Chemical mechanical polishing apparatus and method

Patent metadata

Field	Value
Publication number	US-11738423-B2
Application number	US-201916502845-A
Country	US
Kind code	B2
Filing date	Jul 3, 2019
Priority date	Jul 31, 2018
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

The present disclosure describes a method and apparatus to remove consumable (e.g., sacrificial) polishing pad layers from a multilayer polishing pad. For example, the method includes measuring a thickness profile of a top polishing pad layer of a multilayer polishing pad and comparing the thickness profile to a threshold. The method, in response to the thickness profile being above the threshold, rinses the top polishing pad layer of the multilayer polishing pad and removes, after the top polishing pad layer has been rinsed, the top polishing pad layer to expose an underlying polishing pad layer of the multilayer polishing pad.

First claim

What is claimed is:

1. A system, comprising:
a polishing pad comprising a plurality of polishing pad layers;
a sensor configured to measure a thickness profile of a top polishing pad layer of the plurality of polishing pad layers;
a rinse system configured to rinse a surface of the top polishing pad layer; and
a laser unit configured to produce a laser beam to remove the top polishing pad layer.

2. The system of claim 1 , further comprising:
a wafer carrier configured to hold a wafer against the top polishing pad layer; and
a slurry feeder configured to dispense a slurry on the top polishing pad layer.

3. The system of claim 1 , wherein the polishing pad further comprises an intermediate layer between each of the plurality of polishing pad layers.

4. The system of claim 1 , wherein each of the plurality of polishing pad layers has a thickness that ranges from about 20 mil to about 25 mil.

5. The system of claim 1 , wherein the sensor comprises an optical sensor, an acoustic sensor, or combinations thereof.

6. The system of claim 1 , wherein the laser beam comprises a wavelength that ranges from about 400 nm to about 700 nm and has a diameter less than about 3 mm.

7. The system of claim 1 , wherein the sensor is arranged above the top polishing pad layer.

8. The system of claim 1 , wherein the rinse system is configured to deliver pressurized deionized water to a surface of the top polishing pad layer.

9. A method, comprising:
measuring a thickness profile comprising two points of a top polishing pad layer of a multilayer polishing pad;
comparing the thickness profile to a threshold;
in response to the thickness profile being above the threshold, rinsing the top polishing pad layer of the multilayer polishing pad; and
removing, after the top polishing pad layer is rinsed, the top polishing pad layer to expose an underlying polishing pad layer of the multilayer polishing pad.

10. The method of claim 9 , further comprising:
in response to the thickness profile being equal to or below the threshold, polishing one or more wafers with the top polishing pad layer.

11. The method of claim 9 , further comprising:
after removing the top polishing pad layer, polishing one or more wafers with the underlying polishing pad layer.

12. The method of claim 9 , wherein measuring the thickness profile comprising the two points of the top polishing pad layer comprises measuring a maximum vertical distance between the two points on a surface of the top polishing pad layer.

13. The method of claim 9 , wherein a total thickness of the top polishing pad layer and the underlying polishing pad layer of the multilayer polishing pad ranges from about 20 mil to about 25 mil.

14. The method of claim 9 , wherein removing the top polishing pad layer comprises burning off material from the top polishing pad layer and a separation layer disposed between the top polishing pad layer and the underlying polishing pad layer.

15. The method of claim 14 , wherein burning off the material from the top polishing pad layer comprises applying a laser beam, with a wavelength ranging from about 400 nm to about 700 nm and a diameter less than about 3 mm, to a surface of the top polishing pad layer.

16. The method of claim 9 , wherein the multilayer polishing pad comprises stacked polishing pad layers with separation layers therebetween.

17. A system, comprising:
a polisher with a multilayer polishing pad;
one or more sensors configured to determine a thickness profile of a top polishing pad layer of the multilayer polishing pad;
a rinse system configured to rinse the top polishing pad layer of the multilayer polishing pad;
a laser unit configured to produce a laser beam to remove the top polishing pad layer from the multilayer polishing pad; and
a computer unit configured to compare the thickness profile obtained by the one or more sensors to a value, and in response to the thickness profile being greater than the value, command the laser unit to remove the top polishing pad layer.

18. The system of claim 17 , wherein the multilayer polishing pad further comprises a separation layer interposed between adjacent polishing pad layers.

19. The system of claim 17 , wherein the laser beam is configured to be perpendicular to a side surface of the multilayer polishing pad.

20. The system of claim 17 , wherein the one or more sensors are further configured to measure a maximum vertical distance between two surface points on the top polishing pad layer.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Peng Cheng-Chin

Classifications

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B37/22 Primary

  characterised by a multi-layered structure · CPC title

• B24B49/003

  involving acoustic means · CPC title

• B24B49/12

  involving optical means · CPC title