Illumination assembly, method of manufacturing the illumination assembly, and backlight module including the illumination assembly

Patent metadata

Field	Value
Publication number	US-2016111401-A1
Application number	US-201514879496-A
Country	US
Kind code	A1
Filing date	Oct 9, 2015
Priority date	Oct 15, 2014
Publication date	Apr 21, 2016
Grant date	—

Abstract

An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

First claim

What is claimed is:

1 . An illumination assembly comprising:
a substrate; a wiring structure that is formed on a part of said substrate, and that includes a catalyst layer covering the part of said substrate, and a first conducting layer formed on said catalyst layer; a reflecting layer that is formed on another part of said substrate exposed from said wiring structure; and a plurality of light-emitting diodes that are disposed on said wiring structure and are electrically connected to said wiring structure.

2 . The illumination assembly as claimed in claim 1 , wherein said substrate includes a metal layer and an insulating layer formed on said metal layer, said wiring structure being formed on and covering a part of said insulating layer.

3 . The illumination assembly as claimed in claim 1 , wherein said substrate is made of an insulating material, said wiring structure being directly formed on said substrate.

4 . The illumination assembly as claimed in claim 1 , wherein said catalyst layer includes N-methyl-2-pyrrolidone.

5 . The illumination assembly as claimed in claim 1 , wherein said reflecting layer is made of a material including epoxy resin and titanium dioxide.

6 . The illumination assembly as claimed in claim 1 , wherein said wiring structure further includes a second conducting layer formed on said first conducting layer, said light-emitting diodes being disposed on and in contact with said second conducting layer so as to electrically connect to said second conducting layer.

7 . A backlight module comprising:
an illumination assembly as claimed in claim 1 ; and an optical unit that is formed on said illumination assembly and that includes a brightness enhancement film.

8 . A method of manufacturing an illumination assembly, comprising the following steps:
providing a substrate; forming on the substrate a catalyst layer that covers a part of the substrate; forming a first conducting layer on the catalyst layer by an electroless plating technique; forming a reflecting layer on another part of the substrate exposed from the first conducting layer; and disposing a plurality of light-emitting diodes on the first conducting layer so as to electrically connect the plurality of light-emitting diodes to the first conducting layer.

9 . The method as claimed in claim 8 , wherein:
in the step of providing the substrate, the substrate is made of an insulating material; and in the step of forming the catalyst layer, the catalyst layer is directly formed on the substrate.

10 . The method as claimed in claim 8 , wherein:
in the step of providing the substrate, the substrate includes a metal layer and an insulating layer formed on the metal layer; and in the step of forming the catalyst layer, the catalyst layer is formed on and covering a part of the insulating layer.

11 . The method as claimed in claim 8 , further comprising, before the step of forming the reflecting layer, a step of forming on the first conducting layer a second conducting layer,
wherein, in the step of forming the reflecting layer, the reflecting layer is formed on the another part of the substrate that is exposed from the first conducting layer and on a part of the second conducting layer.

12 . The method as claimed in claim 8 , wherein, in the step of forming the reflecting layer, the reflecting layer is further formed on a part of the first conducting layer.

13 . An illumination assembly comprising:
a substrate; a wiring structure that includes a catalyst layer formed on said substrate, a blocking layer covering a part of said catalyst layer, and a first conducting layer formed on another part of said catalyst layer that is exposed from said blocking layer; a reflecting layer that is formed on said blocking layer; and a plurality of light-emitting diodes that are disposed on said first conducting layer and are electrically connected to said first conducting layer.

14 . The illumination assembly as claimed in claim 13 , wherein said substrate includes a metal layer and an insulating layer formed on said metal layer, said catalyst layer of said wiring structure being formed on said insulating layer.

15 . The illumination module as claimed in claim 13 , wherein said substrate is made of an insulating material, said catalyst layer of said wiring structure being formed on said substrate.

16 . The illumination assembly as claimed in claim 13 , wherein said wiring structure further includes a second conducting layer formed on said first conducting layer, said light-emitting diodes being formed on and in contact with said second conducting layer so as to electrically connect to said second conducting layer.

17 . The illumination assembly as claimed in claim 13 , wherein said catalyst layer includes N-methyl-2-pyrrolidone.

18 . The illumination assembly as claimed in claim 13 , wherein said reflecting layer is made of a material including epoxy resin and titanium dioxide.

19 . A backlight module comprising:
a substrate; a wiring structure that is formed on said substrate, and that includes a catalyst layer covering a part of said substrate, and a conducting layer formed on said catalyst layer; a plurality of light-emitting diodes that are disposed on said wiring structure and are electrically connected to said wiring structure; and an optical unit.

20 . The backlight module as claimed in claim 19 , further comprising a casing that includes said substrate.

Assignees

• Taiwan Green Point Entpr Co

Inventors

• Lin Yu-Chuan
• Liao Pen-Yi
• Chuang Hui-Ching
• Chen Chih-Hao
• Lin Ai-Ling

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• G02F1/133603 Primary

  with LEDs · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/856

  Reflecting means · CPC title