Wafer-scale programmable films for semiconductor planarization and for imprint lithography

Patent metadata

Field	Value
Publication number	US-11762284-B2
Application number	US-201716322882-A
Country	US
Kind code	B2
Filing date	Aug 3, 2017
Priority date	Aug 3, 2016
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

A method for fabricating patterns. An inverse optimization scheme is implemented to determine process parameters used to obtain a desired film thickness of a liquid resist formulation, where the liquid resist formulation includes a solvent and one or more non-solvent components. A substrate is covered with a substantially continuous film of the liquid resist formulation using one or more of the following techniques: dispensing discrete drops of a diluted monomer on the substrate using an inkjet and allowing the dispensed drops to spontaneously spread and merge, slot die coating and spin-coating. The liquid resist formulation is diluted in the solvent. The solvent is then substantially evaporated from the liquid resist formulation forming a film. A gap between a template and the substrate is then closed. The film is cured to polymerize the film and the substrate is separated from the template leaving the polymerized film on the substrate.

First claim

The invention claimed is:

1. A method for planarizing patterns on rigid wafer substrates, the method comprising:
covering a patterned substrate with a substantially continuous film of liquid resist formulation using spin-coating, wherein said liquid resist formulation comprises a solvent and one or more non-solvent components;
evaporating said solvent substantially from said liquid resist formulation to form a film;
implementing an inverse optimization scheme with existing substrate topography as an input which is used to determine process parameters to further selectively evaporate said film using a spatial light modulator to modify said film to create a planarized pattern, wherein said spatial light modulator controls one or more sources of electromagnetic radiation; and
curing said planarized pattern.

2. The method as recited in claim 1 , wherein a stack of one or more films is used between said liquid resist formulation and said substrate that substantially absorbs electromagnetic radiation.

3. The method as recited in claim 1 , wherein a superstrate is used to cover a top of said film to obtain desired evolution dynamics of said film.

4. The method as recited in claim 1 , wherein metrology is used to provide feedback for said inverse optimization scheme using a machine in a loop control.

5. The method as recited in claim 1 , wherein a forward model is used as a core for said inverse optimization scheme to predict a film thickness profile, wherein said forward model incorporates one or more of the following: thermal transport, non-solvent transport, and solvent transport.

6. The method as recited in claim 1 , wherein an inkjet is used to dispense discrete drops of said liquid resist formulation prior to solvent evaporation, wherein said discrete drops do not form a substantially continuous film.

7. The method as recited in claim 1 , wherein an inkjet is used to dispense discrete drops of said liquid resist formulation without said solvent after said solvent in said film has been substantially evaporated, wherein said inkjet drops do not form a substantially continuous film.

8. The method as recited in claim 1 further comprising:
performing metrology to provide feedback for process optimization, wherein said metrology is performed by:
having an array of Atomic Force Microscope (AFM) tips with individually addressable locations;
determining an optimum positioning of said array of AFM tips on a wafer with a pattern, a topography variation or a variation in a film thickness, wherein each AFM tip in said array of AFM tips provides data that is aggregated to infer said pattern, said topography variation or said film thickness variation;
scanning said wafer to measure said pattern, said topography variation or said film thickness variation; and
aggregating and analyzing said measured pattern, said measured topography variation or said measured film thickness variation to infer said pattern, said topography variation or said film thickness variation.

9. The method as recited in claim 8 , wherein each AFM tip of said array of AFM tips is on a different device on a same wafer, wherein each said different device on said same wafer is substantially the same.

Assignees

• Univ Texas

Inventors

• Sreenivasan Sidlgata V
• Singhal Shrawan
• Abed Ovadia
• Dunn Lawrence

Classifications

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title

• G01Q60/24

  AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes · CPC title