Smt connection of rigid and flexible printed circuit boards
US-2017271799-A1 · Sep 21, 2017 · US
US11764412B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11764412-B2 |
| Application number | US-201917055873-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 12, 2019 |
| Priority date | May 15, 2018 |
| Publication date | Sep 19, 2023 |
| Grant date | Sep 19, 2023 |
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This application relates to a battery pack including a battery cell, a circuit board configured to collect state information about the battery cell, and a connection line configured to transmit the state information about the battery cell to the circuit board and including a link line and a board connection pad. The link line extends from a side of the battery cell toward the circuit board, and the board connection pad extends from a first end portion, to which the link line is connected, and is coupled to the circuit board while facing the circuit board. The board connection pad includes outer soldering portions formed in an outer region of the board connection pad and concave toward the outside of the board connection pad and a gas discharge hole formed in a closed loop shape in an inner region of the board connection pad.
Opening claim text (preview).
The invention claimed is: 1. A battery pack comprising: a battery cell; a circuit board configured to collect state information relating to the battery cell; and a connection line configured to transmit the state information to the circuit board and comprising a link line and a board connection pad, wherein the link line extends from a side of the battery cell toward the circuit board, and wherein the board connection pad extends from a first end portion, to which the link line is connected, and is coupled to the circuit board while facing the circuit board, wherein the board connection pad comprises: a plurality of outer soldering portions formed in an outer region of the board connection pad and concave toward the outside of the board connection pad; a gas discharge hole formed in a closed loop shape in an inner region of the board connection pad; and an inner soldering portion formed along the gas discharge hole. 2. The battery pack of claim 1 , wherein the board connection pad comprises: a conductive pattern through which the state information is transmitted; and an insulating layer in which the conductive pattern is embedded for insulating the conductive pattern. 3. The battery pack of claim 2 , wherein the outer soldering portions and the inner soldering portion are formed by the conductive pattern exposed from the insulating layer. 4. The battery pack of claim 2 , wherein the conductive pattern comprises a one-piece conductive pattern connected to all the outer soldering portions and the inner soldering portion formed on the board connection pad. 5. The battery pack of claim 1 , wherein each of the outer soldering portions is formed in a semicircular shape having a center outside the board connection pad. 6. The battery pack of claim 1 , wherein the inner region is surrounded by the outer region and is separated from the outside of the board connection pad. 7. The battery pack of claim 1 , wherein the gas discharge hole is formed in an elongated shape in the inner region of the board connection pad in a connection direction of the link line. 8. The battery pack of claim 7 , wherein the gas discharge hole is formed in an oval shape having a long axis in the connection direction of the link line. 9. The battery pack of claim 1 , wherein the outer region of the board connection pad comprises: the first end portion; a slope portion sloped from the first end portion to increase an area of the board connection pad; a second end portion on a side opposite the first end portion in a connection direction of the link line; and a third end portion and a fourth end portion which connect the second end portion and the slope portion to each other. 10. The battery pack of claim 9 , wherein the outer soldering portions are formed on the second end portion, the third end portion, and the fourth end portion. 11. The battery pack of claim 9 , wherein in the first end portion and the slope portion, an insulation-covered portion in which a conductive pattern of the board connection pad is covered with an insulating layer is formed. 12. The battery pack of claim 9 , wherein two or more of the outer soldering portions are formed on the second end portion. 13. The battery pack of claim 9 , wherein the outer soldering portions comprise at least one first outer soldering portion and at least one second outer soldering portion respectively formed on the third and fourth end portions, and wherein the at least one first outer soldering portion and the at least one second outer soldering portion are symmetric to each other. 14. The battery pack of claim 9 , wherein a first number of the outer soldering portions are formed on the third and fourth end portions and a second number of the outer soldering portions are formed on the second end portion, and wherein the first number is less than the second number. 15. The battery pack of claim 9 , wherein the outer soldering portions comprise two or more outer soldering portions formed on the third and fourth end portions and overlapping the inner soldering portion in the connection direction of the link line. 16. The battery pack of claim 15 , wherein a first number of the outer soldering portions are formed on the third and fourth end portions, wherein the board connection pad comprises a third number of the inner soldering portion wherein a second number of the outer soldering portions are formed on the second end portion, and wherein the sum of the first and third numbers is equal to the second number. 17. The battery pack of claim 9 , wherein the outer soldering portions comprise two or more outer soldering portions formed on the third and fourth end portions and not overlapping the inner soldering portion in the connection direction of the link line. 18. The battery pack of claim 17 , wherein a first number of the outer soldering portions are formed on the third and fourth end portions, wherein the board connection pad comprises a third number of the inner soldering portion, wherein a second number of the outer soldering portions are formed on the second end portion, and wherein each of the first and third numbers is equal to the second number. 19. The battery pack of claim 9 , wherein the board connection pad comprises a conductive pattern through which the state information relating to the battery cell is transmitted and an isolated pattern through which the state information is not transmitted, and wherein the conductive pattern comprises: a first conductive pattern which connects a first outer soldering portion formed on the second end portion to a first inner soldering portion surrounding a first gas discharge hole in the inner region; and a second conductive pattern which connects a second outer soldering portion formed on the second end portion to a second inner soldering portion surrounding a second gas discharge hole in the inner region, wherein the isolated pattern comprises: a first isolated pattern which connects a third outer soldering portion formed on the second end portion to a fifth outer soldering portion formed on the third end portion; and a second isolated pattern which connects a fourth outer soldering portion formed on the second end portion to a sixth outer soldering portion formed on the fourth end portion. 20. The battery pack of claim 9 , wherein the board connection pad comprises a conductive pattern through which the state information is transmitted, and the conductive pattern comprises first and second conductive patterns separate from each other, wherein the first conductive pattern connects together a first outer soldering portion formed on the second end portion, a third outer soldering portion formed on the third end portion, and a first inner soldering portion surrounding a first gas discharge hole in the inner region, and wherein the second conductive pattern connects together a second outer soldering portion formed on the second end portion, a fourth outer soldering portion formed on the fourth end portion, and a second inner soldering portion surrounding a second gas discharge hole in the inner region.
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