Ultrasonic sealing device

US11724844B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11724844-B2
Application numberUS-201917286840-A
CountryUS
Kind codeB2
Filing dateOct 3, 2019
Priority dateOct 24, 2018
Publication dateAug 15, 2023
Grant dateAug 15, 2023

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An ultrasonic sealing device including a sonotrode for sealing a packaging material, including a piezoelectric transducer to generate ultrasonic acoustic vibrations for the sealing, a housing, a power circuit connected to the piezoelectric transducer. The power circuit is enclosed in the housing, and an absorbent arranged in the housing to absorb moisture in an atmosphere therein to lower humidity. A method of controlling humidity in an ultrasonic sealing device is also described.

First claim

Opening claim text (preview).

The invention claimed is: 1. An ultrasonic sealing device comprising: a sonotrode for sealing a packaging material comprising: a piezoelectric transducer to generate ultrasonic acoustic vibrations for said sealing, a housing, a power circuit connected to the piezoelectric transducer, wherein the power circuit is enclosed in the housing, an absorbent arranged in the housing to absorb moisture in an atmosphere therein to lower humidity, a frame, wherein the sonotrode and the housing are attached to the frame, and a track guide configured to engage with a track so that the frame is movable along the track. 2. The ultrasonic sealing device according to claim 1 , comprising a container to hold the absorbent in a defined position in the housing. 3. The ultrasonic sealing device according to claim 2 , wherein the defined position is adjacent the power circuit. 4. The ultrasonic sealing device according to claim 2 , wherein the container comprises a fixation element to removably attach the container to the housing. 5. The ultrasonic sealing device according to claim 4 , wherein the container is cylinder-shaped and the fixation element comprises threads being screwable into an opening of the housing. 6. The ultrasonic sealing device according to claim 2 , wherein the container comprises a wall enclosing the absorbent, and wherein the wall comprises a plurality of perforations. 7. The ultrasonic sealing device according to claim 1 , wherein the absorbent comprises a desiccant. 8. The ultrasonic sealing device according to claim 7 , wherein the desiccant comprises silica, and/or activated charcoal, and/or calcium sulfate, and/or calcium chloride, and/or molecular sieves, and/or a moisture absorbing polymer. 9. The ultrasonic sealing device according to claim 8 , comprising a sensor to detect moisture in said atmosphere, wherein the sensor is in communication with a control device configured to notify a user of a threshold level of moisture in the atmosphere. 10. The ultrasonic sealing device according to claim 1 , wherein the housing is formed as an integrated enclosure in the frame. 11. A method of controlling humidity in an ultrasonic sealing device having: a piezoelectric transducer of a sonotrode to generate ultrasonic acoustic vibrations for sealing a packaging material, a power circuit enclosed in a housing and being connected to the piezoelectric transducer, a frame, wherein the sonotrode and the housing are attached to the frame, and a track guide configured to engage with a track so that the frame is movable along the track; the method comprising: absorbing moisture in an atmosphere in the housing with an absorbent arranged in the housing. 12. The method according to claim 11 , comprising: detecting a threshold level of moisture in said atmosphere, and notifying a user of said threshold level. 13. A method comprising using an absorbent in a housing of an ultrasonic sealing device, the housing enclosing a power circuit connected to a piezoelectric transducer of a sonotrode to generate ultrasonic acoustic vibrations for sealing a packaging material with said ultrasonic sealing device; wherein the ultrasonic sealing device comprises a frame, wherein the sonotrode and the housing are attached to the frame, and a track guide configured to engage with a track so that the frame is movable along the track. 14. A packaging machine comprising an ultrasonic sealing device according to claim 1 . 15. The ultrasonic sealing device according to claim 1 , wherein the ultrasonic sealing device is in the form of a cart and the track guide is in the form of rollers configured to engage with the track. 16. A conveyor system, comprising: the ultrasonic sealing device according to claim 1 , wherein the track guide engages with the track to move the frame along the track.

Assignees

Inventors

Classifications

  • B65B51/225Primary

    by ultrasonic welding · CPC title

  • B29C65/08Primary

    using ultrasonic vibrations {(non-plastics element to plastics elements B29C65/645)} · CPC title

  • Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence) · CPC title

  • Packaging machines · CPC title

  • using a rotary sonotrode · CPC title

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Frequently asked questions

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What does patent US11724844B2 cover?
An ultrasonic sealing device including a sonotrode for sealing a packaging material, including a piezoelectric transducer to generate ultrasonic acoustic vibrations for the sealing, a housing, a power circuit connected to the piezoelectric transducer. The power circuit is enclosed in the housing, and an absorbent arranged in the housing to absorb moisture in an atmosphere therein to lower humid…
Who is the assignee on this patent?
Tetra Laval Holdings & Finance
What technology area does this patent fall under?
Primary CPC classification B65B51/225. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 15 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).