Antenna device and electronic apparatus
US-2019385787-A1 · Dec 19, 2019 · US
for compensation of, or protection against, temperature or moisture effects {; for improving power handling capability (H01P1/04, H01P1/08 take precedence)}
for compensation of, or protection against, temperature or moisture effects {; for improving power handling capability (H01P1/04, H01P1/08 take precedence)} · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01P1/30 |
| Official title | for compensation of, or protection against, temperature or moisture effects {; for improving power handling capability (H01P1/04, H01P1/08 take precedence)} |
| Display label | for compensation of, or protection against, temperature or moisture effects {; for improving power handling capability (H01P1/04, H01P1/08 take precedence)} |
| Total patents | 201 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 5 |
| 2017 | 10 |
| 2018 | 16 |
| 2019 | 31 |
| 2020 | 35 |
| 2021 | 28 |
| 2022 | 20 |
| 2023 | 25 |
| 2024 | 10 |
| 2025 | 10 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Mini isolator
US-2019348736-A1 · Nov 14, 2019 · US
Mini isolator
US-2019348775-A1 · Nov 14, 2019 · US
Cryogenic-stripline microwave attenuator
US-10476122-B2 · Nov 12, 2019 · US
Resonator and communications apparatus
US-2019319331-A1 · Oct 17, 2019 · US
On-chip coplanar waveguide having a shielding layer comprising a capacitor formed by sets of interdigitated fingers
US-10446898-B2 · Oct 15, 2019 · US
Cryogenic-stripline microwave attenuator
US-2019288361-A1 · Sep 19, 2019 · US
Technologies for long-lived 3d multimode microwave cavities
US-2019288367-A1 · Sep 19, 2019 · US
Reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications
US-2019252751-A1 · Aug 15, 2019 · US
Microwave attenuators on high-thermal conductivity substrates for quantum applications
US-2019252752-A1 · Aug 15, 2019 · US
Mini isolator
US-10381702-B2 · Aug 13, 2019 · US
Waveguide structures
US-10356964-B2 · Jul 16, 2019 · US
Protection apparatus for a hollow conductor and method for producing a protection apparatus
US-2019157764-A1 · May 23, 2019 · US
Power and rf devices implemented using an engineered substrate structure
US-2019139859-A1 · May 9, 2019 · US
Transmission line and signal processing device
US-10263311-B2 · Apr 16, 2019 · US
High-frequency power combiner
US-2019089032-A1 · Mar 21, 2019 · US
Multi-layer substrate with integrated resonator
US-2019074571-A1 · Mar 7, 2019 · US
Flat radio frequency transmission line
US-10224591-B2 · Mar 5, 2019 · US
Broadband radio frequency coupler
US-2019067785-A1 · Feb 28, 2019 · US
Method for compensating a temperature drift of a microwave filter
US-10199704-B2 · Feb 5, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01P1/30?
- CPC H01P1/30 is the Cooperative Patent Classification code for “for compensation of, or protection against, temperature or moisture effects {; for improving power handling capability (H01P1/04, H01P1/08 take precedence)}.”
- How many patents are filed under CPC H01P1/30 (for compensation of, or protection against, temperature or moisture effects {; for improving power handling capability (H01P1/04, H01P1/08 take precedence)})?
- Our database includes 201 publications tagged with this CPC code.
- Is patent activity under CPC H01P1/30 growing?
- Publication counts under this code: 10 in 2024 vs 10 in 2025 (latest complete years).