Method of manufacturing light emitting device having a light-shielding frame around a light emitting surface

Patent metadata

Field	Value
Publication number	US-11735687-B2
Application number	US-202117179320-A
Country	US
Kind code	B2
Filing date	Feb 18, 2021
Priority date	Mar 9, 2020
Publication date	Aug 22, 2023
Grant date	Aug 22, 2023

Abstract

A method of manufacturing a light emitting device includes: providing a first intermediate body including a substrate, first bonding members, a second bonding member, a light emitting element, a protecting element, a light transmissive member bonded to the light emitting element, and a light-shielding frame surrounding the light transmissive member in a top view, a portion of an outer periphery of the light-shielding frame being located above the protecting element such that at least a portion of the protecting element is exposed from the light-shielding frame in the top view; disposing a first resin between the light emitting element and the substrate by applying the first resin on the substrate in a region outside of the portion of the protecting element such that the first resin moves toward the light emitting element along the protecting element; and curing the first resin to obtain a first cover member.

First claim

What is claimed is:

1. A method of manufacturing a light emitting device, the method comprising:
providing a first intermediate body including
a substrate,
a plurality of first bonding members,
a second bonding member,
a light emitting element mounted on an upper surface of the substrate via the plurality of first bonding members,
a protecting element mounted on the upper surface of the substrate via the second bonding member and spaced apart from the light emitting element,
a light transmissive member bonded to an upper surface of the light emitting element, and
a light-shielding frame surrounding the light transmissive member in a top view, a portion of an outer periphery of the light-shielding frame being located above the protecting element such that at least a portion of the protecting element is exposed from the light-shielding frame in the top view;

disposing a first resin between the light emitting element and the substrate by applying the first resin on the substrate in a region outside of the portion of the protecting element exposed from the light-shielding frame in the top view such that the first resin moves toward the light emitting element along the protecting element; and
curing the first resin to obtain a first cover member.

2. The method of manufacturing a light emitting device according to claim 1 , wherein
the disposing of the first resin includes applying the first resin such that the first resin comes into contact with an upper surface of the protecting element.

3. The method of manufacturing a light emitting device according to claim 1 , further comprising
after the disposing of the first resin, forming a second cover member on the substrate, the second cover member covering the first cover member and lateral surfaces of the light-shielding frame.

4. The method of manufacturing a light emitting device according to claim 1 , wherein
the providing of the first intermediate body includes providing a second intermediate body, the second intermediate body including
the light transmissive member including a first surface, a second surface opposite to the first surface, and lateral surfaces between the first surface and the second surface,
the light-shielding frame having an inner surface defining an opening, and
a third cover member bonding the inner surface of the light-shielding frame and the lateral surfaces of the light transmissive member.

5. The method of manufacturing a light emitting device according to claim 4 , wherein
the providing of the first intermediate body includes bonding the second surface of the light transmissive member in the second intermediate body and the upper surface of the light emitting element.

6. The method of manufacturing a light emitting device according to claim 1 , wherein
the providing of the first intermediate body includes providing the first intermediate body including an additional light emitting element with the light emitting element and the additional light emitting element being aligned along a first direction, and
the disposing of the first resin includes applying the first resin along the first direction.

7. The method of manufacturing a light emitting device according to claim 1 , wherein
the providing of the first intermediate body includes providing the first intermediate body including the light transmissive member containing a phosphor.

8. The method of manufacturing a light emitting device according to claim 1 , wherein
the providing of the first intermediate body includes providing the first intermediate body including the light transmissive member including a first surface serving as a light emission surface of the light emitting device, a second surface opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface with the first surface having an area dimension smaller than an area dimension of the second surface.

9. The method of manufacturing a light emitting device according to claim 1 , wherein
the providing of the first intermediate body includes providing the first intermediate body including the light-shielding frame having a thickness in a range of 20 μm to 200 μm.

10. The method of manufacturing a light emitting device according to claim 1 , wherein
the disposing of the first resin includes applying the first resin having a viscosity in a range of 0.5 Pa·s to 30 Pa·s.

Assignees

• Nichia Corp

Inventors

• Abe Shogo
• Ogura Yuki

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title