Reduced kapitza resistance microwave filter for cryogenic environments

Patent metadata

Field	Value
Publication number	US-11757169-B2
Application number	US-202218063150-A
Country	US
Kind code	B2
Filing date	Dec 8, 2022
Priority date	Oct 2, 2018
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

First claim

What is claimed is:

1. A thermal decoupling device, comprising:
a dielectric material comprising a first channel that is separated from a second channel by a wall of the dielectric material;
a conductive line comprising a first segment and a second segment that are separated by the wall, wherein the wall facilitates propagation of a microwave signal between the first segment and the second segment and reduces heat flow between the first segment and the second segment of the conductive line; and
a housing formed of a housing material and configured to be coupled to refrigerator plates that facilitate a transfer of thermal energy away from the housing.

2. The thermal decoupling device of claim 1 , wherein the wall has dimensions determined to propagate the microwave signal based on the microwave signal having a frequency above about 1 gigahertz (GHz).

3. The thermal decoupling device of claim 1 , wherein the first segment and the second segment extend in directions substantially parallel.

4. The thermal decoupling device of claim 1 , wherein the first segment exhibits a first mean temperature that is higher than a second mean temperature of the second segment.

5. The thermal decoupling device of claim 1 , wherein the dielectric material is selected to have a thermal conductivity that is above 200 watts per meter-Kelvin (W/m-K) at a temperature of 77 degrees Kelvin (K).

6. The thermal decoupling device of claim 5 , wherein the dielectric material is selected from a group comprising sapphire and diamond.

7. The thermal decoupling device of claim 1 , wherein the conductive line comprises a conductive material that has been sintered in discontinuous channels of the dielectric material.

8. The thermal decoupling device of claim 1 , wherein the dielectric material comprises discontinuous channels, comprising the first channel and the second channel, wherein the discontinuous channels are in a pattern that facilitates a filter operation on the microwave signal propagated in a cryogenic environment having a temperature below about 77 degrees Kelvin (K).

9. The thermal decoupling device of claim 8 , wherein the filter operation is a function of a geometry of the conductive line that fills the discontinuous channels having the pattern.

10. The thermal decoupling device of claim 8 , wherein the filter operation comprises a bandpass filter operation, wherein first frequencies of the microwave signal that are within a defined range of frequencies are passed by the bandpass filter operation, and wherein second frequencies beyond the defined range are attenuated by the bandpass filter operation.

11. The thermal decoupling device of claim 10 , wherein the defined range of frequencies has a band width of approximately a one gigahertz (GHz) that encompasses a portion of frequencies within a range of between about one GHz and about 10 GHz.

12. A thermally decoupled cryogenic microwave filter device, comprising:
a dielectric having discontinuous channels in a pattern that facilitates a filter operation on a microwave signal propagated in a cryogenic environment having a temperature below about 77 degrees Kelvin (K), wherein the discontinuous channels comprise a first channel that is separated from a second channel by a wall of the dielectric;
a conductive line comprising a first segment, situated in the first channel, and a second segment, situated in the second channel, separated by the wall that facilitates propagation of the microwave signal through the conductive line and reduces heat flow between the first segment and the second segment of the conductive line;
a housing formed of a housing material and configured to be coupled to refrigerator plates that facilitate a transfer of thermal energy away from the housing.

13. The thermally decoupled cryogenic microwave filter device of claim 12 , wherein the wall has dimensions determined to propagate the microwave signal based on the microwave signal having a frequency above about one gigahertz (GHz).

14. The thermally decoupled cryogenic microwave filter device of claim 12 , wherein the first segment and the second segment extend in directions substantially parallel.

15. The thermally decoupled cryogenic microwave filter device of claim 14 , wherein the housing couples to an electrical ground.

Assignees

• IBM

Inventors

• Gumann Patryk
• Olivadese Salvatore Bernardo

Classifications

• H01P11/001

  Manufacturing waveguides or transmission lines of the waveguide type · CPC title

• H01P1/30 Primary

  for compensation of, or protection against, temperature or moisture effects {; for improving power handling capability (H01P1/04, H01P1/08 take precedence)} · CPC title

• H01P1/20363 Primary

  Linear resonators · CPC title

• H01P11/007

  Manufacturing frequency-selective devices (resonators H01P11/008) · CPC title

• H01P1/20

  Frequency-selective devices, e.g. filters · CPC title