Electroplated metal layer on a niobium-titanium substrate

Patent metadata

Field	Value
Publication number	US-11735802-B2
Application number	US-202016859363-A
Country	US
Kind code	B2
Filing date	Apr 27, 2020
Priority date	Apr 27, 2020
Publication date	Aug 22, 2023
Grant date	Aug 22, 2023

Abstract

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

First claim

What is claimed is:

1. A method, comprising:
electroplating a first metal film onto a surface of a niobium-titanium substrate;
electroplating a second metal film onto the first metal film; and
electroplating a third metal film onto the second metal film, wherein the niobium-titanium substrate comprises a niobium-titanium wire, and wherein the first metal film is comprised of nickel, the second metal film is comprised of copper and the third metal film is comprised of gold.

2. The method of claim 1 , further comprising:
preparing the surface of the niobium-titanium substrate, resulting in a prepared surface, wherein the preparing comprises polishing the surface of the niobium-titanium substrate using a mechanical polishing wheel.

3. The method of claim 1 , further comprising:
preparing the surface of the niobium-titanium substrate, resulting in a prepared surface, wherein the preparing comprises sanding the surface of the niobium-titanium substrate, and wherein the preparing further comprises dipping the surface of the niobium-titanium substrate in a hydrochloric acid solution.

4. The method of claim 1 , further comprising:
soldering a metal surface to at least one of the first metal film, the second metal film, or the third metal film.

Assignees

• IBM

Inventors

• Gordon Ryan T
• Hall Shawn Anthony
• Luo Yu
• Sandstrom Robert L

Classifications

• G06N10/40

  Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control · CPC title

• H01P3/06 Primary

  Coaxial lines · CPC title

• B23K35/40

  Making wire or rods for soldering or welding · CPC title

• B23K35/404

  Coated rods; Coated electrodes · CPC title

• C25D5/12 Primary

  at least one layer being of nickel or chromium · CPC title