Heatsink assembly, method of manufacturing a heatsink assembly, and an electrical device

Patent metadata

Field	Value
Publication number	US-11764125-B2
Application number	US-202016847850-A
Country	US
Kind code	B2
Filing date	Apr 14, 2020
Priority date	Apr 16, 2019
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

First claim

The invention claimed is:

1. A heatsink assembly, comprising:
a heatsink having a surface for receiving a heat source;
a copper insert; and
a layer of low density pyrolytic graphite having a density in a range of 0.25 g/cm 3 to 1.8 g/cm 3 ,
wherein the copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and
wherein the heat transferring assembly is configured to receive the heat source to transfer heat from the heat source to the heatsink.

2. The heatsink assembly according to claim 1 , wherein the layer of low density pyrolytic graphite comprises a compressed layer comprising at least one sheet of low density pyrolytic graphite.

3. The heatsink assembly according to claim 2 , wherein the compressed layer of low density pyrolytic graphite is on the surface of the heatsink and the copper insert is attached to the heatsink on top of the said compressed layer and arranged to hold the said layer in compressed state, and a surface of the copper insert is adapted to form the surface of the heat transferring assembly.

4. The heatsink assembly according to claim 3 , wherein the surface of the heatsink comprises an indent and the compressed layer of low density pyrolytic graphite is arranged in the indent of the surface of the heatsink and the copper insert attached to the edges of the intend.

5. The heatsink assembly according to claim 1 , wherein a thermal interface material layer is arranged on the surface of the heat transferring assembly.

6. The heatsink assembly according to claim 2 , wherein the compressed layer of low density pyrolytic graphite is arranged between two copper inserts to form the heat transferring assembly.

7. The heatsink assembly according to claim 6 , wherein the two copper inserts are in the form of copper sheets between which the compressed layer of low density pyrolytic graphite is arranged.

8. The heatsink assembly according to claim 7 , wherein the two copper sheets are welded together to form a structure in which the layer of low density pyrolytic graphite is held compressed.

9. The heatsink assembly according to claim 7 , wherein the copper sheets form a top and a bottom of a box-like structure, and the compressed layer of low density pyrolytic graphite is arranged in the box-like structure.

10. The heatsink assembly according to claim 8 , wherein the surface of the heatsink comprises an indent and the two copper sheets with a layer of low density pyrolytic graphite compressed between the sheets is arranged in the indent.

11. The heatsink assembly according to claim 8 , wherein a thermal interface material layer is arranged between the heat transferring assembly and the heat sink and on the surface of the heat transferring assembly.

12. The heatsink assembly according to claim 1 , wherein a thermal interface material layer is arranged on a surface of the heat transferring assembly.

13. The heatsink assembly according to claim 8 , wherein the copper sheets form a top and a bottom of a box-like structure, and the compressed layer of low density pyrolytic graphite is arranged in the box-like structure.

14. The heatsink assembly according to claim 9 , wherein the surface of the heatsink comprises an indent and the two copper sheets with a layer of low density pyrolytic graphite compressed between the sheets are arranged in the indent.

15. The heatsink assembly according to claim 9 , wherein a thermal interface material layer is arranged between the heat transferring assembly and the heat sink and on a surface of the heat transferring assembly.

16. The heatsink assembly according to claim 2 , wherein a thermal interface material layer is arranged on a surface of the heat transferring assembly.

17. A method of producing a heatsink assembly, the method comprising:
providing a heatsink having a surface for receiving a heat source;
providing a copper insert and a layer of low density pyrolytic graphite having a density in a range of 0.25 g/cm 3 to 1.8 g/cm 3 ; and
arranging the copper insert and the layer of low density pyrolytic graphite on the surface of the heatsink in layers to form a heat transferring assembly.

18. The method according to claim 17 , wherein the method comprises further compressing one or multiple of sheets of low density pyrolytic graphite to form a compressed layer of low density pyrolytic graphite to be used in the heat transferring assembly.

19. The method according to claim 18 , wherein the method comprises:
providing an indent to the surface of the heatsink, arranging one or multiple of sheets of low density pyrolytic graphite to the indent, compressing the one or multiple of sheets of low density pyrolytic graphite with the copper insert, and attaching the copper insert to the heatsink with the one or multiple of sheets of low density pyrolytic graphite in compressed state between the copper insert and the heatsink.

20. An electronic device, comprising:
at least one heat generating semiconductor component; and
a heatsink assembly, the heatsink assembly comprising a heatsink, a copper insert, and a layer of low density pyrolytic graphite having a density in a range of 0.25 g/cm 3 to 1.8 g/cm 3 ,
wherein the copper insert and the layer of low density pyrolytic graphite are arranged on a surface of the heatsink in layers to form a heat transferring assembly, and
wherein the at least one heat generating semiconductor component is attached to the heat transferring assembly to transfer heat from the at least one heat generating semiconductor component to the heatsink.

Assignees

• Abb Schweiz Ag

Inventors

• Manninen Jorma
• Silvennoinen Mika
• Pakarinen Joni

Classifications

• H10W40/037

  Assembling together parts thereof · CPC title

• B32B37/18

  involving the assembly of discrete sheets or panels only · CPC title

• B32B27/36

  comprising polyesters · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/25 Primary

  characterised by their materials · CPC title