Illumination assembly, method of manufacturing the illumination assembly, and backlight module including the illumination assembly
US-2016111401-A1 · Apr 21, 2016 · US
Method for manufacturing a light-emitting device
US11735684B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11735684-B2 |
| Application number | US-201917283973-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 10, 2019 |
| Priority date | Oct 12, 2018 |
| Publication date | Aug 22, 2023 |
| Grant date | Aug 22, 2023 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A method for manufacturing a light-emitting device may include producing a support having at least one conductor track on a surface of the support. The method may further include producing a reflective coating directly on the at least one conductor track by means of a film transfer method such that the conductor track is substantially covered by the reflective coating and arranging a light-emitting component on or above the reflective coating. The light-emitting component may be electrically conductively connected to the conductor track(s).
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing a light-emitting device, the method comprising: forming a carrier with at least one conductor track on a surface of the carrier; forming a reflective coating directly on the at least one conductor track by a film transfer method in such a way that the conductor track is substantially covered by the reflective coating; and arranging a light-emitting component on or over the reflective coating, wherein the light-emitting component is electrically conductively connected to the at least one conductor track. 2. The method as claimed in claim 1 , further comprising forming at least one contact pad on the surface of the carrier, said at least one contact pad being electrically conductively connected to the at least one conductor track, and wherein the reflective coating is formed on or over the contact pad in such a way that the contact pad is at least partially exposed. 3. The method as claimed in claim 1 , wherein the reflective coating is formed as a solder barrier structure for the contact pad. 4. The method as claimed in claim 3 , wherein the light-emitting component is electrically conductively connected to the at least one conductor track by the contact pad. 5. The method as claimed in claim 3 , wherein a soldered connection is formed between the light-emitting component and the contact pad. 6. The method as claimed in claim 1 , wherein the carrier comprises at least one first conductor track and a second conductor track electrically insulated from the at least one first conductor track, and wherein the reflective coating comprises a first section formed directly on the first conductor track, and comprises a second section formed directly on the second conductor track, wherein the first section is electrically insulated from the second section. 7. The method as claimed in claim 1 , wherein the reflective coating is electrically conductive. 8. The method as claimed in claim 1 , wherein the reflective coating is electrically nonconductive. 9. The method as claimed in claim 1 , wherein the reflective coating is applied on or over the carrier by a cold film transfer method. 10. The method as claimed in claim 1 , wherein the reflective coating is applied on or over the carrier by a hot film transfer method. 11. The method as claimed in claim 1 , wherein the reflective coating comprises an electrically conductive material. 12. The method as claimed in claim 1 , wherein the reflective coating comprises an electrically nonconductive material.
Assignees
Inventors
Classifications
of interconnections · CPC title
Interconnections (of active-matrix LED displays H10H29/49) · CPC title
Reflective coatings, e.g. dielectric Bragg reflectors · CPC title
of coatings · CPC title
of interconnections · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11735684B2 cover?
- A method for manufacturing a light-emitting device may include producing a support having at least one conductor track on a surface of the support. The method may further include producing a reflective coating directly on the at least one conductor track by means of a film transfer method such that the conductor track is substantially covered by the reflective coating and arranging a light-emit…
- Who is the assignee on this patent?
- Osram Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10H20/857. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 22 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).