Integrated circuit structures in package substrates
US-11804426-B2 · Oct 31, 2023 · US
Lambert William James is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lambert William James |
| Total patents | 20 |
| First publication | Aug 22, 2019 |
| Latest publication | Oct 31, 2023 |
Publications ranked by popularity score, then publication date.
US-11804426-B2 · Oct 31, 2023 · US
US-11729902-B2 · Aug 15, 2023 · US
US-11664596-B2 · May 30, 2023 · US
US-11522291-B2 · Dec 6, 2022 · US
US-11380979-B2 · Jul 5, 2022 · US
US-2021351116-A1 · Nov 11, 2021 · US
US-2021344116-A1 · Nov 4, 2021 · US
US-11121468-B2 · Sep 14, 2021 · US
US-11107757-B2 · Aug 31, 2021 · US
US-2021066265-A1 · Mar 4, 2021 · US
Latest publications not already listed above.
US-2020403316-A1 · Dec 24, 2020 · US
US-10797394-B2 · Oct 6, 2020 · US
US-2020251411-A1 · Aug 6, 2020 · US
US-2020253040-A1 · Aug 6, 2020 · US
US-2020203839-A1 · Jun 25, 2020 · US
US-10672693-B2 · Jun 2, 2020 · US
US-2019372229-A1 · Dec 5, 2019 · US
US-2019304887-A1 · Oct 3, 2019 · US
US-2019305402-A1 · Oct 3, 2019 · US
US-2019260110-A1 · Aug 22, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 19 |
| Intel Ip Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01Q1/2283 | 13 |
| H10W90/724 | 12 |
| H01Q21/065 | 11 |
| H10W90/00 | 11 |
| H10W44/248 | 11 |