Method for producing a radome and corresponding radome

US11005172B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11005172-B2
Application numberUS-201615764460-A
CountryUS
Kind codeB2
Filing dateSep 21, 2016
Priority dateSep 30, 2015
Publication dateMay 11, 2021
Grant dateMay 11, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to a method for producing a radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material and electric contact elements are connected to the flexible printed circuit board. A connector skirt is placed on the contact elements prior to back-molding.

First claim

Opening claim text (preview).

The invention claimed is: 1. A radome comprising: a sheet-like plastic element comprising a laminate film connected to a back-molded thermoplastic material, wherein the laminate film is flexible and comprises an etched metallized structure arranged on one side of the laminate film and configured to carry an electric current to heat the radome; and a contact element arranged on the laminate film and electrically connected to the metallized structure, wherein at least a portion of the contact element protrudes through a connector skirt provided on the laminate film, wherein at least a first portion of the connector skirt is arranged between the laminate film and the back-molded thermoplastic material, wherein at least a second portion of the connector skirt is accessible externally of the radome. 2. The radome as claimed in claim 1 , further comprising a front panel attached to the plastic element. 3. The radome as claimed in claim 1 , wherein the laminate film comprises a polyimide film or a polyethylene naphthalate film. 4. The radome as claimed in claim 1 , wherein the back-molded thermoplastic material is arranged on the side of the laminate film having the metallized structure. 5. The radome as claimed in claim 1 , wherein the metallized structure comprises copper or aluminum. 6. The radome as claimed in claim 1 , wherein the side of the laminate film adjacent to the back-molded thermoplastic material comprises a discrete layer of the laminate having a surface structure obtained by mechanical or chemical pretreatment prior to attachment of the back-molded thermoplastic material such that an interlocking between the laminate film and the back-molded thermoplastic material is achieved, which increases a bond strength between the laminate film and the back-molded thermoplastic material. 7. The radome as claimed in claim 6 , wherein the surface structure comprises impressions generated by mechanical stamping of the plastic element. 8. The radome as claimed in claim 1 , wherein the laminate film comprises two long sides and two short sides, wherein a first groove-like impression in the laminate film runs between the two long sides, wherein a second and third groove-like impression in the laminate film run from the two short sides toward a center region, each terminating before reaching the first groove-like impression. 9. The radome as claimed in claim 8 , wherein the metallized structure comprises strips of metallic material arranged parallel to the first groove-like impression. 10. A radome comprising: a sheet-like plastic element comprising a laminate film connected to a back-molded thermoplastic material, wherein the laminate film is flexible and comprises an etched metallized structure arranged on one side of the laminate film and configured to carry an electric current to heat the radome; and a contact element arranged on the laminate film and electrically connected to the metallized structure, wherein at least a portion of the contact element protrudes through a connector skirt provided on the laminate film, wherein at least a first portion of the connector skirt is arranged between the laminate film and the back-molded thermoplastic material, wherein at least a second portion of the connector skirt is accessible externally of the radome, wherein the back-molded thermoplastic material is arranged on the side of the laminate film having the metallized structure, wherein the metallized structure comprises copper or aluminum, wherein the side of the laminate film adjacent to the back-molded thermoplastic material comprises a discrete layer of the laminate having a surface structure obtained by mechanical or chemical pretreatment prior to attachment of the back-molded thermoplastic material such that an interlocking between the laminate film and the back-molded thermoplastic material is achieved, which increases a bond strength between the laminate film and the back-molded thermoplastic material, wherein the surface structure comprises impressions generated by mechanical stamping of the plastic element, wherein the laminate film comprises two long sides and two short sides, wherein a first groove-like impression in the laminate film runs between the two long sides, wherein a second and third groove-like impression in the laminate film run from the two short sides toward a center region, each terminating before reaching the first groove-like impression.

Assignees

Inventors

Classifications

  • Connector integrally incorporated in the printed circuit board [PCB] or in housing · CPC title

  • Heaters using particular connecting means · CPC title

  • Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} · CPC title

  • Moulding over PCB locally or completely · CPC title

  • Plugs, connectors, or parts thereof · CPC title

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Frequently asked questions

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What does patent US11005172B2 cover?
The invention relates to a method for producing a radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material and electric contact elements are connected to the flexible printed circuit board. A connector skirt is placed on the contact elements prior to back-molding.
Who is the assignee on this patent?
Hella Gmbh & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification H01Q1/425. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 11 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).