Radio frequency front-end structures

Patent metadata

Field	Value
Publication number	US-11729902-B2
Application number	US-201916268318-A
Country	US
Kind code	B2
Filing date	Feb 5, 2019
Priority date	Feb 5, 2019
Publication date	Aug 15, 2023
Grant date	Aug 15, 2023

Abstract

Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

First claim

The invention claimed is:

1. A radio frequency (RF) communication assembly, comprising:
an RF package substrate including an embedded passive circuit element, wherein at least a portion of the embedded passive circuit element is included in a metal layer of the RF package substrate; and
a ground plane in the metal layer of the RF package substrate.

2. The RF communication assembly of claim 1 , wherein the RF package substrate includes no more than two metal layers.

3. The RF communication assembly of claim 1 , wherein the RF package substrate includes conductive contacts for second-level interconnects, and the ground plane is in the metal layer closest to the conductive contacts.

4. The RF communication assembly of claim 1 , further comprising:
a circuit board coupled to the RF package substrate.

5. The RF communication assembly of claim 4 , wherein the circuit board includes a first plate of a capacitor and the metal layer of the RF package substrate includes a second plate of the capacitor.

6. The RF communication assembly of claim 1 , wherein the ground plane is non-rectangular.

7. The RF communication assembly of claim 1 , wherein the embedded passive circuit element is part of a harmonic filter or a matching filter.

8. The RF communication assembly of claim 1 , wherein the RF communication assembly is a handheld computing device, a tablet computing device, or a wearable computing device.

9. A radio frequency (RF) communication assembly, comprising:
an RF package substrate including a metal layer; and
a balun in the RF package substrate, wherein the balun includes a first coil and a second coil, and at least a portion of the first coil and at least a portion of the second coil are in the metal layer.

10. The RF communication assembly of claim 9 , wherein the first coil and the second coil are spaced apart in a direction parallel to a plane of the metal layer.

11. The RF communication assembly of claim 9 , wherein the first coil and the second coil are interleaved.

12. The RF communication assembly of claim 9 , wherein the metal layer is a first metal layer, the RF package substrate includes a second metal layer, and at least a portion of the first coil and at least a portion of the second coil are in the second metal layer.

13. The RF communication assembly of claim 9 , wherein the balun includes at least one via with a non-circular footprint.

14. A radio frequency (RF) communication assembly, comprising:
a flexible RF package substrate;
a passive circuit element embedded in the flexible RF package substrate; and
one or more discrete components coupled to a surface of the flexible RF package substrate.

15. The RF communication assembly of claim 14 , wherein the one or more discrete components includes a power amplifier, a harmonic filter, a matching filter, or an antenna.

16. The RF communication assembly of claim 15 , wherein the one or more discrete components includes an antenna, and the antenna is proximate to an end of the flexible RF package substrate.

17. The RF communication assembly of claim 14 , wherein the passive circuit element includes a capacitor, an inductor, or a balun.

18. The RF communication assembly of claim 14 , further comprising:
an RF processing device coupled to the flexible RF package substrate.

19. The RF communication assembly of claim 18 , wherein the RF processing device includes one or more passive circuit elements in its metallization stack.

20. The RF communication assembly of claim 19 , wherein at least one of the one or more discrete components is between the RF processing device and an antenna along the flexible RF package substrate.

Assignees

• Intel Corp

Inventors

• Dalmia Sidharth
• Jiang Zhenguo
• Lambert William James
• Nahalingam Kirthika
• Vijayakumar Swathi

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W44/248

  for antennas · CPC title

• H10W44/234

  Arrangements for impedance matching · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title