Head resistance buffer
US-9899466-B2 · Feb 20, 2018 · US
Resistive device
US11765831B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-11765831-B1 |
| Application number | US-202318120638-A |
| Country | US |
| Kind code | B1 |
| Filing date | Mar 13, 2023 |
| Priority date | Mar 16, 2022 |
| Publication date | Sep 19, 2023 |
| Grant date | Sep 19, 2023 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
According to an aspect, there is provided a printed circuit board-based resistive device. The resistive device comprises, arranged on a substrate of the printed circuit board of the printed circuit board: a first conductive pad; a second conductive pad; a resistive patch having a first longitudinal end connected to the first conductive pad and a second longitudinal end connected to the second conductive pad, wherein a width of the resistive patch varies along a length of the resistive patch and has a maximum at a point between the first and second longitudinal ends.
First claim
Opening claim text (preview).
The invention claimed is: 1. A printed circuit board-based resistive device comprising, disposed on a substrate of the printed circuit board: a first conductive pad; a second conductive pad; a resistive patch having a first longitudinal end connected to the first conductive pad and a second longitudinal end connected to the second conductive pad, wherein the resistive patch comprises a first end section at the first longitudinal end of the resistive patch, a middle section, and second end section at the second longitudinal end of the resistive patch, wherein the middle section comprises a plurality of rectangular segments cascaded next to each other, and wherein the plurality of rectangular segments is approximating an elliptic shape; and wherein a width of the resistive patch varies along a length of the resistive patch and has a maximum at a point between the first and second longitudinal ends. 2. The resistive device according to claim 1 , wherein the first and second end sections of the resistive patch are rectangular. 3. The resistive device according to claim 1 , wherein the resistive patch comprises resistive ink disposed on the substrate of the printed circuit board. 4. The resistive device according to claim 1 , wherein the resistive patch comprises a thin film of lossy material deposited on the substrate of the printed circuit board. 5. The resistive device according to claim 1 , wherein the resistive patch comprises a thin film of lossy material attached to the substrate of the printed circuit board and shaped by chemical etching, laser etching, mechanical routing to remove unwanted material.
Assignees
Inventors
Classifications
- H01C7/20Primary
the resistive layer or coating being tapered · CPC title
- H05K1/167Primary
incorporating printed resistors · CPC title
Thin film resistors · CPC title
Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title
Thick film resistors · CPC title
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Frequently asked questions
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- What does patent US11765831B1 cover?
- According to an aspect, there is provided a printed circuit board-based resistive device. The resistive device comprises, arranged on a substrate of the printed circuit board of the printed circuit board: a first conductive pad; a second conductive pad; a resistive patch having a first longitudinal end connected to the first conductive pad and a second longitudinal end connected to the second c…
- Who is the assignee on this patent?
- Nokia Solutions & Networks Oy
- What technology area does this patent fall under?
- Primary CPC classification H01C7/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).