Fast set moisture curable hot melt adhesive composition and articles including the same

US11732166B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11732166-B2
Application numberUS-202017003549-A
CountryUS
Kind codeB2
Filing dateAug 26, 2020
Priority dateAug 26, 2019
Publication dateAug 22, 2023
Grant dateAug 22, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A moisture curable hot melt adhesive composition that includes isocyanate-terminated polyurethane prepolymer that includes the reaction product of a crystalline polyester polyol, a polyether polyol, and diisocyanate, clay, polyester/polyether elastomer, a first thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and combinations thereof, a tackifying agent, and optionally a second thermoplastic polymer selected from the group consisting of thermoplastic polyurethane, thermoplastic polycaprolactone, and combinations thereof.

First claim

Opening claim text (preview).

What is claimed is: 1. A moisture curable hot melt adhesive composition comprising: isocyanate-terminated polyurethane prepolymer comprising a reaction product of crystalline polyester polyol exhibiting a crystallization peak temperature of at least 55° C., polyether polyol, and diisocyanate; clay; polyester/polyether thermoplastic elastomer; a first thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and combinations thereof; a second thermoplastic polymer selected from the group consisting of thermoplastic polyurethane, thermoplastic polycaprolactone, and combinations thereof; and a first tackifying agent. 2. The moisture curable hot melt adhesive composition of claim 1 comprising from 10% by weight to 50% by weight isocyanate-terminated polyurethane prepolymer; and from 1% by weight to 40% by weight clay. 3. The moisture curable hot melt adhesive composition of claim 1 comprising from 25% by weight to 45% by weight isocyanate-terminated polyurethane prepolymer; and from 5% by weight to 30% by weight clay. 4. The moisture curable hot melt adhesive composition of claim 1 , wherein the isocyanate-terminated polyurethane prepolymer has an NCO:OH ratio of from 5:1 to 2:1. 5. The moisture curable hot melt adhesive composition of claim 1 , wherein the isocyanate-terminated polyurethane prepolymer has an NCO:OH ratio of from 4:1 to 3:1. 6. The moisture curable hot melt adhesive composition of claim 1 comprising from 10% by weight to 20% by weight clay. 7. The moisture curable hot melt adhesive composition of claim 1 comprising from 5% by weight to 35% by weight tackifying agent. 8. The moisture curable hot melt adhesive composition of claim 1 further comprising a second tackifying agent, the first tackifying agent comprising an aromatic hydrocarbon resin, and the second tackifying agent comprising an alpha-methyl styrene tackifying agent. 9. The moisture curable hot melt adhesive composition of claim 1 , wherein the crystalline polyester polyol exhibits a crystallization peak temperature of at least 60° C. 10. The moisture curable hot melt adhesive composition of claim 1 , wherein the crystalline polyester polyol is derived from a diol having at least 2 carbon atoms and a diacid having from 10 to 20 carbon atoms. 11. The moisture curable hot melt adhesive composition of claim 1 , wherein the crystalline polyester polyol is derived from ethylene glycol and a diacid selected from the group consisting of tetradecanedioic acid, dodecanedioic acid, and combinations thereof. 12. The moisture curable hot melt adhesive composition of claim 1 , wherein the second thermoplastic polymer exhibits a melting point of at least 80° C. 13. The moisture curable hot melt adhesive composition of claim 1 , wherein the composition exhibits a Five Minute Overlap Shear Strength of at least 500 Newtons. 14. The moisture curable hot melt adhesive composition of claim 1 , wherein the composition exhibits a Five Minute Overlap Shear Strength of at least 600 Newtons. 15. The moisture curable hot melt adhesive composition of claim 1 , wherein the composition exhibits a High Temperature Overlap Shear Strength of at least 640 Newtons. 16. The moisture curable hot melt adhesive composition of claim 1 , wherein the composition passes the Static Load at 3 Minutes Test Method. 17. The moisture curable hot melt adhesive composition of claim 1 , wherein the composition, upon cooling from melt, exhibits a crystallization transition time of no greater than 215 seconds. 18. The moisture curable hot melt adhesive composition of claim 1 , wherein the composition, upon cooling from melt, exhibits a crystallization transition temperature of at least 45° C. 19. The moisture curable hot melt adhesive composition of claim 1 , wherein the composition exhibits at least 90% transmittance when tested according to the Fogging Test Method. 20. The moisture curable hot melt adhesive composition of claim 1 , wherein the composition exhibits 100% transmittance when tested according to the Fogging Test Method. 21. A moisture curable hot melt adhesive composition comprising: isocyanate-terminated polyurethane prepolymer comprising the reaction product of a crystalline polyester polyol exhibiting a crystallization peak temperature of at least 55° C., a polyether polyol, and diisocyanate; clay; polyester/polyether thermoplastic elastomer; a thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and combinations thereof; and a first tackifying agent. 22. An article comprising: a first substrate; a second substrate; and the cured adhesive composition of claim 1 , the first substrate being bonded to the second substrate through the cured adhesive composition. 23. The article of claim 22 , wherein the first substrate comprises polycarbonate, and the second substrate comprises polypropylene. 24. A head lamp comprising: a polycarbonate substrate; a polypropylene substrate, and the cured adhesive composition of claim 1 , the polycarbonate substrate being bonded to the polypropylene substrate through the cured adhesive composition. 25. The moisture curable hot melt adhesive composition of claim 21 , wherein the polyester/polyether thermoplastic elastomer has a melt flow rate no greater than 25 g/10 min when tested at 190° C. using a 2.16 kilogram weight. 26. The moisture curable hot melt adhesive composition of claim 1 , wherein the polyester/polyether thermoplastic elastomer has a melt flow rate no greater than 25 g/10 min when tested at 190° C. using a 2.16 kilogram weight. 27. The moisture curable hot melt adhesive composition of claim 1 , wherein the polyester/polyether thermoplastic elastomer has a melt flow rate no greater than 15 g/10 min when tested at 190° C. using a 2.16 kilogram weight. 28. The moisture curable hot melt adhesive composition of claim 21 further comprising a second tackifying agent, the first tackifying agent comprising an aromatic hydrocarbon resin, and the second tackifying agent comprising an alpha-methyl styrene tackifying agent. 29. The moisture curable hot melt adhesive composition of claim 21 comprising from 5% by weight to 30% by weight clay.

Assignees

Inventors

Classifications

  • C09J175/04Primary

    Polyurethanes · CPC title

  • prepared by oxyalkylation of polyesterpolyols · CPC title

  • Polyisocyanates or polyisothiocyanates · CPC title

  • involving heating of the applied adhesive · CPC title

  • Clay · CPC title

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Frequently asked questions

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What does patent US11732166B2 cover?
A moisture curable hot melt adhesive composition that includes isocyanate-terminated polyurethane prepolymer that includes the reaction product of a crystalline polyester polyol, a polyether polyol, and diisocyanate, clay, polyester/polyether elastomer, a first thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and c…
Who is the assignee on this patent?
Fuller H B Co
What technology area does this patent fall under?
Primary CPC classification C09J175/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 22 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).