recovery coil arranged downstream of the LAMEE in the auxiliary scavenger air plenum, and wherein the third cooling fluid flows through at least one of the LAMEE and the recovery coil to reduce a temperature of the third cooling fluid.

14. The conditioning system of claim 12 wherein the auxiliary cooling unit selectively operates to provide process cooling fluid to the process cooling fluid supply circuit when the plurality of process cooling units are operating in a mode in which the first cooling component of each process cooling unit is bypassed.

15. The conditioning system of claim 1 , wherein the heat load is from an enclosed space with one or more heat-generating components.

16. The conditioning system of claim 15 wherein the enclosed space is a data center.

17. A method of providing cooling to a heat load, the method comprising:
selectively directing scavenger air through a pre-cooler arranged inside a scavenger air plenum, the scavenger air entering the plenum at an air inlet and exiting the plenum at an air outlet, the pre-cooler having a first cooling fluid circuit configured to selectively circulate a first cooling fluid through the pre-cooler to selectively condition the scavenger air;
selectively directing the first cooling fluid exiting the pre-cooler through an auxiliary cooling unit to decrease a temperature of the first cooling fluid;
selectively directing the scavenger air through an evaporative cooler arranged inside the scavenger air plenum downstream of the pre-cooler, the evaporative cooler having an evaporative cooler fluid circuit configured to circulate an evaporative cooler fluid through the evaporative cooler, and the evaporative cooler configured to selectively evaporate a portion of the evaporative cooler fluid;
directing the scavenger air through a recovery coil arranged inside the scavenger air plenum downstream of the evaporative cooler, the recovery coil having a second cooling fluid circuit configured to circulate a second cooling fluid, and the recovery coil configured to reduce a temperature of the second cooling fluid using scavenger air; and
supplying a process cooling fluid in a process cooling fluid circuit to the heat load, the process cooling fluid receiving heat rejected by the heat load, wherein the process cooling fluid circuit is connected to the second cooling fluid circuit and the process cooling fluid comprises the second cooling fluid, and
wherein the first cooling fluid circuit is separate from the second cooling fluid circuit.

18. The method of claim 17 further comprising:
delivering the reduced-temperature first cooling fluid back to the pre-cooler after the first cooling fluid circulates through the auxiliary cooling unit.

19. The method of claim 17 wherein the process cooling fluid is at an increased temperature after receiving heat rejected by the heat load, and the method further comprise:
delivering the increased-temperature process cooling fluid to the recovery coil.

20. The method of claim 17 wherein selectively directing the first cooling fluid e

Assignees

• Nortek Air Solutions Canada Inc

Inventors

• Lepoudre Philip Paul
• Gerber Manfred
• Ghadiri Moghaddam Davood

Classifications

• Y02B30/54

  Free-cooling systems · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• F24F2003/1435

  comprising semi-permeable membrane · CPC title

• H05K7/20309

  Evaporators · CPC title

• H05K7/20827

  within rooms for removing heat from cabinets, e.g. air conditioning devices · CPC title