Electromagnetic wave transmissive cover and method for manufacturing the same

US11721889B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11721889-B2
Application numberUS-201916973983-A
CountryUS
Kind codeB2
Filing dateApr 22, 2019
Priority dateJun 26, 2018
Publication dateAug 8, 2023
Grant dateAug 8, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Object:A plurality of problems of an electromagnetic wave transmissive cover to be installed in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave are simultaneously eliminated.Resolution means:An electromagnetic wave transmissive cover 1 is a member to be installed in an electromagnetic wave irradiation direction of a millimeter wave radar 100 using an electromagnetic wave, and includes a colored resin member 3, a transparent resin member 5, and a transparent heater film 7. The transparent resin member 5 is provided on an opposite side to the millimeter wave radar 100 of the colored resin member 3. The transparent heater film 7 is provided on the opposite side to the millimeter wave radar 100 of the colored resin member 3, includes a wiring pattern formed by copper plating or etching, and has electromagnetic wave transmissivity.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electromagnetic wave transmissive cover to be installed on a vehicle in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave, the electromagnetic wave transmissive cover comprising: a colored resin member having a first surface with a three-dimensional shape; a transparent resin member provided on the colored resin member and positioned on a side of the colored resin member opposite to the sensor, wherein the transparent resin member having a second surface with a three-dimensional shape; and a transparent heater film provided on an outermost surface of the transparent resin member opposite the colored resin member, including a wiring pattern with a wiring width of 50 to 70 μm formed by copper plating or copper foil etching, and having electromagnetic wave transmissivity, wherein the transparent heater film further includes a cover layer and a base substrate, such that the wiring pattern is provided between an upper surface of the base substrate and a lower surface of the cover layer. 2. The electromagnetic wave transmissive cover according to claim 1 , further comprising: a pictorial pattern layer arranged between the colored resin member and the transparent resin member. 3. The electromagnetic wave transmissive cover according to claim 1 , wherein the electromagnetic wave transmissive cover is an emblem to be mounted on a vehicle, and the sensor is a millimeter wave radar. 4. A method for manufacturing an electromagnetic wave transmissive cover to be installed on a vehicle in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave, the method comprising: forming a wiring pattern having a wiring width of 50 to 70 μm by copper plating or copper foil etching on a base substrate to prepare a transparent heater film; molding a colored resin member having a first surface with a three-dimensional shape; and molding a transparent resin member having a second surface with a three-dimensional shape on the first surface of the colored resin member, and integrally molding the transparent heater film having electromagnetic wave transmissivity with the transparent resin member on an outermost surface of the transparent resin member opposite the second surface with the three-dimensional shape, wherein the transparent heater film further includes a cover layer and the base substrate, such that the wiring pattern is provided between an upper surface of the base substrate and a lower surface of the cover layer. 5. The method of claim 4 , further comprising arranging a flexible printed circuit for the transparent heater film after molding the colored resin member. 6. The method of claim 4 , wherein molding the colored resin member comprises performing injection molding of the colored resin member using a first mold and a second mold. 7. The method of claim 6 , wherein molding the transparent resin member comprises performing injection molding of the transparent resin member using the second mold and a third mold. 8. The method of claim 6 , further comprising setting a pictorial pattern layer in the first mold, wherein the pictorial pattern layer is integrally molded with the colored resin member. 9. The electromagnetic wave transmissive cover according to claim 1 , wherein the wiring pattern has a pitch of 4 to 6 mm and a plating thickness of 10 to 20 μm. 10. The electromagnetic wave transmissive cover according to claim 1 , wherein the wiring pattern includes a heater portion configured to melt snow or ice from the electromagnetic wave transmissive cover. 11. The electromagnetic wave transmissive cover according to claim 10 , further comprising a flexible printed circuit connected to the heater portion of the wiring pattern. 12. The electromagnetic wave transmissive cover according to claim 1 , wherein the three-dimensional shape of the first surface corresponds to the three-dimensional shape of the second surface. 13. The electromagnetic wave transmissive cover according to claim 12 , further comprising a pictorial pattern layer configured to fit between the three-dimensional shape of the first surface and the three-dimensional shape of the second surface. 14. The electromagnetic wave transmissive cover according to claim 2 , wherein the pictorial pattern layer includes a base substrate. 15. The electromagnetic wave transmissive cover according to claim 14 , wherein the pictorial pattern layer includes a vapor deposition design surface layer and a protective layer provided on a lower surface of the base substrate. 16. The electromagnetic wave transmissive cover according to claim 14 , wherein the pictorial pattern layer includes a clear layer and a pattern layer provided on an upper surface of the base substrate. 17. A method for manufacturing an electromagnetic wave transmissive cover to be installed on a vehicle in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave, the method comprising: forming a wiring pattern having a wiring width of 50 to 70 μm by copper plating or copper foil etching on a base substrate to prepare a transparent heater film; performing injection molding of a colored resin member having a first surface a with a three-dimensional shape; and performing injection molding of a transparent resin member having a second surface with a three-dimensional shape on the colored resin member, wherein the transparent heater film is set into an injection mold such that the transparent heater film is integrally molded on an outermost surface of the transparent resin member opposite the second surface of the transparent resin member when performing injection molding of the transparent resin member, and wherein the transparent heater film further includes a cover layer and the base substrate, such that the wiring pattern is provided between an upper surface of the base substrate and a lower surface of the cover layer. 18. The electromagnetic wave transmissive cover according to claim 2 , wherein the pictorial pattern layer includes a pattern layer base substrate, a pattern layer, and a vapor deposition layer such that the pattern layer is provided on the pattern layer base substrate opposite the vapor deposition layer. 19. The electromagnetic wave transmissive cover according to claim 18 , wherein the pictorial pattern layer includes a clear layer provided between the pattern layer and the pattern layer base substrate. 20. An electromagnetic wave transmissive cover to be installed on a vehicle in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave, the electromagnetic wave transmissive cover comprising: a colored resin member having a first surface with a three-dimensional shape; a transparent resin member provided with the color resin member and positioned on a side of the colored resin member opposite to the sensor, wherein the transparent resin member has a second surface with a three-dimensional shape; and a transparent heater film provided between the colored resin member and the transparent resin member, including a wiring pattern with a wiring width of 50 to 70 μm formed by copper plating or copper foil etching, and having electromagnetic wave transmissivity, wherein the transparent heater film further includes a cover layer and a base substrate, such that the wiring pattern is provided between an upper surface of the base substrate and a lower surface of the cover layer.

Assignees

Inventors

Classifications

  • H01Q1/425Primary

    comprising a metallic grid · CPC title

  • Manufacturers' emblems, name plates, bonnet ornaments, mascots or the like; Mounting means therefor · CPC title

  • Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver · CPC title

  • Means for monitoring or calibrating · CPC title

  • G01S13/931Primary

    of land vehicles · CPC title

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What does patent US11721889B2 cover?
Object:A plurality of problems of an electromagnetic wave transmissive cover to be installed in an electromagnetic wave irradiation direction of a sensor using an electromagnetic wave are simultaneously eliminated.Resolution means:An electromagnetic wave transmissive cover 1 is a member to be installed in an electromagnetic wave irradiation direction of a millimeter wave radar 100 using an elec…
Who is the assignee on this patent?
Nissha Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01Q1/425. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 08 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).