Photonic communication platform

Patent metadata

Field	Value
Publication number	US-11754783-B2
Application number	US-202117313415-A
Country	US
Kind code	B2
Filing date	May 6, 2021
Priority date	Mar 6, 2019
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

First claim

What is claimed is:

1. A photonic communication platform comprising:
a photonic network comprising a plurality of optical switches formed on a semiconductor substrate;
a plurality of dies in communication with the photonic network;
an electronic switching network comprising a plurality of transistors co-integrated with the plurality of optical switches, the electronic switching network being configured to:
at a first time, program the plurality of optical switches to form a first optical communication path coupling together a first subset of the plurality of dies, wherein programming the plurality of optical switches to form the first optical communication path comprises:
identifying an optical communication path coupling together the first subset of the plurality of dies, wherein identifying an optical communication path coupling together the first subset of the plurality of dies comprises identifying an optical communication path providing a bandwidth in excess of a threshold bandwidth; and
programming the plurality of optical switches based on the identified optical communication path; and

at a second time subsequent to the first time, program the plurality of optical switches to form a second optical communication path coupling together a second subset of the plurality of dies.

2. The photonic communication platform of claim 1 , wherein the plurality of transistors are formed on the semiconductor substrate.

3. The photonic communication platform of claim 1 , wherein the semiconductor substrate is a first semiconductor substrate, and wherein the plurality of transistors are formed on a second semiconductor substrate, wherein the first and second semiconductor substrates are 3D-bonded together.

4. The photonic communication platform of claim 1 , wherein identifying an optical communication path coupling together the first subset of the plurality of dies further comprises monitoring a usage of the photonic network.

5. The photonic communication platform of claim 1 , wherein the electronic switching network is further configured to:
determine at least one characteristic of an optical signal at the first optical communication path;
identify an encoding scheme based on the at least one characteristic of the optical signal; and
cause the photonic network to communicate optically on the first optical communication path based on the encoding scheme.

6. The photonic communication platform of claim 1 , wherein the plurality of dies are in electronic communication with the photonic network.

7. The photonic communication platform of claim 1 , wherein the electronic switching network is further configured to cause the photonic network to communicate optically on the first optical communication path using wavelength division multiplexing.

8. The photonic communication platform of claim 1 , wherein the photonic network comprises a plurality of photonic modules sharing a same waveguide layer layout, wherein a first photonic module of the plurality of photonic modules comprises a first optical switch of the plurality of optical switches and a second photonic module of the plurality of photonic modules comprises a second optical switch of the plurality of optical switches.

9. The photonic communication platform of claim 8 , wherein the first subset of the plurality of dies comprises a first die and a second die, wherein the first die is in communication with the first photonic module and the second die is in communication with the second photonic module.

10. The photonic communication platform of claim 9 , wherein the first die is bonded to the semiconductor substrate in correspondence with the first photonic module and the second die is bonded to the semiconductor substrate in correspondence with the second photonic module.

11. A method for operating a photonic communication platform, comprising:
with an electronic switching network comprising a plurality of transistors, programming, at a first time, a plurality of optical switches formed on a semiconductor substrate to form a first optical communication path coupling together a first subset of a plurality of dies, wherein the plurality of dies are in communication with the plurality of optical switches, and wherein the plurality of transistors are co-integrated with the plurality of optical switches, wherein programming the plurality of optical switches to form the first optical communication path comprises:
identifying an optical communication path coupling together the first subset of the plurality of dies, wherein identifying an optical communication path coupling together the first subset of the plurality of dies comprises identifying an optical communication path providing a bandwidth in excess of a threshold bandwidth; and
programming the plurality of optical switches based on the identified optical communication path; and

with the electronic switching network, programming, at a second time subsequent to the first time, the plurality of optical switches to form a second optical communication path coupling together a second subset of the plurality of dies.

12. The method of claim 11 , further comprising:
determining at least one characteristic of an optical signal at the first optical communication path;
identifying an encoding scheme based on the at least one characteristic of the optical signal; and
causing the plurality of optical switches to communicate optically on the first optical communication path based on the encoding scheme.

13. The method of claim 11 , further comprising causing the photonic network to communicate optically on the first optical communication path using wavelength division multiplexing.

14. The method of claim 11 , further comprising debugging the electronic switching network using a joint test action group (JTAG) unit.

15. The method of claim 11 , further comprising arbitrating between a first request received from a die of the first subset and a second request received from a die of the second subset.

16. The method of claim 15 , further comprising programming the optical switches based on the arbitrating.

Assignees

• Lightmatter Inc

Inventors

• Harris Nicholas C
• Ramey Carl
• Gould Michael
• Graham Thomas
• Bunandar Darius
• Braid Ryan
• Tymchenko Mykhailo

Classifications

• H10P76/2042

  using lasers · CPC title

• H04J14/0307

  Multiplexers; Demultiplexers · CPC title

• H04J14/02

  Wavelength-division multiplex systems · CPC title

• G02B6/43 Primary

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/12004 Primary

  Combinations of two or more optical elements · CPC title