Mixing apparatus, mixing method and substrate processing system

US11724235B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11724235-B2
Application numberUS-202016816379-A
CountryUS
Kind codeB2
Filing dateMar 12, 2020
Priority dateMar 13, 2019
Publication dateAug 15, 2023
Grant dateAug 15, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A mixing apparatus includes a phosphoric acid aqueous solution supply, an additive supply, a tank, a phosphoric acid aqueous solution supply path and an additive supply path. The phosphoric acid aqueous solution supply is configured to supply a phosphoric acid aqueous solution. The additive supply is configured to supply an additive configured to suppress precipitation of a silicon oxide. The phosphoric acid aqueous solution supply path is configured to connect the phosphoric acid aqueous solution supply with the tank. The additive supply path is configured to connect the additive supply with the tank. The additive is supplied while fluidity is imparted to the phosphoric acid aqueous solution supplied from the phosphoric acid aqueous solution supply into the tank.

First claim

Opening claim text (preview).

We claim: 1. A mixing apparatus, comprising: a tank configured to mix a phosphoric acid aqueous solution and an additive configured to suppress precipitation of a silicon oxide; a phosphoric acid aqueous solution supply configured to supply the phosphoric acid aqueous solution to the tank; an additive supply having multiple supply openings provided at an upper portion of the tank and arranged in a horizontal direction, and configured to supply the additive; a circulation path through which the phosphoric acid aqueous solution stored in the tank comes out of the tank and returns to the tank; wherein the circulation path has an inlet provided at a lower portion of the tank and an outlet provided at the upper portion of the tank, a pump provided on the circulation path and configured to form a circulation flow of the phosphoric acid aqueous solution which comes out of the tank and returns to the tank through the circulation path; and a controller configured to: supply the phosphoric acid aqueous solution to the tank from the phosphoric acid aqueous solution supply to store a predetermined amount of the phosphoric acid aqueous solution in the tank; operate the pump to form the circulation flow of the phosphoric acid aqueous solution such that a fluidity is imparted to the phosphoric acid aqueous solution; supply, from the multiple supply openings of the additive supply, the additive from above a liquid surface of the phosphoric acid aqueous solution to the liquid surface of the phosphoric acid aqueous solution to which the fluidity is imparted; and control a nozzle of the additive supply to diffuse the additive on the liquid surface of the phosphoric acid aqueous solution to suppress a concentration of the additive from being locally increased. 2. The mixing apparatus of claim 1 , wherein the multiple supply openings of the additive supply are provided adjacent to the outlet of the circulation path. 3. The mixing apparatus of claim 2 , wherein the controller is further configured to supply a mixed liquid mixed in the tank to a processing tank through a solution sending path, the processing tank being configured to perform an etching processing by immersing a substrate in an etching solution, and the etching solution containing the mixed liquid of the phosphoric acid aqueous solution and the additive. 4. The mixing apparatus of claim 2 , further comprising: a stirrer provided in the tank, wherein the controller is further configured to operate the stirrer to impart an additional fluidity to the phosphoric acid aqueous solution. 5. The mixing apparatus of claim 2 , further comprising: a heater configured to heat the phosphoric acid aqueous solution stored in the tank. 6. The mixing apparatus of claim 1 , further comprising: a stirrer provided in the tank, wherein the controller is further configured to operate the stirrer to impart an additional fluidity to the phosphoric acid aqueous solution. 7. The mixing apparatus of claim 6 , wherein the stirrer is a bubbling device configured to supply a bubbling gas into the phosphoric acid aqueous solution stored in the tank. 8. The mixing apparatus of claim 6 , wherein the stirrer is a stirring blade configured to stir the phosphoric acid aqueous solution stored in the tank. 9. The mixing apparatus of claim 6 , wherein the stirrer is an ultrasonic generator configured to generate ultrasonic waves toward the phosphoric acid aqueous solution stored in the tank. 10. The mixing apparatus of claim 6 , further comprising: a heater configured to heat the phosphoric acid aqueous solution stored in the tank. 11. The mixing apparatus of claim 1 , wherein the controller is further configured to supply a mixed liquid mixed in the tank to a processing tank through a solution sending path, the processing tank being configured to perform an etching processing by immersing a substrate in an etching solution, and the etching solution containing the mixed liquid in which the phosphoric acid aqueous solution and the additive are mixed. 12. The mixing apparatus of claim 11 , further comprising: a stirrer provided in the tank, wherein the controller is further configured to operate the stirrer to impart an additional fluidity to the phosphoric acid aqueous solution. 13. The mixing apparatus of claim 11 , further comprising: a heater configured to heat the phosphoric acid aqueous solution stored in the tank. 14. The mixing apparatus of claim 1 , further comprising: a heater configured to heat the phosphoric acid aqueous solution stored in the tank. 15. A mixing method, comprising: a mixing process of storing a predetermined amount of a phosphoric acid aqueous solution in a tank; forming a circulation flow of the phosphoric acid aqueous solution by operating a pump provided on a circulation path which comes out of the tank and returns to the tank such that a fluidity is imparted to the phosphoric acid aqueous solution, wherein the circulation path has an inlet provided at a lower portion of the tank and an outlet provided at an upper portion of the tank; and supplying, from multiple supply openings of an additive supply provided at an upper portion of the tank and arranged in a horizontal direction, an additive from above a liquid surface of the phosphoric acid aqueous solution to the liquid surface of the phosphoric acid aqueous solution to which the fluidity is imparted; and controlling a nozzle of the additive supply to mix the additive to be diffused on the liquid surface of the phosphoric acid aqueous solution to which fluidity is imparted to suppress a concentration of the additive from being locally increased; and a heating process of heating a mixed solution of the phosphoric acid aqueous solution and the additive. 16. A substrate processing system, comprising: a mixing apparatus as claimed in claim 1 ; and a substrate processing apparatus configured to process a substrate with a mixed solution of the phosphoric acid aqueous solution and the additive mixed in the mixing apparatus.

Assignees

Inventors

Classifications

  • with the semiconductor substrates being dipped in baths or vessels · CPC title

  • by chemical means · CPC title

  • B01F23/405Primary

    Methods of mixing liquids with liquids (B01F23/4105 takes precedence) · CPC title

  • B01F23/43Primary

    using driven stirrers · CPC title

  • by injecting one liquid into another · CPC title

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What does patent US11724235B2 cover?
A mixing apparatus includes a phosphoric acid aqueous solution supply, an additive supply, a tank, a phosphoric acid aqueous solution supply path and an additive supply path. The phosphoric acid aqueous solution supply is configured to supply a phosphoric acid aqueous solution. The additive supply is configured to supply an additive configured to suppress precipitation of a silicon oxide. The p…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0426. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 15 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).